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Texas Instruments MSP430F5259IRGCR
- Part No.:
- MSP430F5259IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5259IRGCR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,750
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Product details
Overview
MSP430F5259IRGCR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller with dual-supply architecture (DVCC/DVIO), 128 KB flash, 32 KB RAM, and four USCI_A + four USCI_B modules supporting UART/IrDA/SPI/I²C. It delivers 290 µA/MHz active current at 3.0 V and wakes from LPM3 in 3.5 µs - optimized for always-on sensor hub and power-management controller roles in portable electronics.
For engineers reviewing the MSP430F5259IRGCR datasheet, MSP430F5259IRGCR pinout, MSP430F5259IRGCR application, or MSP430F5259IRGCR equivalent, key selection criteria include split-rail I/O (1.8 V DVIO/3.6–1.8 V DVCC), RTC-integrated standby mode (2.3 µA @ 3.0 V), 35 general-purpose I/Os with 16 external interrupts, and hardware multiplier support for real-time sensor fusion.
Technical Context
The MSP430F5259IRGCR implements a unified clock system with FLL stabilization, VLO and REFO internal sources, plus XT1 (32 kHz) and XT2 (up to 32 MHz) crystal support. Its CPUXV2 core executes at up to 25 MHz and integrates three-channel DMA, MPY32 hardware multiplier, and CRC16 engine for efficient data processing.
Power management includes a fully integrated LDO with programmable core voltage, supply-voltage supervision (SVS/SVM), brownout reset, and five low-power modes (LPM0–LPM4.5). The device supports simultaneous 1.8-V DVIO interface to application processors and higher-voltage DVCC operation - eliminating external level shifters in system controller designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with 25-MHz max system clock - enables deterministic real-time execution for sensor polling and event-driven wake-up. |
| Memory | 128 KB flash + 32 KB RAM - supports complex firmware for multi-sensor aggregation and local decision logic without external memory. |
| Active Mode Current | 290 µA/MHz @ 8 MHz, 3.0 V (flash execution) - reduces battery drain during periodic sensing tasks in portable devices. |
| Standby Mode (LPM3) | 2.3 µA @ 3.0 V with RTC, watchdog, and full RAM retention - sustains time-critical background monitoring with sub-3.5 µs wakeup latency. |
| Dual-Supply I/O | DVIO rail: 1.62–1.98 V; DVCC rail: 1.8–3.6 V - enables direct interfacing to 1.8-V application processors and legacy 3.3-V peripherals. |
| Serial Interfaces | 4 × USCI_A (UART/IrDA/SPI) + 4 × USCI_B (I²C/SPI) - provides eight dedicated hardware serial channels for concurrent sensor and peripheral communication. |
| Analog Peripherals | 10-bit ADC10_A (200 ksps, 12 channels), comparator_B (8 channels), internal reference - supports analog signal acquisition from temperature, battery, and inertial sensors. |
Pinout & Package
VQFN-64 package (9 mm × 9 mm, 0.5-mm pitch) with exposed thermal pad; pin-compatible with other MSP430F525x RGC variants. DVIO-supplied pins (P1.x–P4.x, P7.x, PJ.x, RST/NMI, BSLEN) enable 1.8-V logic interfacing; DVCC-supplied pins (P5.x, P6.x) support higher-voltage peripherals and analog functions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0–P1.7 | DVIO I/O with TA0CLK/ACLK, TA0.0–TA0.4 | 1.8-V general-purpose I/O with timer capture/compare and low-frequency clock input - used for wake-up triggers and sensor timing. |
| P2.0–P2.7 | DVIO I/O with TA1, UCB3, RTCCLK, DMAE0 | 1.8-V I/O supporting SPI/I²C for sensor buses and real-time clock synchronization - critical for time-stamped data logging. |
| P3.0–P3.4 | DVIO I/O with UCB0, UCA0 | 1.8-V I²C and UART interfaces for connecting to accelerometers, gyroscopes, and environmental sensors. |
| P4.0–P4.7 | DVIO I/O with UCB1, UCA1, UCA3 | Additional 1.8-V serial channels for expansion peripherals or redundant communication paths in fault-tolerant systems. |
| P5.0–P5.5, P6.0–P6.7 | DVCC I/O with ADC inputs, XT1, XIN/XOUT, CBx | 3.3-V domain I/O for analog front-end (VeREF±, ADC channels), crystal oscillator, and comparator inputs - ensures noise-immune analog acquisition. |
| AVCC/AVSS | Analog supply and ground | Independent analog power domain isolates sensitive ADC and comparator circuitry from digital switching noise. |
| DVIO | 1.8-V I/O supply input | External 1.8-V source powers all DVIO-domain pins - eliminates need for level translators when interfacing to APs/FPGAs. |
Key Features
| Feature | Design Value |
|---|---|
| Split-rail I/O architecture | Enables direct 1.8-V interface to application processors while maintaining 3.3-V analog and flash operation - reduces BOM count and PCB area. |
| Four independent USCI_A + USCI_B modules | Supports eight concurrent hardware serial interfaces (e.g., four I²C + four SPI) - eliminates software bit-banging and frees CPU for sensor fusion algorithms. |
| RTC with alarm and calendar | Provides autonomous timekeeping and scheduled wake-up events without CPU involvement - extends battery life in data loggers and wearables. |
| Hardware multiplier (MPY32) | Executes 32-bit arithmetic in one cycle - accelerates FFT, filtering, and calibration computations in sensor hub firmware. |
| Three-channel DMA | Transfers ADC samples, UART buffers, and SPI data without CPU intervention - lowers active-mode duty cycle and improves real-time responsiveness. |
Applications
| Always-On Sensor Hub | Power-Management Controller |
|---|---|
Use Scenario: Continuous monitoring of inertial, temperature, and battery sensors in smartphones/tablets while main SoC is asleep. IC Role / Device Role / Timing Role: System-level coordinator that reads sensors via I²C/SPI, processes data locally, and initiates wake-up on threshold violation or RTC alarm. Use Value: Reduces system-wide power by >70% versus running application processor continuously - extends battery runtime in portable devices. | Use Scenario: Dynamic voltage/frequency scaling and rail sequencing in multi-rail embedded systems (e.g., industrial gateways). IC Role / Device Role / Timing Role: Real-time supervisor managing PMIC commands, monitoring supply health, and triggering fault responses within 3.5 µs. Use Value: Enables fail-safe power control with deterministic latency - meets functional safety requirements for industrial equipment. |
| Bluetooth® Peripheral Controller | Data Logger with Local Processing |
Use Scenario: BLE beacon or sensor node aggregating data from multiple analog/digital sensors before wireless transmission. IC Role / Device Role / Timing Role: Host controller handling BLE stack timing, sensor polling, and packet assembly using USCI_A/B modules and hardware multiplier. Use Value: Offloads BLE protocol processing from host MCU - reduces host firmware complexity and memory footprint. | Use Scenario: Environmental monitor recording temperature, humidity, and pressure at fixed intervals with onboard storage. IC Role / Device Role / Timing Role: Time-triggered data acquisition engine using RTC alarm, ADC10_A, and flash write operations with DMA-assisted buffering. Use Value: Achieves >1-year battery life on coin cell via LPM4.5 (0.18 µA) and intelligent wake-up scheduling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5252IRGCR | 128 KB flash, 16 KB RAM, same pinout and peripherals - lacks ADC10_A and internal comparator channels. | Suitable for digital-only sensor hubs without analog signal conditioning. | Select when analog acquisition is unnecessary and cost reduction is prioritized over ADC functionality. |
| MSP430F5259IZXHR | Identical electrical specs and feature set, but in 80-pin nFBGA (5 mm × 5 mm) package - different mechanical footprint and thermal performance. | Better suited for space-constrained designs requiring higher I/O density and improved thermal dissipation. | Choose for compact PCB layouts where VQFN thermal limitations or routing congestion exist. |
Compared with MSP430F5252IRGCR, the MSP430F5259IRGCR adds 16 KB RAM and full ADC/comparator capability for richer sensor fusion; compared with MSP430F5259IZXHR, it trades package size and thermal mass for simpler assembly and lower cost in mid-volume production.
Availability
MSP430F5259IRGCR is available at Aetrix Electronics and suitable for always-on sensor hubs, power-management controllers, and Bluetooth® peripheral designs requiring stable component supply across automotive infotainment, industrial IoT gateways, and medical wearable platforms.
Supply support for MSP430F5259IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies - with over 50 years of innovation in low-power microcontrollers.
The MSP430F5259IRGCR belongs to the MSP430F525x ultra-low-power mixed-signal MCU family, designed specifically for "always-on" system controller applications where energy efficiency, dual-supply flexibility, and real-time responsiveness are critical.
FAQ
What is the maximum operating frequency of the MSP430F5259IRGCR?
The MSP430F5259IRGCR supports a maximum system clock frequency of 25 MHz, enabled by its integrated FLL-controlled DCO and optional external high-frequency crystal (XT2) up to 32 MHz. This allows deterministic real-time execution for time-critical sensor polling and interrupt handling while maintaining ultra-low power consumption in active mode.
Does the MSP430F5259IRGCR support hardware-based I²C and SPI simultaneously?
Yes, the MSP430F5259IRGCR integrates four USCI_B modules (each supporting I²C and SPI) and four USCI_A modules (each supporting UART, IrDA, and SPI), enabling up to eight concurrent hardware serial interfaces. This allows simultaneous I²C communication with multiple sensors and SPI transfers to displays or memory without CPU overhead.
What are the voltage requirements for DVIO and DVCC on the MSP430F5259IRGCR?
The MSP430F5259IRGCR requires DVIO between 1.62 V and 1.98 V (typically 1.8 V) for its 1.8-V I/O domain (P1.x–P4.x, P7.x, PJ.x), and DVCC between 1.8 V and 3.6 V for its core, flash, and analog domains. AVCC must match DVCC for proper ADC and comparator operation, and separate AVSS is required.
How does the MSP430F5259IRGCR achieve ultra-low standby current?
The MSP430F5259IRGCR achieves 2.3 µA standby current (LPM3) by retaining full RAM, operating the RTC with 32-kHz crystal, and keeping watchdog and supply supervisors active - all while disabling the CPU, MCLK, and SMCLK. Its integrated LDO and low-leakage process technology minimize quiescent draw without compromising wake-up reliability.
Is the MSP430F5259IRGCR pin-compatible with other MSP430F525x variants in the RGC package?
Yes, the MSP430F5259IRGCR is pin-compatible with all MSP430F525x devices in the 64-pin VQFN (RGC) package, including MSP430F5252IRGCR, MSP430F5254IRGCR, and MSP430F5258IRGCR. Function mapping across P1–P7, PJ, and analog pins is identical - enabling hardware reuse across family members with differing flash/RAM/ADC configurations.
MSP430F5259IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5259IRGCR FAQ
1.How can I place an order for MSP430F5259IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5259IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5259IRGCR reliable?
The price and inventory of MSP430F5259IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5259IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430F5259IRGCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5259IRGCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5259IRGCR?
MSP430F5259IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5259IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5259IRGCR?
For technical support, including MSP430F5259IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5259IRGCR requirements.
6.How does Aetrix verify that MSP430F5259IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5259IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5259IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5259IRGCR?
All MSP430F5259IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5259IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5259IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5259IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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