Texas Instruments MSP430F5308IRGCR
- Part No.:
- MSP430F5308IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5308IRGCR.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 64VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:5,349
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Product details
Overview
MSP430F5308IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 16 KB flash, 6 KB RAM, four 16-bit timers (TA0/TA1/TA2/TB0), dual USCI modules (UART/IrDA/SPI/I²C), 10-bit ADC with 8-channel input (6 external + 2 internal), RTC, hardware multiplier, and DMA. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and portable measurement devices.
For engineers reviewing the MSP430F5308IRGCR datasheet, MSP430F5308IRGCR pinout, MSP430F5308IRGCR application, or MSP430F5308IRGCR equivalent, key selection criteria include standby current (1.9 µA at 3 V), wake-up time (<5 µs), 47 I/O pins in 64-pin VQFN, dual USCI support, and integrated LDO for single-supply operation.
Technical Context
The MSP430F5308IRGCR implements a unified clock system (UCS) with FLL-based frequency stabilization, programmable LDO core regulation, and five low-power modes (LPM0–LPM4.5). Its CPUXV2 core executes instructions at up to 25 MHz with constant generators for optimized code efficiency.
Peripherals are managed via port mapping control on P4, enabling flexible USCI signal routing. The device integrates a 10-bit ADC with window comparator, Comparator_B, and RTC_A with alarm capability-each accessible without external components in typical embedded sensing configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators; enables compact, deterministic firmware for real-time sensor control. |
| Flash / RAM | 16 KB flash / 6 KB RAM; sufficient for standalone firmware with ADC data buffering and communication stacks. |
| Supply Voltage | 1.8 V to 3.6 V; supports direct Li-ion/Li-poly battery operation without external regulators. |
| Standby Current (LPM3) | 1.9 µA at 3 V with RTC, watchdog, and full RAM retention; enables multi-year battery life in periodic-sensing applications. |
| Wake-up Time | <5 µs from LPM3 to active mode; meets fast-response requirements for interrupt-driven sensor sampling. |
| ADC Resolution & Speed | 10-bit, 200 kSPS, 8-channel (6 external + 2 internal); supports simultaneous temperature/voltage monitoring with hardware window compare. |
| USCI Modules | Two independent USCI blocks (USCI_A0/A1 and USCI_B0/B1); enable concurrent UART debug + I²C sensor interface or dual SPI peripherals. |
Pinout & Package
VQFN-64 package (9 mm × 9 mm) with exposed thermal pad (to be connected to DVSS). Pin count and peripheral mapping match the RGC package variant per TI SLAS677G Rev. May 2020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Timer/CLK I/O | Primary ACLK output source; drives real-time clock and timer subsystems with crystal or internal reference. |
| P1.6/TA1CLK/CBOUT | Timer/Comparator I/O | Configurable TA1 clock input or Comparator_B output; enables synchronized timing or analog event flagging. |
| P2.6/RTCCLK/DMAE0 | RTC/DMA I/O | RTC calibration clock output or DMA external trigger; supports precise time-stamping of sensor events. |
| P3.0–P3.4 | USCI_B0 I/O | Dedicated I²C bus (SDA/SCL) and SPI signals; no port mapping required for basic sensor interface. |
| P4.0–P4.4 | USCI_A1/B1 I/O | Reconfigurable via port mapping controller; allows simultaneous UART + I²C or dual SPI with software-defined pin assignment. |
| RST/NMI/SBWTDIO | Reset/Debug I/O | Single-pin JTAG/Spy-Bi-Wire interface; enables in-system programming and debugging without dedicated debug headers. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power LPM3 mode | 1.9 µA at 3 V with RTC running and full RAM retention-enables decade-scale operation on coin-cell batteries. |
| Integrated 3.3-V LDO | Eliminates need for external voltage regulator; simplifies BOM and PCB layout for single-supply systems. |
| Port mapping controller (P4) | Allows dynamic reassignment of USCI functions across P4 pins-maximizes peripheral flexibility without hardware changes. |
| Hardware multiplier (MPY32) | Executes 32-bit arithmetic in one cycle; accelerates sensor fusion, filtering, and cryptographic operations in firmware. |
| RTC_A with alarm | Provides calendar/timekeeping with configurable alarms; enables scheduled wake-up for periodic sensor reads without CPU intervention. |
Applications
| Smart Thermostat Sensor Node | Portable Handheld Meter |
|---|---|
Use Scenario: Battery-powered HVAC sensor node measuring ambient temperature, humidity, and air quality at 10-minute intervals. IC Role / Device Role / Timing Role: Central MCU managing ADC sampling, I²C sensor interface, RTC-triggered wake-up, and UART telemetry upload. Use Value: 1.9 µA LPM3 current and <5 µs wake-up ensure >5 years operation on two AA cells while maintaining sub-second response to manual override. | Use Scenario: Field-deployable multimeter logging voltage, current, and resistance with LCD display and USB/UART export. IC Role / Device Role / Timing Role: Main controller executing measurement algorithms, driving segmented LCD, and handling serial communication. Use Value: Integrated 10-bit ADC with window comparator enables automatic range switching and over-limit detection without external comparators. |
| Digital Motor Control Monitor | Remote Industrial Controller |
Use Scenario: Compact enclosure monitoring motor winding temperature, supply voltage, and fault status in pump/fan systems. IC Role / Device Role / Timing Role: Real-time supervisor using TA2 for PWM capture, ADC for analog monitoring, and USCI_A for Modbus RTU communication. Use Value: Dual USCI modules allow simultaneous UART diagnostics and RS-485 fieldbus interface-no multiplexing or protocol arbitration needed. | Use Scenario: Wireless gateway edge node aggregating data from multiple analog sensors before forwarding via LoRaWAN or NB-IoT. IC Role / Device Role / Timing Role: Low-power host processor managing sensor polling, data preprocessing, and radio interface timing. Use Value: 47 GPIOs and port mapping on P4 support diverse legacy sensor interfaces (SPI, I²C, analog) within a single compact footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5309IRGCR | 24 KB flash, same RAM, timers, USCI, ADC, and package; higher program memory for complex firmware. | Preferred when bootloader, OTA updates, or multi-sensor fusion algorithms require >16 KB code space. | Select if future firmware expansion is anticipated and cost premium is acceptable. |
| MSP430F5310IRGCR | 32 KB flash, same RAM, timers, USCI, ADC, and package; largest memory in RGC-family subset. | Suitable for applications needing extensive data logging buffers, cryptographic libraries, or dual-role firmware (e.g., sensor + radio stack). | Choose when maximum flash headroom is critical and long-term design scalability is prioritized. |
Compared with MSP430F5308IRGCR, the MSP430F5309IRGCR and MSP430F5310IRGCR offer identical peripheral sets and power profiles but increase flash capacity to 24 KB and 32 KB respectively-enabling larger application code, safety-certified stacks, or extended feature sets without changing PCB layout or firmware architecture.
Availability
MSP430F5308IRGCR is available at Aetrix Electronics and suitable for smart thermostat sensor nodes, portable handheld meters, digital motor control monitors, and remote industrial controllers requiring stable component supply and long-lifecycle support.
Supply support for MSP430F5308IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and reliability.
The MSP430F5308IRGCR belongs to the MSP430F5xx ultra-low-power microcontroller family, designed specifically for battery-operated sensing, measurement, and control applications where nanowatt-level standby power and fast wake-up are essential.
FAQ
What is the maximum operating frequency of the MSP430F5308IRGCR?
The MSP430F5308IRGCR supports a maximum system clock frequency of 25 MHz, achieved via its digitally controlled oscillator (DCO) with FLL stabilization. This allows high-speed execution of time-critical tasks such as real-time ADC sampling, PWM generation, or communication protocol handling while maintaining ultra-low power consumption in active mode.
Does the MSP430F5308IRGCR support crystal oscillators?
Yes, the MSP430F5308IRGCR supports both low-frequency (32 kHz) watch crystals via XT1 (P5.4/XIN and P5.5/XOUT) and high-frequency crystals up to 32 MHz via XT2 (P5.2/XT2IN and P5.3/XT2OUT). These provide precise, low-jitter clock sources for RTC accuracy and high-speed peripheral operation.
How many I/O pins does the MSP430F5308IRGCR have in the RGC package?
The MSP430F5308IRGCR in the 64-pin VQFN (RGC) package provides 47 general-purpose I/O pins, as confirmed in TI's SLAS677G device comparison table. This includes all P1–P6, PJ, and PU ports with functional assignments defined in the pinout diagrams and signal descriptions.
Can the MSP430F5308IRGCR operate from a single 3.3-V supply?
Yes, the MSP430F5308IRGCR integrates a 3.3-V LDO power system that accepts input voltages from 1.8 V to 3.6 V and regulates internally to 3.3 V for core and I/O domains. This allows direct connection to standard 3.3-V rails or single-cell lithium batteries without external regulators.
Is the MSP430F5308IRGCR pin-compatible with other devices in the MSP430F53xx family?
Yes, the MSP430F5308IRGCR shares identical pinout, package dimensions, and peripheral mapping with MSP430F5309IRGCR and MSP430F5310IRGCR in the 64-pin RGC package. This enables drop-in replacement for memory-scaling upgrades without PCB redesign.
MSP430F5308IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5308IRGCR FAQ
1.How can I place an order for MSP430F5308IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5308IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of MSP430F5308IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5308IRGCR is usually 5 days.
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For technical support, including MSP430F5308IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5308IRGCR requirements.
6.How does Aetrix verify that MSP430F5308IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5308IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5308IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5308IRGCR?
All MSP430F5308IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5308IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5308IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5308IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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