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Texas Instruments MSP430F5258IRGCR
- Part No.:
- MSP430F5258IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5258IRGCR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,579
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Product details
Overview
MSP430F5258IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller designed as an "always-on" system controller for portable and battery-powered devices. It features 128 KB flash, 32 KB RAM, dual-supply operation (DVCC up to 3.6 V, DVIO at 1.62–1.98 V), 35 general-purpose I/Os with 16 external interrupts, and four USCI_A and four USCI_B modules supporting UART, IrDA, SPI, and I²C.
For engineers reviewing the MSP430F5258IRGCR datasheet, MSP430F5258IRGCR pinout, MSP430F5258IRGCR application, or MSP430F5258IRGCR equivalent, key selection criteria include split-rail I/O compatibility with 1.8-V application processors, sub-2 µA LPM3 standby current, 3.5 µs wake-up time, integrated RTC with alarm, and hardware multiplier for sensor fusion algorithms.
Technical Context
The MSP430F5258IRGCR implements a unified clock system with FLL stabilization, VLO and REFO internal sources, XT1 (32-kHz crystal), and XT2 (up to 32-MHz HF crystal). Its power architecture integrates a programmable LDO core regulator, supply voltage supervisor (SVS), brownout reset (BOR), and flexible low-power modes (LPM0–LPM4.5).
Peripherals include three Timer_A instances (TA0: 5 CC, TA1: 3 CC, TA2: 3 CC), one Timer_B (TB0: 7 CC), 10-bit ADC10_A with 12 channels (10 external + 2 internal), comparator_B (8-channel), CRC16 module, and 3-channel DMA - all operating under DVCC/DVIO domain separation for optimal signal integrity in mixed-voltage systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with extended memory addressing, enabling direct access to full 128 KB flash and 32 KB RAM without banking overhead. |
| Flash / RAM | 128 KB flash program memory and 32 KB SRAM - sufficient for complex sensor hub firmware, real-time data aggregation, and bootloader+application coexistence. |
| Supply Rails | Dual-supply: DVCC = 1.8–3.6 V (core/peripherals), DVIO = 1.62–1.98 V (I/O bank) - eliminates need for external level shifters when interfacing with 1.8-V application processors or sensors. |
| Ultra-Low Power | LPM3 standby: 2.3 µA at 3.0 V; LPM4 shutdown: 1.3 µA; LPM4.5 deep-off: 0.18 µA - enables multi-year battery life in always-listening sensor nodes. |
| Wake-up Time | 3.5 µs from LPM3 to active mode - ensures rapid response to external interrupts (e.g., motion detection, button press) without missing critical events. |
| Serial Interfaces | Four USCI_A (UART/IrDA/SPI) + four USCI_B (I²C/SPI) - supports eight concurrent hardware serial links, e.g., four I²C sensor buses + four SPI peripherals without software bit-banging. |
| Analog Peripherals | 10-bit ADC10_A with 12 input channels, internal reference, sample-and-hold; comparator_B with 8 inputs - enables simultaneous analog monitoring of battery voltage, temperature, and sensor outputs. |
Pinout & Package
VQFN-64 (RGC) package, 9 mm × 9 mm, 0.5-mm pitch, thermally enhanced with exposed thermal pad. Pin functions validated per TI SLAS903D datasheet Figure 7-1 and Table 7-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0–P1.7 | DVIO-domain GPIO / TA0CLK / ACLK | 1.8-V tolerant I/Os with timer clock input and low-frequency oscillator support - suitable for RTC backup and ultra-low-power timing. |
| P2.0–P2.7 | DVIO-domain GPIO / USCI_B3 / RTCCLK / DMAE0 | Configurable serial interface pins (I²C/SPI) and real-time clock input - enables autonomous timekeeping and event-triggered DMA transfers. |
| P3.0–P3.4 | DVIO-domain GPIO / USCI_B0 / USCI_A0 | Dual-role I²C master/slave and UART/SPI pins - allows flexible peripheral connectivity with minimal pin count overhead. |
| P4.0–P4.7 | DVIO-domain GPIO / USCI_B1 / USCI_A1 | Secondary serial interface bank - supports independent communication with additional sensors or subsystems without bus contention. |
| P5.0–P5.5 | DVCC-domain GPIO / ADC inputs / VeREF± | Analog-capable I/Os with dedicated reference voltage terminals - enables precision ADC measurements without external reference circuitry. |
| P6.0–P6.7 | DVCC-domain GPIO / TA2 / comparator_B | Timer and analog comparator inputs powered from main supply - ideal for high-accuracy timing and threshold detection on higher-voltage signals. |
| AVCC / AVSS | Analog supply / ground | Independent analog power domain decoupled from digital rails - reduces noise coupling into ADC and comparator circuits. |
| DVIO | 1.8-V I/O supply reference | Explicit external 1.62–1.98 V supply connection - enforces strict voltage compliance for 1.8-V logic interfaces and prevents overvoltage damage. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-supply I/O architecture | Enables direct 1.8-V interface to application processors and sensors without level translators - reduces BOM cost and PCB area. |
| 35 total GPIO with 16 interrupt-capable pins | Supports large-scale sensor arrays and multiple peripheral control lines while maintaining fast, prioritized wake-up response across diverse I/O banks. |
| Hardware multiplier (MPY32) | Accelerates 32-bit arithmetic for FFTs, filtering, and sensor fusion math - offloads CPU and shortens active-mode duration to minimize energy use. |
| RTC_A with alarm and calibration | Provides autonomous timekeeping and scheduled wake-up events (e.g., periodic sensor sampling) without CPU involvement - extends battery life in duty-cycled applications. |
| Integrated LDO with programmable VCORE | Allows dynamic core voltage scaling (down to 1.2 V) to match processing load - reduces active-mode current by >30% versus fixed-core designs. |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
Use Scenario: Continuous acquisition of accelerometer, temperature, and heart-rate sensor data during sleep mode, with selective wake-up for BLE transmission. IC Role / Device Role / Timing Role: Always-on system controller managing sensor polling, data preprocessing, and low-latency wake-up of host MCU via GPIO or UART handshake. Use Value: 2.3 µA LPM3 current and 3.5 µs wake-up enable <1 µA average system current - extending coin-cell battery life beyond 12 months. | Use Scenario: Centralized aggregation of Zigbee, I²C environmental sensors (humidity, CO₂, VOC), and local display control in battery-backed gateway. IC Role / Device Role / Timing Role: Low-power hub coordinating multi-protocol communication, RTC-based scheduling, and power-state arbitration between subsystems. Use Value: Four USCI_B modules allow concurrent I²C buses to 8+ sensors; DVIO rail ensures interoperability with 1.8-V IoT transceivers without translation. |
| Industrial Battery Management Unit | Portable Data Logger |
Use Scenario: Monitoring cell voltages, pack temperature, and charge/discharge cycles in lithium-ion packs for medical or test equipment. IC Role / Device Role / Timing Role: Dedicated safety monitor executing independent firmware, isolating critical BMS logic from host processor failures. Use Value: Independent SVS/BOR and 10-bit ADC with internal reference provide ±1% voltage measurement accuracy at <2 µA quiescent current. | Use Scenario: Field-deployed environmental logger capturing temperature, pressure, and light intensity every 10 seconds using solar charging. IC Role / Device Role / Timing Role: Autonomous data acquisition engine with RTC-triggered sampling, flash logging, and USB/UART upload upon docking. Use Value: 128 KB flash stores >100,000 timestamped samples; LPM4.5 mode (0.18 µA) minimizes self-discharge during long idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5259IRGCR | Includes ADC10_A with 10 external + 2 internal channels; same flash/RAM/timers/USCI count. | Required where analog sensing (e.g., battery voltage, thermistor) is integral to the always-on function. | Select MSP430F5259IRGCR if ADC inputs are needed; MSP430F5258IRGCR omits ADC for cost-sensitive, digital-only sensor hubs. |
| MSP430F5229IRGCR | Lower RAM (8 KB), no DVIO rail, only two USCI_A/B modules, no hardware multiplier, LPM3 = 2.5 µA (vs. 2.3 µA). | Suitable for simpler "always-on" tasks without intensive data aggregation or multi-sensor concurrency. | Choose MSP430F5229IRGCR only if legacy design reuse or lower gate count justifies reduced peripheral set and higher standby current. |
Compared with MSP430F5259IRGCR, the MSP430F5258IRGCR removes ADC functionality to reduce cost and power in purely digital sensor hub roles; versus MSP430F5229IRGCR, it delivers 4× more RAM, dual-supply I/O, and enhanced serial throughput - making it optimal for next-generation battery-constrained edge controllers requiring scalability and voltage interoperability.
Availability
MSP430F5258IRGCR is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, and industrial battery management units requiring stable component supply, long-term lifecycle assurance, and TI-qualified production traceability.
Supply support for MSP430F5258IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of ultra-low-power MCU innovation.
The MSP430F525x product line was engineered specifically for "always-on" system controller applications, emphasizing split-rail I/O compatibility, sub-2 µA standby, and hardware acceleration for sensor data processing - targeting portable, medical, and industrial edge devices.
FAQ
What is the maximum system clock frequency supported by the MSP430F5258IRGCR?
The MSP430F5258IRGCR supports a maximum system clock frequency of 25 MHz, achieved via the FLL-controlled DCO or external HF crystal (XT2) up to 32 MHz. This enables high-throughput data processing in active mode while maintaining deterministic timing for real-time sensor fusion and communication stacks within the MSP430F5258IRGCR's power budget.
Does the MSP430F5258IRGCR include an analog-to-digital converter (ADC)?
No, the MSP430F5258IRGCR does not include an ADC. Unlike the MSP430F5259IRGCR variant, the MSP430F5258IRGCR omits the ADC10_A module to reduce cost and power for digital-only sensor hub applications - confirmed in Table 6-1 of the SLAS903D datasheet where ADC10_A is marked "N/A" for this part number.
What package type and dimensions does the MSP430F5258IRGCR use?
The MSP430F5258IRGCR uses the VQFN-64 (RGC) package: 9 mm × 9 mm body size, 0.5-mm lead pitch, with an exposed thermal pad. This RoHS-compliant, space-efficient package supports automated assembly and provides thermal performance suitable for battery-operated applications running extended low-power modes.
How many USCI modules does the MSP430F5258IRGCR support, and what protocols do they handle?
The MSP430F5258IRGCR supports eight USCI modules: four USCI_A (each configurable for UART, IrDA, or SPI) and four USCI_B (each configurable for I²C or SPI). This enables concurrent, dedicated hardware interfaces - for example, four independent I²C sensor buses and four SPI peripherals - without CPU intervention or protocol contention in the MSP430F5258IRGCR's firmware.
What is the purpose of the DVIO supply pin on the MSP430F5258IRGCR?
The DVIO pin on the MSP430F5258IRGCR supplies the 1.62–1.98 V voltage rail for its 35 I/Os, enabling seamless 1.8-V logic-level interfacing with application processors, sensors, and transceivers. This eliminates external level-shifting circuitry, reduces system power, and improves noise immunity - a defining feature of the MSP430F5258IRGCR's split-rail architecture.
MSP430F5258IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5258IRGCR FAQ
1.How can I place an order for MSP430F5258IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5258IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5258IRGCR reliable?
The price and inventory of MSP430F5258IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5258IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430F5258IRGCR?
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4.How is shipping managed for MSP430F5258IRGCR?
MSP430F5258IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5258IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5258IRGCR?
For technical support, including MSP430F5258IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5258IRGCR requirements.
6.How does Aetrix verify that MSP430F5258IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5258IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5258IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5258IRGCR?
All MSP430F5258IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5258IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5258IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5258IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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