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Texas Instruments MSP430F5257IZQE

Part No.:
MSP430F5257IZQE
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
80-VFBGA
Datasheet:
AetrixMSP430F5257IZQE.pdf
Description:
IC MCU 16BIT 128KB FLASH 80BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,092

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Product details

Overview

MSP430F5257IZQE from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller designed as an "always-on" system controller for portable and battery-powered applications. It features 128 KB flash, 16 KB RAM, dual-supply operation (DVCC: 1.8–3.6 V; DVIO: 1.62–1.98 V), 35 general-purpose I/Os with up to 16 external interrupts, and four USCI_A + four USCI_B modules supporting UART, IrDA, SPI, and I²C. It targets sensor hub and power-management roles in handsets, tablets, and data loggers.

For engineers reviewing the MSP430F5257IZQE datasheet, MSP430F5257IZQE pinout, MSP430F5257IZQE application, or MSP430F5257IZQE equivalent, key selection criteria include split-rail I/O voltage support (1.8 V DVIO), LPM3 standby current of 2.3 µA at 3.0 V, 3.5 µs wake-up time, integrated RTC with alarm, and hardware multiplier for real-time sensor fusion algorithms.

Technical Context

The MSP430F5257IZQE implements a unified clock system with FLL stabilization, dual crystal support (XT1 for 32-kHz RTC, XT2 up to 32 MHz), and three internal sources (VLO, REFO, DCO). Its power architecture integrates a programmable LDO core regulator, supply voltage supervision (SVS/SVM), and brownout reset - enabling robust operation across variable battery conditions.

All peripherals-including four 16-bit timers (TA0/TA1/TA2/TB0), 10-bit ADC10_A with 12 channels (10 external + 2 internal), comparator_B, and 3-channel DMA-are synchronized to the flexible clock domains (MCLK, SMCLK, ACLK) and fully accessible under both DVCC and DVIO supply rails, supporting heterogeneous peripheral interfacing without level shifters.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPUXV2 with extended memory addressing, enabling direct access to full 128 KB flash and 16 KB RAM space
Flash / RAM128 KB flash program memory and 16 KB SRAM - sufficient for complex sensor aggregation and real-time control firmware
Supply RailsDual-rail operation: DVCC = 1.8–3.6 V (core/peripherals); DVIO = 1.62–1.98 V (I/O ports P1–P4, P7, PJ) - eliminates external level translation for 1.8-V logic interfaces
Ultra-Low PowerLPM3 standby current = 2.3 µA at 3.0 V with RTC + watchdog + full RAM retention; wake-up latency = 3.5 µs (typical)
Serial InterfacesFour USCI_A modules (UART/IrDA/SPI) + four USCI_B modules (I²C/SPI) - supports eight concurrent hardware serial links for multi-sensor communication
Analog Peripherals10-bit ADC10_A with 12 input channels (10 external, 2 internal), sample rate up to 200 ksps; integrated comparator_B with 8-channel input multiplexer
Timers & RTCFour 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers); RTC_A module with calendar mode and alarm interrupt capability

Pinout & Package

Package: MicroStar Junior™ BGA (80-pin, 5 mm × 5 mm, ZQE). Ball pitch: 0.5 mm. Thermal pad exposed on underside. Compliant with JEDEC MO-220 standard.

Pin/TerminalCircuit RoleDesign Meaning
P1.0–P1.7DVIO-domain GPIO / TA0CLK / ACLK1.8-V tolerant I/O with timer clock input and low-frequency system clock source - enables direct connection to 1.8-V sensors or APs
P2.0–P2.7DVIO-domain GPIO / USCI_B3 / RTCCLK / DMAE0Supports I²C/SPI slave/master, real-time clock input, and DMA trigger - critical for time-stamped sensor data acquisition
P3.0–P3.4DVIO-domain GPIO / USCI_B0 / UCA0TXD/RXDDual-mode serial interface pins (I²C + UART) - allows flexible peripheral connectivity without pin remapping
P4.0–P4.7DVIO-domain GPIO / USCI_B1 / UCA1/UCA3 TXD/RXDAdditional dedicated serial I/O bank for high-throughput sensor clusters or display controllers
P5.0–P5.5DVCC-domain GPIO / ADC10_A inputs / VeREF±3.0-V analog input domain with internal reference buffer - used for precision battery monitoring or external sensor signal conditioning
P6.0–P6.7DVCC-domain GPIO / TA2 / CBx / A0–A7High-drive digital I/O with timer capture/compare and comparator outputs - suitable for PWM-driven actuators or status indicators
P7.0–P7.5DVIO-domain GPIO / USCI_A3 / UCA3TXD/RXDFinal USCI_A channel for IrDA or high-speed SPI - enables redundant or auxiliary communication path
PJ.0–PJ.3DVCC-domain GPIO / RSTDVCC / BSLENReset and bootloader enable signals powered by DVCC - ensures reliable recovery and firmware update sequencing
AVCC / AVSSAnalog supply / groundIndependent analog power domain for ADC and reference circuitry - reduces noise coupling from digital switching
DVIO1.8-V I/O supply railMust be supplied externally within 1.62–1.98 V range; powers all DVIO-domain pins (P1–P4, P7, PJ) - defines interface voltage compatibility
VCORECore LDO outputInternally regulated voltage (1.8 V typical) derived from DVCC - decouples core logic from supply ripple

Key Features

FeatureDesign Value
Split-rail I/O architectureEnables native 1.8-V digital interfacing while operating core at higher DVCC - eliminates external level translators in AP/sensor subsystems
Hardware multiplier (MPY32)Executes 32-bit multiply-accumulate in single cycle - accelerates FFT, PID, and sensor fusion math without CPU overhead
RTC_A with calendar and alarmProvides autonomous timekeeping and scheduled wake-up events - essential for periodic sensor sampling without CPU involvement
3-channel DMA controllerTransfers ADC samples, UART buffers, or timer captures directly to RAM - reduces active-mode CPU load and power consumption
Programmable LDO core regulatorAdjusts VCORE voltage via software to balance performance vs. power - supports dynamic voltage scaling for burst-mode operation

Applications

Wearable Sensor HubSmartphone Power Manager

Use Scenario: Aggregating data from accelerometer, gyroscope, and ambient light sensors in a fitness band, with local preprocessing before transmission.

IC Role / Device Role: Always-on system controller managing sensor polling, data fusion, and wake-up triggers for main application processor.

Use Value: 2.3 µA LPM3 current extends battery life to >7 days; 35 DVIO I/Os interface directly to 1.8-V MEMS sensors without level shifters.

Use Scenario: Monitoring battery voltage, temperature, and charging state while keeping application processor in deep sleep until user interaction or fault condition.

IC Role / Device Role: Dedicated power-management hub coordinating fuel gauging, thermal throttling, and charger control.

Use Value: Integrated 10-bit ADC10_A with internal reference measures battery health at <1 mV resolution; RTC alarm wakes system for periodic calibration.

Industrial Data LoggerBluetooth® Peripheral Controller

Use Scenario: Logging environmental parameters (temperature, humidity, pressure) at 10-second intervals in remote equipment using SD card or LoRaWAN backhaul.

IC Role / Device Role: Standalone logging engine handling sensor reads, timestamping, storage buffering, and wireless transmission scheduling.

Use Value: Four USCI_B modules drive simultaneous I²C sensor buses; 128 KB flash stores >1 million timestamped samples locally.

Use Scenario: Acting as BLE central or peripheral node in smart home devices - connecting to multiple BLE sensors and relaying data to gateway.

IC Role / Device Role: Bluetooth controller managing link layer, GATT services, and host stack execution with minimal host intervention.

Use Value: Dual USCI_A/USCI_B support enables UART-based BLE module control + I²C sensor interface; 3.5 µs wake-up ensures responsive connection events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430F5259IZQE32 KB RAM (vs. 16 KB), identical peripherals, package and pinout compatibleRequired when firmware complexity or sensor data buffering exceeds 16 KB RAM capacitySelect MSP430F5259IZQE if algorithmic depth or multi-sensor history buffer size demands >16 KB RAM
MSP430F5257IRGCVQFN-64 (9×9 mm) vs. ZQE BGA (5×5 mm); same flash/RAM/peripherals; different thermal and routing constraintsSuitable for cost-sensitive or manually assembled designs where BGA rework is impracticalChoose MSP430F5257IRGC for prototyping, lower-volume production, or PCB assembly without BGA capability

Compared with MSP430F5257IZQE, the MSP430F5259IZQE offers double RAM for larger firmware or data buffers without changing layout, while the MSP430F5257IRGC provides identical functionality in a larger, rework-friendly VQFN package - enabling design flexibility across volume, thermal, and manufacturing requirements.

Availability

MSP430F5257IZQE is available at Aetrix Electronics and suitable for wearable sensor hubs, smartphone power managers, and industrial data loggers requiring stable component supply and long-term lifecycle support.

Supply support for MSP430F5257IZQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The MSP430F525x product line was engineered specifically for "always-on" ultra-low-power system control - emphasizing split-rail I/O, sub-µA standby, fast wake-up, and integrated sensor interface peripherals to replace discrete power management and sensor aggregation ICs.

FAQ

What is the maximum operating frequency of the MSP430F5257IZQE?

The MSP430F5257IZQE supports a system clock (MCLK) up to 25 MHz, enabled by its integrated FLL with XT2 crystal support up to 32 MHz. This frequency is achievable with proper configuration of the FLL loop, supply voltage ≥2.2 V, and stable crystal or external clock source - allowing real-time processing of sensor data streams without compromising ultra-low-power operation.

Does the MSP430F5257IZQE support in-system programming without external voltage?

Yes, the MSP430F5257IZQE supports serial onboard programming (SBW) with no external programming voltage required. Its integrated bootloader (BSL) accepts firmware updates via UART or SPI using only DVCC and DVIO supplies - simplifying field upgrades and eliminating need for dedicated HV programming hardware during production or maintenance.

How many analog input channels does the ADC10_A module support on the MSP430F5257IZQE?

The ADC10_A module on the MSP430F5257IZQE supports 12 total input channels: 10 external analog inputs (A0–A7, VeREF+, VeREF−) and 2 internal references (temperature sensor and supply voltage). Channel selection is controlled via ADC10INCHx bits, and conversion results are stored in ADC10MEM with configurable sample-and-hold timing.

Can the MSP430F5257IZQE operate with only the DVIO supply active?

No - the MSP430F5257IZQE requires both DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) supplies to function. DVCC powers the core, flash, RAM, and DVCC-domain peripherals (ADC, comparator, P5/P6/PJ), while DVIO powers DVIO-domain I/O (P1–P4, P7). Omitting either supply violates absolute maximum ratings and prevents operation.

What is the purpose of the RSTDVCC pin on the MSP430F5257IZQE?

The RSTDVCC pin on the MSP430F5257IZQE is a DVCC-domain reset input that asserts a system reset when pulled low. It is Schmitt-triggered for noise immunity and functions independently of the internal SVS reset - providing a reliable hardware reset path for external supervisory circuits or manual reset buttons tied to the DVCC rail.

MSP430F5257IZQE Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
80-VFBGA
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5257IZQE FAQ

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The price and inventory of MSP430F5257IZQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5257IZQE is usually 5 days.

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5.How can I obtain technical support or documentation for MSP430F5257IZQE?

For technical support, including MSP430F5257IZQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5257IZQE requirements.

6.How does Aetrix verify that MSP430F5257IZQE is sourced from the original manufacturer or authorized distributors?

All MSP430F5257IZQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5257IZQE meets industry standards.

7.What is the process for return or replacement of MSP430F5257IZQE?

All MSP430F5257IZQE units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5257IZQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5257IZQE part is unused and in its original packaging.

Return procedure for MSP430F5257IZQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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