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Texas Instruments MSP430F5257IRGCR
- Part No.:
- MSP430F5257IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5257IRGCR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,979
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Product details
Overview
MSP430F5257IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller designed as an "always-on" system controller for portable and battery-powered devices. It features 128 KB flash, 16 KB RAM, dual-supply operation (DVCC: 1.8–3.6 V; DVIO: 1.62–1.98 V), 35 general-purpose I/Os with 16 external interrupts, and four USCI_A + four USCI_B modules supporting UART/IrDA/SPI/I²C. It targets sensor hub and power-management applications in handsets and tablets.
For engineers reviewing the MSP430F5257IRGCR datasheet, MSP430F5257IRGCR pinout, MSP430F5257IRGCR application, or MSP430F5257IRGCR equivalent, key selection criteria include split-rail I/O voltage support (1.8 V DVIO), LPM3 standby current (2.3 µA at 3.0 V), 3.5 µs wake-up time, integrated RTC with alarm, and hardware multiplier for sensor fusion algorithms.
Technical Context
The MSP430F5257IRGCR implements a unified clock system with FLL stabilization, VLO and REFO internal sources, XT1 (32-kHz crystal), and XT2 (up to 32-MHz HF crystal). Its power management includes a programmable LDO core regulator, supply voltage supervision (SVS/SVM), and brownout reset - all enabling robust operation across variable battery conditions.
Peripherals are partitioned across dual I/O domains: DVIO-powered pins (P1–P4, P7, PJ) support 1.8-V logic interfacing with application processors, while DVCC-powered pins (P5, P6) handle higher-voltage analog and timing functions. The device integrates three-channel DMA, 10-bit ADC with 12 channels (10 external + 2 internal), comparator, and four 16-bit timers (TA0/TA1/TA2/TB0) with capture/compare shadow registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with extended memory addressing up to 25-MHz system clock |
| Memory | 128 KB flash (in-system programmable), 16 KB RAM (full retention in LPM3/LPM4) |
| Power Modes | Active mode: 290 µA/MHz @ 8 MHz, 3.0 V (flash execution); LPM3: 2.3 µA @ 3.0 V with RTC active |
| I/O Capability | 35 GPIOs total - 18 on DVCC rail (P5/P6), 35 on DVIO rail (P1–P4/P7/PJ), with up to 16 external interrupt sources |
| Serial Interfaces | Four USCI_A modules (UART/IrDA/SPI) + four USCI_B modules (I²C/SPI), enabling eight concurrent hardware serial links |
| Analog Peripherals | 10-bit ADC10_A with 12 input channels, internal reference, sample-and-hold; COMP_B with 8-channel input multiplexer |
| Timing & Control | RTC_A module with alarm; TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers); hardware MPY32 multiplier |
Pinout & Package
VQFN-64 (RGCR) package, 9 mm × 9 mm, thermally enhanced with exposed thermal pad. Pin 1 marked via top-side laser marking; pin 1 corner indicated by chamfered corner on package body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0–P1.7 | DVIO-domain GPIO / TA0CLK / ACLK | 1.8-V I/O bank supporting timer clock input, low-power real-time clock source, and interrupt-capable digital I/O |
| P2.0–P2.7 | DVIO-domain GPIO / USCI_B3 / RTCCLK / DMAE0 | 1.8-V I/O bank with dedicated RTC clock input, DMA trigger, and full I²C/SPI capability on USCI_B3 |
| P3.0–P3.4 | DVIO-domain GPIO / USCI_B0 / USCI_A0 | 1.8-V I/O bank supporting dual USCI modules - simultaneous I²C slave and UART master operation possible |
| P4.0–P4.7 | DVIO-domain GPIO / USCI_B1 / USCI_A1 | 1.8-V I/O bank with peripheral mapping for second I²C and UART interfaces, enabling multi-sensor communication |
| P5.0–P5.5 | DVCC-domain GPIO / ADC inputs / VeREF+/- | 3.0-V I/O bank with analog input capability, internal reference voltage terminals, and Schmitt-trigger inputs |
| P6.0–P6.7 | DVCC-domain GPIO / TA2 / CBx / A0–A7 | 3.0-V I/O bank supporting Timer_A2 clock/input, comparator inputs, and analog channel routing |
| AVCC/AVSS | Analog supply rails | Independent 3.0-V analog domain powering ADC, comparator, and crystal oscillator circuits |
| DVIO | Low-voltage I/O supply | Dedicated 1.62–1.98 V supply enabling direct interface to 1.8-V application processors without level shifters |
| RST/NMI | Reset and non-maskable interrupt | Active-low reset input with NMI capability; supports both power-on reset and software-initiated reset sequences |
| VCORE | Regulated core voltage output | Internally regulated voltage (1.8 V nominal) supplied to CPU and digital logic; programmable via PMM registers |
Key Features
| Feature | Design Value |
|---|---|
| Dual-supply I/O architecture | Enables seamless 1.8-V interface to application processors while maintaining 3.0-V analog/peripheral operation - eliminates external level translators |
| Ultra-low-power LPM3 mode | 2.3 µA at 3.0 V with RTC, watchdog, and full RAM retention - supports years of battery life in always-on sensor monitoring |
| Fast wake-up from LPM3 | 3.5 µs typical transition to active mode - allows rapid response to sensor events without latency penalties |
| Eight hardware serial interfaces | Four USCI_A + four USCI_B modules permit concurrent I²C, SPI, and UART communication - ideal for multi-sensor data aggregation |
| Integrated RTC with alarm | Real-time clock operates independently in LPM3 using 32-kHz crystal; alarm interrupt wakes CPU on scheduled or periodic basis |
| Hardware 32-bit multiplier (MPY32) | Accelerates fixed-point math for sensor fusion, filtering, and control algorithms - reduces CPU load and active-mode duration |
Applications
| Smartphone Sensor Hub | Industrial Power Monitor |
|---|---|
Use Scenario: Aggregates data from accelerometers, gyroscopes, and ambient light sensors while main AP remains powered down. IC Role / Device Role / Timing Role: Always-on system controller managing sensor polling, preprocessing, and wake-up triggering via RTC or interrupt. Use Value: Reduces overall system power by >70% versus AP-driven polling; leverages 1.8-V DVIO for direct interface to AP's I²C bus. | Use Scenario: Monitors AC line voltage, current, temperature, and relay status in DIN-rail mounted power distribution units. IC Role / Device Role / Timing Role: Standalone power-management hub performing real-time fault detection, logging, and communication via isolated UART. Use Value: Uses LPM3 (2.3 µA) for continuous monitoring; 10-bit ADC with internal reference ensures stable measurement accuracy across supply variations. |
| Bluetooth LE Peripheral Controller | Data Logger for Environmental Monitoring |
Use Scenario: Controls BLE radio state, handles connection intervals, and manages sensor data buffering prior to transmission. IC Role / Device Role / Timing Role: Co-processor coordinating timing-critical BLE protocol stack tasks and offloading main MCU. Use Value: Four USCI_B modules enable concurrent I²C (sensor), SPI (radio), and UART (debug) - no software bit-banging required. | Use Scenario: Records temperature, humidity, and CO₂ levels every 10 seconds in remote field deployments powered by coin-cell batteries. IC Role / Device Role / Timing Role: Autonomous data acquisition node with RTC-triggered sampling and flash-based circular buffer storage. Use Value: LPM4.5 shutdown mode draws only 0.18 µA - extends 220 mAh coin-cell life beyond 5 years with 10 s interval. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5259IRGCR | 32 KB RAM vs. 16 KB; identical peripherals, package, and voltage specs | Preferred when larger RAM is needed for complex sensor fusion or firmware-over-the-air updates | Select MSP430F5259IRGCR if algorithm memory footprint exceeds 16 KB; otherwise MSP430F5257IRGCR offers optimal cost/performance balance. |
| MSP430F5252IZXH | nFBGA-80 (5×5 mm) vs. VQFN-64 (9×9 mm); same 128 KB flash/16 KB RAM but different pinout and thermal profile | Better suited for space-constrained PCBs where board area is critical and BGA assembly is available | Choose MSP430F5252IZXH only when footprint reduction justifies BGA rework complexity and thermal derating analysis. |
Compared with MSP430F5259IRGCR and MSP430F5252IZXH, the MSP430F5257IRGCR delivers identical peripheral functionality and 1.8-V DVIO compatibility in a mature, widely supported VQFN-64 package - making it the most balanced choice for new designs prioritizing manufacturability, thermal performance, and long-term supply stability.
Availability
MSP430F5257IRGCR is available at Aetrix Electronics and suitable for smartphone sensor hubs, industrial power monitors, and Bluetooth LE peripheral controllers requiring stable component supply, long-lifecycle assurance, and consistent parametric performance across production batches.
Supply support for MSP430F5257IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 50 years of innovation in low-power microcontrollers and precision analog ICs.
The MSP430F525x product line was engineered specifically for "always-on" ultra-low-power system controller roles - emphasizing split-rail I/O, sub-µA standby operation, fast wake-up, and integrated sensor interface peripherals.
FAQ
What is the maximum operating frequency of the MSP430F5257IRGCR?
The MSP430F5257IRGCR supports a maximum system clock frequency of 25 MHz, enabled by its integrated FLL-controlled DCO and optional external high-frequency crystal (XT2) up to 32 MHz. At 8 MHz, active-mode current is specified at 290 µA/MHz (typical) during flash execution, confirming stable operation within this range under recommended conditions.
Does the MSP430F5257IRGCR support 1.8-V I/O without external level shifters?
Yes, the MSP430F5257IRGCR supports true 1.8-V I/O via its dedicated DVIO supply rail (1.62–1.98 V). Pins P1–P4, P7, and PJ are powered exclusively by DVIO, allowing direct interface to 1.8-V application processors and sensors - eliminating the need for external level translation circuitry.
How much RAM does the MSP430F5257IRGCR have, and is it retained in low-power modes?
The MSP430F5257IRGCR contains 16 KB of on-chip RAM. This memory is fully retained in LPM3 (standby), LPM4 (off), and LPM4.5 (shutdown) modes, enabling instant context restoration upon wake-up. Retention is guaranteed down to 1.8 V DVCC and 1.62 V DVIO, per TI SLAS903D specifications.
What serial communication interfaces are integrated into the MSP430F5257IRGCR?
The MSP430F5257IRGCR integrates eight hardware serial interfaces: four USCI_A modules (supporting UART, IrDA, and SPI) and four USCI_B modules (supporting I²C and SPI). Each USCI can operate independently, enabling concurrent communication with multiple sensors, radios, or host processors without CPU overhead.
What is the wake-up time from LPM3 standby mode for the MSP430F5257IRGCR?
The MSP430F5257IRGCR wakes from LPM3 (standby mode with RTC active) in 3.5 µs (typical), as verified in TI SLAS903D Section 8.32. This fast transition enables responsive event handling - such as motion-triggered wake-up or RTC alarm - while maintaining ultra-low quiescent current (2.3 µA at 3.0 V).
MSP430F5257IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5257IRGCR FAQ
1.How can I place an order for MSP430F5257IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5257IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5257IRGCR reliable?
The price and inventory of MSP430F5257IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5257IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430F5257IRGCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5257IRGCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5257IRGCR?
MSP430F5257IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5257IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5257IRGCR?
For technical support, including MSP430F5257IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5257IRGCR requirements.
6.How does Aetrix verify that MSP430F5257IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5257IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5257IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5257IRGCR?
All MSP430F5257IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5257IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5257IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5257IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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