Texas Instruments MSP430F5309IRGZR
- Part No.:
- MSP430F5309IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5309IRGZR.pdf
- Description:
- IC MCU 16BIT 24KB FLASH 48VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430F5309IRGZR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 24 KB flash, 6 KB RAM, four 16-bit timers (TA0/TA1/TA2/TB0), dual USCI modules (UART/IrDA/SPI/I²C), 10-bit ADC with 12 channels (10 external + 2 internal), RTC, hardware multiplier, and DMA. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and digital timers.
For engineers reviewing the MSP430F5309IRGZR datasheet, MSP430F5309IRGZR pinout, MSP430F5309IRGZR application, or MSP430F5309IRGZR equivalent, key selection criteria include standby current (1.9 µA at 3 V), 48-pin VQFN package compatibility, dual-USCI interface flexibility, 10-bit ADC resolution with window comparator, and LPM4.5 shutdown mode (0.18 µA).
Technical Context
The MSP430F5309IRGZR implements a unified clock system (UCS) with FLL stabilization, VLO and REFO internal sources, and support for 32-kHz XT1 and up to 32-MHz XT2 crystals. Its power management includes an integrated 3.3-V LDO, supply supervision, and five low-power modes (LPM0–LPM4.5) enabling sub-2 µA RTC-active operation.
It features port mapping control on P4 for dynamic USCI signal routing, three-channel DMA for peripheral-to-memory transfers without CPU intervention, and a 16-bit Timer_B (TB0) with seven capture/compare shadow registers optimized for motor control timing precision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generators and 25-MHz max system clock |
| Memory | 24 KB flash (in-system programmable), 6 KB RAM (full retention in LPM3/LPM4) |
| ADC | 10-bit SAR ADC with 200 kSPS, 12 input channels (10 external, 2 internal), integrated window comparator |
| Timers | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers) |
| Communication | Dual USCI modules: USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (SPI/I²C) |
| Power Modes | LPM3: 1.9 µA @ 3 V (RTC + watchdog + full RAM); LPM4.5: 0.18 µA @ 3 V (shutdown) |
| Supply Range | 1.8 V to 3.6 V; integrated 3.3-V LDO with programmable core voltage regulation |
Pinout & Package
VQFN-48 package (7 mm × 7 mm), thermally enhanced with exposed pad (recommended connection to DVSS). Pin count and I/O allocation match RGZ/PT package variants per TI SLAS677G.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Timer/ Clock I/O | Primary ACLK output source; TA0 clock input; supports 32-kHz crystal drive |
| P1.6/TA1CLK/CBOUT | Timer/ Comparator I/O | TA1 clock input; Comparator_B output for analog event signaling |
| P2.6/RTCCLK/DMAE0 | RTC/ DMA Trigger | RTC calibration clock output; external DMA trigger input for time-synchronized data acquisition |
| P3.0–P3.4 | USCI_B0 I/O | Dedicated SPI/I²C pins (SIMO/SOMI/CLK/STE) with no port mapping required |
| P4.0–P4.4 | USCI_A1/B1 Mapped I/O | Reconfigurable via port mapping controller; default: UCB1 SDA/SCL/STE/CLK and UCA1 TXD/RXD/CLK |
| RST/NMI/SBWTDIO | Reset/ Debug | Hardware reset, non-maskable interrupt, and Spy-Bi-Wire debug interface I/O |
| VCORE | Internal Power | Regulated core voltage output (internal only; connect 1-µF capacitor per datasheet) |
| AVCC1/AVSS1 | Analog Supply | Separate analog power and ground for ADC/REF circuitry to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low standby current | 1.9 µA at 3 V with RTC, watchdog, and full RAM retention enables >10-year coin-cell operation |
| Port mapping controller | Dynamic reassignment of USCI signals on P4 allows flexible interface routing without PCB redesign |
| Hardware multiplier | 32-bit multiply-accumulate capability accelerates math-intensive sensor fusion algorithms |
| Integrated LDO | On-chip 3.3-V regulator eliminates need for external DC/DC, reducing BOM count and layout area |
| Fast wake-up | <5 µs transition from LPM3 to active mode ensures responsive real-time event handling |
Applications
| Wireless Sensor Node | Digital Thermostat |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting data via UART-to-LoRa gateway. IC Role / Device Role / Timing Role: Primary MCU managing ADC sampling, RTC-based wakeup scheduling, and UART framing. Use Value: 1.9 µA LPM3 current extends 2× AA battery life beyond 5 years; dual USCI enables simultaneous sensor readout and radio interface. | Use Scenario: Residential HVAC control unit with local display, button inputs, and relay drivers. IC Role / Device Role / Timing Role: System controller executing PID loop, driving 7-segment display via timer PWM, and managing user interface interrupts. Use Value: Four independent 16-bit timers provide precise PWM dimming, fan speed control, and debounce timing without software overhead. |
| Hand-Held Meter | Remote Industrial Monitor |
Use Scenario: Portable multimeter with auto-ranging, backlit LCD, and USB-C charging detection. IC Role / Device Role / Timing Role: Signal processor interfacing with precision ADC front-end, managing charge detection logic, and controlling display contrast. Use Value: 10-bit ADC with window comparator triggers fast over-range alerts; integrated LDO ensures stable analog performance across 1.8–3.6 V battery discharge. | Use Scenario: DIN-rail mounted vibration monitor logging accelerometer data to SD card via SPI. IC Role / Device Role / Timing Role: Data concentrator acquiring sensor streams, timestamping with RTC, and buffering to external memory. Use Value: Three-channel DMA moves ADC samples directly to RAM while CPU sleeps; TB0's 7 CC registers enable multi-phase vibration analysis timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5310IRGZR | 32 KB flash (vs. 24 KB), same peripherals, identical 48-pin VQFN package | Supports larger firmware (e.g., BLE stack + sensor fusion) without layout change | Select when firmware growth headroom or future feature expansion is required |
| MSP430F5308IRGZR | 16 KB flash, otherwise identical peripheral set and pinout | Suitable for cost-sensitive designs with fixed, smaller code footprint | Select when application fits within 16 KB and BOM cost reduction is prioritized |
Compared with MSP430F5309IRGZR, the MSP430F5310IRGZR offers 8 KB more flash for complex protocols, while the MSP430F5308IRGZR reduces flash capacity by 8 KB to lower unit cost-both retain identical power profiles, timers, ADC, and USCI functionality in the same 48-pin VQFN footprint.
Availability
MSP430F5309IRGZR is available at Aetrix Electronics and suitable for wireless sensor nodes, digital thermostats, and hand-held meters requiring stable component supply and long-term industrial availability.
Supply support for MSP430F5309IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430F5309IRGZR belongs to the MSP430F5xx ultra-low-power MCU family, designed specifically for extended-battery-life measurement and sensing applications where sub-2 µA RTC-active operation and flexible mixed-signal integration are critical.
FAQ
What is the maximum operating frequency of the MSP430F5309IRGZR?
The MSP430F5309IRGZR supports a maximum system clock frequency of 25 MHz, enabled by its digitally controlled oscillator (DCO) and FLL-based unified clock system. This allows high-speed execution while maintaining ultra-low power consumption in active mode (195 µA/MHz at 8 MHz, 3 V). The device also supports external high-frequency crystals up to 32 MHz via the XT2 oscillator input.
Does the MSP430F5309IRGZR support crystal oscillators for real-time clock operation?
Yes, the MSP430F5309IRGZR supports a 32.768-kHz watch crystal (XT1) for precise real-time clock (RTC) operation. Pins P5.4/XIN and P5.5/XOUT are dedicated to this low-frequency crystal, enabling accurate timekeeping with typical RTC accuracy of ±20 ppm over temperature and voltage. The RTC remains fully functional in LPM3 with only 1.9 µA current draw at 3 V.
How many I/O pins does the MSP430F5309IRGZR provide in its VQFN-48 package?
The MSP430F5309IRGZR in the VQFN-48 (RGZ) package provides 31 general-purpose I/O pins, consistent with the MSP430F530x family specification for 48-pin variants. These include P1.x (8), P2.x (8), P3.x (5), P4.x (5), P5.x (2), P6.x (3), plus PU.0 and PU.1 - all configurable with interrupt capability and programmable drive strength.
Can the MSP430F5309IRGZR operate from a single 1.8-V supply?
Yes, the MSP430F5309IRGZR is fully specified to operate across a supply range of 1.8 V to 3.6 V. At 1.8 V, it maintains full functionality including flash programming, RTC operation, and ADC conversion (with adjusted reference constraints). Its integrated LDO regulates the core voltage independently, ensuring stable CPU and peripheral performance even as the battery discharges.
What debugging interface does the MSP430F5309IRGZR support?
The MSP430F5309IRGZR supports the two-wire Spy-Bi-Wire (SBW) interface via RST/NMI/SBWTDIO and TEST/SBWTCK pins, compatible with TI's MSP-FET and standard JTAG emulators. This interface enables full-speed debugging, flash programming, and boundary-scan testing without requiring a full 4-pin JTAG connector, reducing PCB footprint and simplifying development setup.
MSP430F5309IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 24KB (24K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5309IRGZR FAQ
1.How can I place an order for MSP430F5309IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5309IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5309IRGZR reliable?
The price and inventory of MSP430F5309IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5309IRGZR is usually 5 days.
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Once your MSP430F5309IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5309IRGZR?
For technical support, including MSP430F5309IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5309IRGZR requirements.
6.How does Aetrix verify that MSP430F5309IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430F5309IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5309IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430F5309IRGZR?
All MSP430F5309IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5309IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5309IRGZR part is unused and in its original packaging.
Return procedure for MSP430F5309IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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