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Texas Instruments MSP430F5309IRGCT
- Part No.:
- MSP430F5309IRGCT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5309IRGCT.pdf
- Description:
- IC MCU 16BIT 24KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:250
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Product details
Overview
MSP430F5309IRGCT from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 24 KB flash, 6 KB RAM, integrated 3.3-V LDO, four 16-bit timers (TA0/TA1/TA2/TB0), dual USCI modules (UART/IrDA/SPI/I²C), 10-bit ADC with window comparator, RTC, and hardware multiplier-designed for battery-powered sensor systems and digital timers.
For engineers reviewing the MSP430F5309IRGCT datasheet, MSP430F5309IRGCT pinout, MSP430F5309IRGCT application, or MSP430F5309IRGCT equivalent, key selection criteria include standby current (1.9 µA @ 3 V), 47 I/O count in 64-pin VQFN, dual USCI support, RTC alarm capability, and 16-MHz max system clock with FLL stabilization.
Technical Context
The MSP430F5309IRGCT implements a unified clock system (UCS) with FLL-based frequency stabilization, dual crystal oscillators (XT1 for 32-kHz RTC, XT2 up to 32 MHz), and internal sources (VLO, REFO). Its five low-power modes-including LPM3 (1.9 µA) and LPM4.5 (0.18 µA)-enable rapid wake-up (<5 µs) and extended battery life in portable measurement applications.
It features port mapping control on P4 for flexible USCI signal routing, three-channel DMA, and a programmable LDO delivering regulated core voltage. The device supports full RAM retention in all low-power modes except shutdown (LPM4.5), with supply supervision and brownout detection integrated into the power management module (PMM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generators and 25-MHz max system clock (FLL-stabilized) |
| Memory | 24 KB flash (in-system programmable), 6 KB RAM (full retention in LPM3/LPM4) |
| Power Consumption | 1.9 µA typical in LPM3 (RTC active, 3 V); 0.18 µA in LPM4.5 (shutdown mode) |
| ADC | 10-bit SAR ADC with 200 kSPS, 12 input channels (10 external + 2 internal), window comparator |
| Timers | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC with shadow registers) |
| Communication | Dual USCI modules: USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (I²C/SPI); port-mapped on P4 |
| I/O Count | 47 general-purpose I/O pins with interrupt capability, Schmitt-trigger inputs, and configurable drive strength |
Pinout & Package
VQFN-64 package (9 mm × 9 mm) with exposed thermal pad (recommended connection to DVSS). Pinout conforms to Figure 4-1 in SLAS677G Rev. May 2020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Timer/CLK I/O | Primary ACLK output source; TA0 clock input; enables precise RTC timing and timer synchronization |
| P1.6/TA1CLK/CBOUT | Timer/Comparator I/O | TA1 clock input; Comparator_B output for analog event signaling without CPU intervention |
| P2.6/RTCCLK/DMAE0 | RTC/DMA I/O | RTC calibration clock output; external DMA trigger input for autonomous data transfers |
| P3.0–P3.4/UCA0/UCA1 signals | USCI_A Primary I/O | Fixed-function UART/I²C/SPI pins for USCI_A0; no port mapping required-guaranteed peripheral availability |
| P4.0–P4.4/PM_USCI_B1/USCI_A1 | Port-Mapped USCI | Reconfigurable secondary functions: USCI_B1 (I²C/SPI) and USCI_A1 (SPI) routed via port mapping controller |
| RST/NMI/SBWTDIO | Reset/Debug I/O | Combined reset, non-maskable interrupt, and Spy-Bi-Wire debug interface-enables in-circuit programming without external voltage |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power LPM3 | 1.9 µA at 3 V with RTC, watchdog, supervisor, and full RAM retention-enables multi-year coin-cell operation |
| Port Mapping Controller | Dynamic reassignment of USCI_B1 and USCI_A1 signals to P4 pins-maximizes peripheral flexibility within fixed pin count |
| Hardware Multiplier | 32-bit integer multiply-accumulate in single cycle-accelerates sensor fusion, filtering, and control loop math |
| Integrated LDO | On-chip 3.3-V regulator with programmable core voltage-eliminates external LDO and simplifies power sequencing |
| RTC with Alarm | Real-time calendar/clock with configurable alarms and calibration register-supports scheduled wake-up and time-stamped logging |
Applications
| Wireless Sensor Node | Digital Thermostat |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting data via UART-to-LoRa bridge every 5 minutes. IC Role / Device Role / Timing Role: Main controller executing sensor reads, ADC conversions, RTC-triggered transmission, and low-power sleep scheduling. Use Value: 1.9 µA LPM3 current extends CR2032 life beyond 3 years; dual USCI enables simultaneous UART (to transceiver) and I²C (to sensor). | Use Scenario: Wall-mounted HVAC controller with LCD, push buttons, and relay drivers maintaining ±0.1°C setpoint accuracy. IC Role / Device Role / Timing Role: System-on-chip managing analog sensor conditioning, display refresh, user input scanning, and relay timing via TA0/TA1 PWM outputs. Use Value: 10-bit ADC with internal reference ensures stable temperature measurement across 1.8–3.6 V supply range; 47 GPIO support button matrix and multiple relays. |
| Hand-Held Multimeter | Digital Timer/Stopwatch |
Use Scenario: Portable 4½-digit DMM with auto-ranging, continuity beeper, and data logging to microSD via SPI. IC Role / Device Role / Timing Role: Precision measurement engine performing ADC sampling, math correction, display driving, and SD card file writes. Use Value: Window comparator triggers fast over-range alerts; hardware multiplier accelerates RMS calculations; 24 KB flash stores calibration coefficients and firmware updates. | Use Scenario: Industrial countdown timer with LED display, buzzer, and external trigger input for machine cycle monitoring. IC Role / Device Role / Timing Role: High-accuracy timing core using RTC for seconds/milliseconds counting and TA2 for sub-millisecond pulse generation. Use Value: RTC clock output (RTCCLK) on P2.6 enables external sync; <5 µs wake-up ensures immediate response to start/stop triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5310IRGCT | 32 KB flash (vs. 24 KB), same peripherals, package, and pinout | Supports larger firmware (e.g., BLE stack + sensor processing) without layout change | Select when firmware size exceeds 24 KB or future scalability is required |
| MSP430F5308IRGCT | 16 KB flash, identical RAM, timers, USCI, ADC, and power specs | Suitable for cost-sensitive designs with smaller code footprint (e.g., basic timer or thermostat) | Choose for BOM cost reduction where flash headroom is sufficient |
Compared with MSP430F5310IRGCT and MSP430F5308IRGCT, the MSP430F5309IRGCT delivers optimal balance of flash capacity (24 KB), ultra-low-power operation, and peripheral integration-making it ideal for mid-complexity sensor and control applications requiring field-upgradable firmware without over-provisioning memory.
Availability
MSP430F5309IRGCT is available at Aetrix Electronics and suitable for wireless sensor nodes, digital thermostats, and hand-held meters requiring stable component supply and long-term industrial availability.
Supply support for MSP430F5309IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and reliability.
The MSP430F5309IRGCT belongs to TI's ultra-low-power MCU product line, engineered specifically for portable and battery-operated measurement systems demanding nanowatt-level sleep currents and fast wake-up responsiveness.
FAQ
What is the maximum operating frequency of the MSP430F5309IRGCT?
The MSP430F5309IRGCT supports a maximum system clock frequency of 25 MHz, achieved via its digitally controlled oscillator (DCO) and FLL circuitry. This allows high-speed execution while maintaining ultra-low-power characteristics. The device can operate reliably across its full 1.8–3.6 V supply range at this frequency, with timing validated per SLAS677G specifications. MSP430F5309IRGCT achieves this performance without external high-frequency crystals by leveraging internal FLL stabilization with XT2 (up to 32 MHz) or REFO.
Does the MSP430F5309IRGCT support real-time clock functionality with calendar mode?
Yes, the MSP430F5309IRGCT integrates a full-featured RTC_A module supporting calendar mode (year/month/day/hour/minute/second), alarm interrupts, and calibration. It operates from the 32-kHz XT1 crystal or VLO source and retains timekeeping during LPM3 with only 1.9 µA consumption. MSP430F5309IRGCT also provides RTCCLK output on P2.6 for external synchronization-critical for timestamped sensor logging and scheduled wake-up events.
How many USCI modules does the MSP430F5309IRGCT have, and what protocols do they support?
The MSP430F5309IRGCT includes two USCI modules: USCI_A0/A1 (UART, IrDA, SPI) and USCI_B0/B1 (I²C, SPI). USCI_A0 has fixed pins (P3.x), while USCI_A1 and USCI_B1 are port-mapped to P4.0–P4.4. This configuration enables concurrent UART (e.g., to radio) and I²C (e.g., to sensor) communication. MSP430F5309IRGCT supports automatic baud-rate detection in UART mode and 400-kbps fast-mode I²C-verified in Section 5.33 of SLAS677G.
What is the ADC resolution and sampling rate of the MSP430F5309IRGCT?
The MSP430F5309IRGCT features a 10-bit successive-approximation ADC (ADC10_A) with a maximum sampling rate of 200 kSPS. It supports 12 input channels (10 external, 2 internal) and includes a programmable window comparator for autonomous threshold detection. MSP430F5309IRGCT ADC performance is specified across 1.8–3.6 V supply and –40°C to 85°C, with INL of ±1 LSB and DNL of ±0.5 LSB per SLAS677G Section 5.36.
Is the MSP430F5309IRGCT pin-compatible with other devices in the MSP430F53xx family?
Yes, the MSP430F5309IRGCT in the 64-pin VQFN (RGC) package shares identical pinout and footprint with MSP430F5310IRGCT and MSP430F5308IRGCT. All three support the same peripheral signal assignments on each pin, enabling direct substitution in designs where flash size requirements align. MSP430F5309IRGCT maintains full functional compatibility-including USCI mapping, timer I/O, and ADC channel routing-across these RGC-package variants.
MSP430F5309IRGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 24KB (24K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5309IRGCT FAQ
1.How can I place an order for MSP430F5309IRGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5309IRGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5309IRGCT reliable?
The price and inventory of MSP430F5309IRGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5309IRGCT is usually 5 days.
3.What payment methods are accepted for MSP430F5309IRGCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5309IRGCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5309IRGCT?
MSP430F5309IRGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5309IRGCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5309IRGCT?
For technical support, including MSP430F5309IRGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5309IRGCT requirements.
6.How does Aetrix verify that MSP430F5309IRGCT is sourced from the original manufacturer or authorized distributors?
All MSP430F5309IRGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5309IRGCT meets industry standards.
7.What is the process for return or replacement of MSP430F5309IRGCT?
All MSP430F5309IRGCT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5309IRGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5309IRGCT part is unused and in its original packaging.
Return procedure for MSP430F5309IRGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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