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Texas Instruments MSP430F5259IRGCT

Part No.:
MSP430F5259IRGCT
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixMSP430F5259IRGCT.pdf
Description:
IC MCU 16BIT 128KB FLASH 64VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,707

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Product details

Overview

MSP430F5259IRGCT from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller with dual-supply operation (DVCC/DVIO), 128 KB flash, 32 KB RAM, and four USCI_A + four USCI_B modules for concurrent UART/IrDA/SPI/I²C communication. It delivers 290 µA/MHz active current at 3.0 V and wakes from LPM3 in 3.5 µs, targeting always-on sensor hub and power-management controller applications.

For engineers reviewing the MSP430F5259IRGCT datasheet, MSP430F5259IRGCT pinout, MSP430F5259IRGCT application, or MSP430F5259IRGCT equivalent, key selection criteria include split-rail I/O (1.8 V DVIO/1.8–3.6 V DVCC), RTC-integrated standby mode (2.1 µA @ 2.2 V), 35 general-purpose I/Os, 10-bit ADC with internal reference, and hardware multiplier support for real-time sensor fusion.

Technical Context

The MSP430F5259IRGCT implements a unified clock system with FLL stabilization, VLO and REFO internal sources, XT1 (32 kHz) and XT2 (up to 32 MHz) crystal support, and programmable LDO core regulation. Its power architecture separates DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) rails to enable direct interfacing with 1.8-V application processors without level shifters.

Peripherals include four 16-bit timers (TA0/TA1/TA2/TB0), 10-bit ADC10_A with 12 channels (10 external, 2 internal), comparator_B (8-channel), CRC16 module, and 3-channel DMA - all operating under flexible low-power modes (LPM0–LPM4.5) with full RAM retention down to 1.3 µA in LPM4.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPUXV2 with extended memory addressing up to 25-MHz system clock
Memory128 KB flash + 32 KB RAM - supports complex sensor aggregation and real-time firmware updates
Power ModesLPM3 standby: 2.1 µA @ 2.2 V with RTC/crystal; LPM4 shutdown: 1.3 µA @ 3.0 V with full RAM retention
I/O Capability35 GPIOs on DVIO rail (1.62–1.98 V) + 18 on DVCC rail (1.8–3.6 V), each with interrupt/wakeup capability
Serial InterfacesFour USCI_A (UART/IrDA/SPI) + four USCI_B (I²C/SPI) - enables eight dedicated hardware serial links
Analog Peripherals10-bit ADC10_A (200 ksps, 12-channel), comparator_B (8-channel), internal 1.5-V/2.5-V reference
Wake-up Time3.5 µs from LPM3 to active mode - critical for responsive event-driven wake-up in battery-powered systems

Pinout & Package

VQFN-64 package (9 mm × 9 mm, 0.5-mm pitch) with thermal pad; pins assigned to dual-supply domains (DVCC/DVIO/AVCC/AVSS/DVSS/VCORE) and function-mapped I/O groups (P1–P7, PA–PJ).

Pin/TerminalCircuit RoleDesign Meaning
P1.0–P1.7DVIO-domain GPIO / TA0CLK / ACLK1.8-V I/O bank supporting timer clock input and low-voltage system timing
P2.0–P2.7DVIO-domain GPIO / UCB3 / RTCCLK / DMAE01.8-V interface for third I²C bus, real-time clock source, and DMA trigger
P4.0–P4.7DVIO-domain GPIO / PM_UCA1/UCA31.8-V peripheral mapping for two additional UART/SPI channels via port mapping
P6.0–P6.7DVCC-domain GPIO / TA2 / CBx / Ax3.3-V I/O bank with Timer_A2 clock input, comparator inputs, and analog channel routing
P5.0/P5.1Analog input / VeREF+/VeREF−Dedicated ADC reference voltage terminals with internal/external reference selection
XIN/XOUTXT1 crystal oscillator terminalsSupports 32-kHz watch crystal for RTC operation with low-power crystal drive circuitry
DVIOLow-voltage I/O supply railMust be supplied 1.62–1.98 V independently to enable 1.8-V logic compatibility
RST/NMIReset and non-maskable interrupt inputActive-low reset with Schmitt-trigger input; supports both power-on and external reset assertion

Key Features

FeatureDesign Value
Dual-supply I/O architectureEnables direct 1.8-V interface to APs/FPGAs without external level shifters, reducing BOM and layout complexity
Four independent USCI_A + USCI_B modulesAllows simultaneous UART (4x), I²C (4x), and SPI (8x) communication - ideal for multi-sensor data acquisition
RTC with alarm and crystal supportProvides autonomous timekeeping and scheduled wake-up events while consuming only 2.1 µA in LPM3
Hardware 32-bit multiplierAccelerates math-intensive sensor fusion algorithms (e.g., Kalman filtering) without CPU overhead
3-channel DMA controllerEnables zero-CPU-overhead data movement between ADC, USCI, and RAM - essential for continuous logging
Programmable LDO core regulatorAllows dynamic core voltage scaling to match performance needs, optimizing active-mode power efficiency

Applications

Wearable Sensor HubIndustrial Power Monitor

Use Scenario: Aggregating accelerometer, gyroscope, and ambient light data in smartwatches while keeping main processor asleep.

IC Role / Device Role / Timing Role: Always-on system controller managing sensor polling, preprocessing, and wake-up triggering via RTC or interrupt.

Use Value: Achieves sub-2.5 µA standby current with full RAM retention and 3.5 µs wake-up - extending battery life to >6 months on coin cell.

Use Scenario: Monitoring AC line voltage, current, and temperature in DIN-rail mounted energy meters.

IC Role / Device Role / Timing Role: Real-time power management hub coordinating ADC sampling, fault detection, and isolated communication to host MCU.

Use Value: Uses 10-bit ADC10_A with internal reference and comparator_B for accurate threshold-based overvoltage/overcurrent alerts without external components.

Bluetooth LE Peripheral ControllerSmart Home Data Logger

Use Scenario: Acting as BLE central node collecting data from multiple environmental sensors before forwarding via Bluetooth radio.

IC Role / Device Role / Timing Role: Low-latency serial bridge with four USCI_B modules handling concurrent I²C sensor reads and one USCI_A managing BLE UART interface.

Use Value: 35 DVIO I/Os allow direct connection to 1.8-V sensors; 290 µA/MHz active current ensures minimal impact on BLE radio battery budget.

Use Scenario: Logging temperature, humidity, and CO₂ levels in HVAC ducts using battery or energy-harvesting power.

IC Role / Device Role / Timing Role: Autonomous data logger with RTC-triggered sampling, flash storage, and periodic wireless upload via SPI-connected transceiver.

Use Value: 128 KB flash stores >100,000 timestamped samples; LPM4.5 shutdown mode draws only 0.18 µA - enabling multi-year deployment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixed-signal microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430F5252IRGCT128 KB flash but only 16 KB RAM; same pinout, peripherals, and power specsSuitable where sensor algorithm memory footprint is ≤16 KB; reduces cost without changing PCBSelect when RAM demand is lower and BOM cost optimization is prioritized over future firmware scalability
MSP430F5255IRGCTIdentical memory and peripherals but BSL configured for UART-only instead of I²C; same package and electrical specsPreferred in designs requiring UART-based field firmware updates and no I²C bootloading pathChoose when production programming uses UART exclusively and I²C bootloader functionality is unnecessary

Compared with MSP430F5252IRGCT and MSP430F5255IRGCT, the MSP430F5259IRGCT provides double the RAM (32 KB vs. 16 KB) and I²C-capable BSL - making it optimal for complex sensor fusion and flexible field update requirements without hardware redesign.

Availability

MSP430F5259IRGCT is available at Aetrix Electronics and suitable for wearable sensor hubs, industrial power monitors, and Bluetooth LE peripheral controllers requiring stable component supply across long-lifecycle embedded programs.

Supply support for MSP430F5259IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and system integration.

The MSP430F525x product line was designed specifically for ultra-low-power "always-on" system controller roles - emphasizing split-rail I/O, RTC-enabled standby, and high peripheral concurrency for sensor fusion and power management.

FAQ

What is the maximum operating frequency of the MSP430F5259IRGCT?

The MSP430F5259IRGCT supports a maximum system clock frequency of 25 MHz, enabled by its integrated FLL control loop and support for high-frequency crystals up to 32 MHz on the XT2 oscillator. This allows deterministic real-time execution of sensor fusion algorithms and high-speed serial communication while maintaining ultra-low power consumption in active mode.

Does the MSP430F5259IRGCT support crystal oscillators for real-time clock operation?

Yes, the MSP430F5259IRGCT supports 32-kHz watch crystals via the XT1 oscillator on P5.4 (XIN) and P5.5 (XOUT), enabling precise RTC operation with crystal accuracy. The RTC_A module retains timekeeping functionality in LPM3 standby mode at just 2.1 µA, making it suitable for battery-backed time-critical applications.

How many serial communication interfaces does the MSP430F5259IRGCT integrate?

The MSP430F5259IRGCT integrates eight hardware serial interfaces: four USCI_A modules (each configurable as UART, IrDA, or SPI) and four USCI_B modules (each configurable as I²C or SPI). This enables concurrent communication with multiple sensors, displays, radios, and host processors without software bit-banging or resource contention.

What is the purpose of the DVIO supply pin on the MSP430F5259IRGCT?

The DVIO supply pin powers the 1.8-V I/O domain (P1–P4, P7, PJ) of the MSP430F5259IRGCT and must be supplied independently at 1.62–1.98 V. This enables seamless interfacing with 1.8-V application processors, FPGAs, and sensors without external level translators - reducing system cost and signal integrity risk.

Can the MSP430F5259IRGCT perform analog-to-digital conversion without external reference components?

Yes, the MSP430F5259IRGCT includes an internal 1.5-V and 2.5-V reference generator for the 10-bit ADC10_A module. It supports single-ended and differential conversions across 12 channels (10 external, 2 internal) with sample rates up to 200 ksps - eliminating the need for external voltage references in most precision sensing applications.

MSP430F5259IRGCT Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
64-VFQFN Exposed Pad
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5259IRGCT FAQ

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Please submit a Request for Quotation (RFQ) for MSP430F5259IRGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MSP430F5259IRGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5259IRGCT is usually 5 days.

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MSP430F5259IRGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F5259IRGCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5259IRGCT?

For technical support, including MSP430F5259IRGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5259IRGCT requirements.

6.How does Aetrix verify that MSP430F5259IRGCT is sourced from the original manufacturer or authorized distributors?

All MSP430F5259IRGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5259IRGCT meets industry standards.

7.What is the process for return or replacement of MSP430F5259IRGCT?

All MSP430F5259IRGCT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5259IRGCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5259IRGCT part is unused and in its original packaging.

Return procedure for MSP430F5259IRGCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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