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Texas Instruments MSP430F5257IRGCT

Part No.:
MSP430F5257IRGCT
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixMSP430F5257IRGCT.pdf
Description:
IC MCU 16BIT 128KB FLASH 64VQFN
Quantity:
Payment:
Payment
Shipping:
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Inventory:563

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Product details

Overview

MSP430F5257IRGCT from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller designed as an "always-on" system controller for portable and battery-powered applications. It features 128 KB flash, 16 KB RAM, dual-supply operation (DVCC: 1.8–3.6 V; DVIO: 1.62–1.98 V), 35 general-purpose I/Os with 16 external interrupts, and four USCI_A + four USCI_B modules supporting UART/IrDA/SPI/I²C. It serves in sensor hub and power-management roles where fast wake-up (<3.5 µs) and sub-µA standby current (1.6 µA LPM3) are critical.

For engineers reviewing the MSP430F5257IRGCT datasheet, MSP430F5257IRGCT pinout, MSP430F5257IRGCT application, or MSP430F5257IRGCT equivalent, key selection criteria include split-rail I/O compatibility (1.8-V DVIO rail), integrated RTC with alarm, hardware multiplier, 10-bit ADC with internal reference, and support for up to eight concurrent serial interfaces across four USCI_A and four USCI_B modules.

Technical Context

The MSP430F5257IRGCT implements a unified clock system with FLL stabilization, low-frequency VLO and trimmed REFO internal sources, 32-kHz XT1 crystal support, and up to 32-MHz XT2 capability. Its power management includes a programmable LDO core regulator, supply voltage supervision (SVS/SVM), and brownout reset - all enabling robust operation across wide input voltage ranges.

It integrates four 16-bit timers (TA0/TA1/TA2/TB0), a 10-bit 200-ksps ADC with 12 channels (10 external + 2 internal), comparator_B with 8 channels, 3-channel DMA, and a basic timer with RTC functionality. All peripherals operate under flexible low-power mode control with full RAM retention down to LPM4.5 (0.18 µA).

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPUXV2 with extended memory addressing, up to 25-MHz system clock
Memory128 KB flash (in-system programmable), 16 KB RAM (full retention in LPM3/LPM4)
Power ModesActive mode: 290 µA/MHz @ 8 MHz, 3.0 V (flash); Standby (LPM3): 1.6 µA @ 3.0 V; Off (LPM4): 1.3 µA; Shutdown (LPM4.5): 0.18 µA
Supply RailsDual-supply: DVCC = 1.8–3.6 V (core/peripherals); DVIO = 1.62–1.98 V (I/O port banks P1–P4, P7, PJ)
Serial InterfacesFour USCI_A (UART/IrDA/SPI) + four USCI_B (I²C/SPI), enabling eight dedicated hardware serial links
Analog Peripherals10-bit ADC10_A with 12 inputs (10 external, 2 internal), sample-and-hold, internal reference; Comparator_B with 8 channels
Timers & RTCTA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC); Basic timer with RTC module and alarm capability

Pinout & Package

VQFN-64 (RGC) package, 9 mm × 9 mm body size, thermally enhanced with exposed thermal pad. Pin mapping supports split-rail I/O: DVIO-supplied pins (P1–P4, P7, PJ) enable direct 1.8-V interface to application processors without level shifters.

Pin/TerminalCircuit RoleDesign Meaning
P1.0–P1.7DVIO-supplied GPIO / TA0CLK / ACLK1.8-V I/O bank with timer clock input and low-frequency system clock source
P2.0–P2.7DVIO-supplied GPIO / USCI_B3 / RTCCLK / DMAE01.8-V I/O bank supporting I²C/SPI, real-time clock input, and DMA trigger
P3.0–P3.4DVIO-supplied GPIO / USCI_B0 / USCI_A01.8-V I/O bank with dual USCI support for I²C and UART/SPI communication
P4.0–P4.7DVIO-supplied GPIO / USCI_B1 / USCI_A11.8-V I/O bank enabling additional I²C and UART/SPI peripheral connectivity
P6.0–P6.7DVCC-supplied GPIO / TA2 / CBx / Ax3.0-V I/O bank with Timer_A2, comparator inputs, and analog channel routing
P5.0/P5.1Analog inputs / VeREF+/VeREF−Dedicated ADC reference voltage terminals with internal/external reference support
XIN/XOUTXT1 oscillator terminalsConnects 32-kHz watch crystal for RTC and low-power timing
DVIOLow-voltage I/O supply pinMust be supplied 1.62–1.98 V to enable 1.8-V logic levels on designated I/O banks

Key Features

FeatureDesign Value
Split-rail I/O architectureEnables direct 1.8-V interface to APs and sensors without external level translators
Ultra-low-power standby1.6 µA LPM3 current with RTC, watchdog, and full RAM retention enables true "always-on" operation
Eight hardware serial interfacesFour USCI_A + four USCI_B modules allow concurrent I²C, SPI, and UART links for multi-sensor systems
Fast wake-up latency3.5 µs typical transition from LPM3 to active mode ensures responsive event handling
Integrated RTC with alarmReal-time clock with calendar mode and interrupt-on-alarm supports time-triggered sensor polling and sleep scheduling
Hardware multiplier32-bit arithmetic acceleration improves efficiency of sensor fusion and control algorithms in flash/RAM

Applications

Sensor Hub ControllerPower-Management Hub

Use Scenario: Aggregates data from inertial, temperature, and touch sensors in smartphones/tablets while main processor remains powered off.

IC Role / Device Role / Timing Role: Always-on system controller managing sensor polling, preprocessing, and wake-up triggering via RTC or interrupt.

Use Value: Reduces system-level power by >70% versus running application processor continuously; leverages 1.8-V DVIO rail for seamless AP interface.

Use Scenario: Monitors battery voltage, charge state, thermal conditions, and peripheral readiness in portable medical or industrial devices.

IC Role / Device Role / Timing Role: Centralized power supervisor executing state-machine-based power sequencing and fault response.

Use Value: Uses integrated SVS/SVM and 10-bit ADC to detect brownout and overtemperature events with <1.6 µA background current.

Bluetooth® System ControllerData Logger with RTC

Use Scenario: Handles BLE advertising, connection management, and host-controller interface in wearables with minimal RF subsystem activity.

IC Role / Device Role / Timing Role: Low-latency host controller coordinating HCI over UART with Bluetooth SoC, using USCI_A0/A1.

Use Value: Achieves sub-100 µs response to BLE events via fast wake-up and dedicated UART hardware; DVIO rail matches BLE SoC I/O voltage.

Use Scenario: Captures environmental sensor readings at scheduled intervals and stores timestamped data in internal flash/RAM.

IC Role / Device Role / Timing Role: Time-triggered data acquisition node using RTC alarm to initiate ADC conversions and store results.

Use Value: Maintains accurate timekeeping with 32-kHz XT1 crystal; uses 128 KB flash for extended logging without external memory.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430F5259IRGCT32 KB RAM vs. 16 KB; identical peripherals, package, and pinoutHigher RAM enables more complex sensor fusion algorithms and larger firmware buffersSelect when >16 KB RAM is required for real-time processing or extended BSL usage
MSP430F5257IZXHTnFBGA-80 (5×5 mm) vs. VQFN-64 (9×9 mm); same flash/RAM/peripheralsSmaller footprint and higher I/O count (up to 35 DVIO + 8 DVCC) suit space-constrained designsChoose for compact PCB layouts requiring maximum I/O density and thermal performance

Compared with MSP430F5259IRGCT, the MSP430F5257IRGCT trades RAM capacity for cost-sensitive deployments, while compared with MSP430F5257IZXHT, it offers easier assembly and thermal management in VQFN-64 - both retain identical peripheral sets, split-rail I/O, and ultra-low-power behavior.

Availability

MSP430F5257IRGCT is available at Aetrix Electronics and suitable for sensor hub controllers, power-management hubs, and Bluetooth® system controllers requiring stable component supply, long-term lifecycle assurance, and TI-qualified production traceability.

Supply support for MSP430F5257IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in ultra-low-power microcontrollers since the MSP430 launch in 1998.

The MSP430F525x product line was engineered specifically for "always-on" system controller applications, emphasizing split-rail I/O compatibility, sub-microamp standby, and hardware-accelerated sensor interfacing - extending the MSP430 legacy into modern portable and IoT edge nodes.

FAQ

What is the primary supply voltage range for MSP430F5257IRGCT?

The MSP430F5257IRGCT operates with two independent supply rails: DVCC (primary core/peripheral supply) from 1.8 V to 3.6 V, and DVIO (low-voltage I/O supply) from 1.62 V to 1.98 V. This dual-supply architecture allows the device to interface directly with 1.8-V application processors and sensors without external level shifters, while maintaining higher core voltage for performance and noise immunity. The MSP430F5257IRGCT datasheet specifies strict decoupling requirements for both rails to ensure stable operation across all low-power modes.

How many hardware serial interfaces does MSP430F5257IRGCT support?

The MSP430F5257IRGCT supports eight dedicated hardware serial interfaces: four USCI_A modules (each configurable for UART, IrDA, or SPI) and four USCI_B modules (each configurable for I²C or SPI). This enables concurrent communication with multiple sensors, displays, or companion ICs - for example, four I²C sensors and four SPI peripherals - without software bit-banging or time-sharing overhead. Each USCI instance has independent clocking, FIFOs, and interrupt vectors, and the MSP430F5257IRGCT pinout allocates dedicated pins per module to avoid signal contention.

Does MSP430F5257IRGCT include a real-time clock (RTC) module?

Yes, the MSP430F5257IRGCT integrates a full-featured RTC_A module with calendar mode, alarm interrupt, and battery-backup capability when connected to a 32-kHz watch crystal on XIN/XOUT. It operates autonomously in LPM3 with only 2.3 µA (typical) current draw at 3.0 V, retaining full timekeeping and alarm functionality while the CPU and most peripherals remain powered down. The RTC_A module supports programmable alarms, periodic interrupts, and direct integration with the device's interrupt vector table - a key enabler for the MSP430F5257IRGCT's role in time-triggered sensor polling and energy-aware scheduling.

What is the wake-up time from LPM3 standby mode for MSP430F5257IRGCT?

The MSP430F5257IRGCT wakes up from LPM3 (standby mode) in 3.5 µs (typical) to active mode with all clocks running and flash execution enabled. This fast wake-up is achieved through optimized clock gating, retained register states, and immediate FLL stabilization using the internal REFO or VLO source. The specification is measured under standard conditions (3.0 V, 25°C) and applies to wake-up triggered by any enabled interrupt source - including RTC alarm, GPIO edge, comparator output, or USCI receive event - making the MSP430F5257IRGCT highly responsive in event-driven "always-on" applications.

Can MSP430F5257IRGCT operate with internal oscillators only, without external crystals?

Yes, the MSP430F5257IRGCT can operate entirely from internal oscillators: the VLO (very-low-power low-frequency oscillator, ~10 kHz) and REFO (trimmed low-frequency reference oscillator, 32.768 kHz). These sources support all low-power modes, including LPM3 with RTC operation (REFO) and LPM4 with watchdog timing (VLO). While external crystals (XT1 for 32-kHz, XT2 for up to 32-MHz) provide higher accuracy and frequency stability, the MSP430F5257IRGCT's internal sources eliminate BOM cost and board space for crystals in applications where timing precision is secondary to ultra-low power - such as basic sensor polling or intermittent telemetry using the MSP430F5257IRGCT's built-in clock system.

MSP430F5257IRGCT Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
64-VFQFN Exposed Pad
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5257IRGCT FAQ

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5.How can I obtain technical support or documentation for MSP430F5257IRGCT?

For technical support, including MSP430F5257IRGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5257IRGCT requirements.

6.How does Aetrix verify that MSP430F5257IRGCT is sourced from the original manufacturer or authorized distributors?

All MSP430F5257IRGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5257IRGCT meets industry standards.

7.What is the process for return or replacement of MSP430F5257IRGCT?

All MSP430F5257IRGCT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5257IRGCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5257IRGCT part is unused and in its original packaging.

Return procedure for MSP430F5257IRGCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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