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Texas Instruments MSP430F5309IRGZT
- Part No.:
- MSP430F5309IRGZT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5309IRGZT.pdf
- Description:
- IC MCU 16BIT 24KB FLASH 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:484
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Product details
Overview
MSP430F5309IRGZT from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 24 KB flash, 6 KB RAM, integrated 3.3-V LDO, four 16-bit timers (TA0/TA1/TA2/TB0), dual USCI modules (UART/IrDA/SPI/I²C), 10-bit ADC with window comparator, RTC, and hardware multiplier. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and digital timers.
For engineers reviewing the MSP430F5309IRGZT datasheet, MSP430F5309IRGZT pinout, MSP430F5309IRGZT application, or MSP430F5309IRGZT equivalent, this page delivers verified functional specifications, package-confirmed pin roles, real-world use cases, and validated alternative options for low-power embedded design selection.
Technical Context
The MSP430F5309IRGZT implements a unified clock system (UCS) with FLL stabilization, VLO and REFO internal sources, and support for 32-kHz XT1 and up to 32-MHz XT2 crystals. Its five low-power modes-including LPM3 (1.9 µA at 2.2 V) and LPM4.5 (0.18 µA)-enable sub-5-µs wake-up from standby, critical for intermittent sensing.
It features port mapping control on P4 for flexible USCI signal routing, three-channel DMA, and a programmable LDO delivering regulated core voltage. The device integrates comparator_B (8 channels), 10-bit ADC10_A (200 kSPS, 6 external + 2 internal inputs), and RTC_A with alarm capability-enabling autonomous timing and analog monitoring without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generators and 25-MHz max system clock - enables high code efficiency and deterministic real-time execution. |
| Memory | 24 KB flash / 6 KB RAM - sufficient for firmware with protocol stacks and sensor data buffering in compact edge nodes. |
| Power Consumption | LPM3: 1.9 µA at 2.2 V - supports multi-year operation on coin-cell batteries in always-on RTC/sensor applications. |
| ADC | 10-bit ADC10_A, 200 kSPS, 6 external + 2 internal channels - enables simultaneous temperature, voltage, and reference monitoring with window-comparator alerting. |
| Timers | TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC) - provides independent PWM generation, input capture, and RTC calibration without resource contention. |
| Communication | Dual USCI: USCI_A0/A1 (UART/IrDA/SPI) + USCI_B0/B1 (I²C/SPI) - supports concurrent wired sensor interface (I²C) and host communication (UART) with automatic baud-rate detection. |
| Package | VQFN-48 (7 mm × 7 mm, RGZ) - surface-mount footprint optimized for space-constrained portable and industrial PCB layouts. |
Pinout & Package
VQFN-48 (RGZ) package with exposed thermal pad (to be connected to DVSS). Pin count: 48. Body size: 7 mm × 7 mm. Pitch: 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Multi-function I/O | Primary ACLK output source for RTC and timer synchronization; also accepts external clock input for TA0. |
| P1.6/TA1CLK/CBOUT | Timer & comparator I/O | Input for TA1 clock; outputs comparator_B result - enables synchronized event-triggered timing and analog threshold detection. |
| P2.6/RTCCLK/DMAE0 | RTC & DMA control | Provides calibrated RTC clock output for system timing; serves as external DMA trigger - allows autonomous data transfers during low-power operation. |
| P3.0–P3.4 | USCI_B0 primary pins | Default I²C SDA/SCL and SPI signals - supports direct connection to sensors (e.g., temperature, humidity) without level-shifting. |
| P4.0–P4.4 | Port-mapped USCI_A1/B1 | Configurable via PMAP to route UART TX/RX or I²C signals - enables flexible peripheral assignment on shared pins without hardware redesign. |
| RST/NMI/SBWTDIO | Reset & debug interface | Single-pin JTAG/Spy-Bi-Wire entry point - simplifies production programming and field firmware updates using TI's standard tools. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power LPM4.5 mode | 0.18 µA at 3 V - extends shelf life and operational lifetime in storage or sleep-state applications like remote thermostats. |
| Integrated 3.3-V LDO | Programmable core voltage regulation - eliminates need for external regulator, reduces BOM count, and improves supply noise immunity. |
| Hardware multiplier (MPY32) | 32-bit arithmetic in single cycle - accelerates FFT, filtering, and sensor fusion algorithms without CPU overhead or latency penalty. |
| Real-time clock (RTC_A) with alarm | Calendar-mode timekeeping with interrupt-driven alarms - enables scheduled wake-up and time-stamped logging without software polling. |
| Comparator_B with 8 channels | Independent analog threshold detection across multiple inputs - replaces discrete comparators and reduces power vs. ADC-based monitoring. |
| Port mapping controller (PMAP) | Dynamic reassignment of USCI functions on P4 - allows full dual-USCI utilization within 48-pin footprint, avoiding pin conflicts in complex designs. |
Applications
| Analog Sensor Node | Digital Thermostat |
|---|---|
|
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and supply voltage at 10-second intervals. IC Role / Device Role / Timing Role: Central MCU managing sensor I²C reads, ADC sampling, RTC-timed wake-ups, and UART reporting to gateway. Use Value: LPM3 current of 1.9 µA at 2.2 V enables >5-year operation on CR2032; integrated comparator_B triggers immediate wake on overtemperature. |
Use Scenario: Wall-mounted HVAC controller with local display, button interface, and wireless module communication. IC Role / Device Role / Timing Role: Main controller executing PID loop, driving segment LCD, handling user input, and scheduling communication bursts. Use Value: Dual USCI modules enable concurrent UART (to RF module) and I²C (to ambient sensor), while RTC_A maintains accurate scheduling across power cycles. |
| Hand-Held Meter | Digital Timer System |
|
Use Scenario: Portable multimeter with auto-ranging, backlit LCD, and USB/UART data logging. IC Role / Device Role / Timing Role: Signal acquisition engine performing ADC conversions, gain switching, and display refresh with precise timing. Use Value: 10-bit ADC10_A with 200 kSPS and window comparator supports fast AC/DC measurements; hardware multiplier accelerates RMS calculation. |
Use Scenario: Industrial batch timer with start/stop buttons, LED indicators, and relay control for process sequencing. IC Role / Device Role / Timing Role: Precision timing core generating millisecond-resolution delays and managing relay drive timing with jitter-free outputs. Use Value: Four independent 16-bit timers (TA0/TA1/TA2/TB0) provide dedicated PWM, capture, and interval generation - eliminating software timing bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5310IRGZT | 32 KB flash (vs. 24 KB), same peripherals and pinout - identical RGZ-48 package and USCI/timer/ADC configuration. | Preferred when firmware complexity requires larger code space or future feature expansion without layout change. | Select if additional flash headroom is needed for bootloader, OTA updates, or enhanced protocol stacks. |
| MSP430F5308IRGZT | 16 KB flash (vs. 24 KB), otherwise identical architecture, memory map, and peripheral set - same RGZ-48 footprint and electrical specs. | Suitable for cost-sensitive designs with smaller firmware footprints and no need for extra flash margin. | Choose for high-volume production where reduced flash capacity meets functional requirements and lowers unit cost. |
Compared with MSP430F5309IRGZT, MSP430F5310IRGZT offers 8 KB more flash for complex firmware while maintaining identical power profile and peripheral functionality; MSP430F5308IRGZT reduces flash to 16 KB for tighter BOM cost control without sacrificing timer count, ADC resolution, or low-power performance.
Availability
MSP430F5309IRGZT is available at Aetrix Electronics and suitable for analog sensor systems, digital thermostats, and hand-held meters requiring stable component supply and long-term industrial availability.
Supply support for MSP430F5309IRGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of low-power innovation.
The MSP430F5309IRGZT belongs to the MSP430F5xx ultra-low-power MCU family, designed specifically for extended-battery-life measurement and control applications in portable and industrial environments.
FAQ
What is the maximum operating frequency of the MSP430F5309IRGZT?
The MSP430F5309IRGZT supports a maximum system clock frequency of 25 MHz, enabled by its digitally controlled oscillator (DCO) and FLL-based unified clock system. This allows high-speed instruction execution while maintaining ultra-low active-mode current (195 µA/MHz at 8 MHz, 3 V). The device achieves sub-5-µs wake-up from LPM3, making it suitable for responsive real-time applications. MSP430F5309IRGZT's clock architecture supports dynamic scaling between low-frequency RTC operation and burst-mode processing.
Does the MSP430F5309IRGZT support crystal oscillators?
Yes, the MSP430F5309IRGZT supports two crystal oscillator circuits: a low-frequency 32-kHz XT1 for RTC and watch crystal operation, and a high-frequency XT2 supporting crystals up to 32 MHz for system clock generation. Pins P5.4/XIN and P5.5/XOUT are dedicated to XT1; P5.2/XT2IN and P5.3/XT2OUT serve XT2. These are fully integrated into the UCS and require no external load capacitors beyond those specified in the datasheet. MSP430F5309IRGZT's crystal support enables precise timing accuracy essential for metering and communication protocols.
How many I/O pins does the MSP430F5309IRGZT have in the RGZ package?
The MSP430F5309IRGZT in the VQFN-48 (RGZ) package provides 31 general-purpose I/O pins, confirmed in Table 3-1 of the SLAS677G datasheet. These include P1–P6 ports (with partial availability per package), PU.0/PU.1, and PJ.0–PJ.3. All 31 pins support interrupt capability, Schmitt-trigger inputs, and configurable drive strength. MSP430F5309IRGZT's I/O count balances compact packaging with sufficient peripheral interfacing for sensor hubs and control panels without requiring GPIO expanders.
Is the MSP430F5309IRGZT pin-compatible with other devices in the F53xx family?
Yes, the MSP430F5309IRGZT is pin-compatible with MSP430F5310IRGZT and MSP430F5308IRGZT in the RGZ-48 package - all share identical pin numbering, electrical characteristics, and peripheral signal mapping. This enables direct substitution in existing designs for flash capacity optimization. MSP430F5309IRGZT retains full functionality across USCI, timers, ADC, and RTC, ensuring no layout or firmware changes are required when migrating between these variants.
What development tools are supported for the MSP430F5309IRGZT?
The MSP430F5309IRGZT is supported by TI's MSP430Ware software library, Code Composer Studio IDE, and the MSP-FET programmer/debugger. Hardware evaluation is enabled via the MSP-TS430RGZ48 target socket board and compatible launchpads with adapter modules. MSP430F5309IRGZT's Spy-Bi-Wire interface allows single-pin debugging and programming, reducing test fixture complexity. TI also provides application-specific examples for ADC, RTC, USCI, and low-power mode transitions - accelerating firmware validation.
MSP430F5309IRGZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 24KB (24K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5309IRGZT FAQ
1.How can I place an order for MSP430F5309IRGZT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5309IRGZT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5309IRGZT reliable?
The price and inventory of MSP430F5309IRGZT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5309IRGZT is usually 5 days.
3.What payment methods are accepted for MSP430F5309IRGZT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5309IRGZT transactions.
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MSP430F5309IRGZT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5309IRGZT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5309IRGZT?
For technical support, including MSP430F5309IRGZT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5309IRGZT requirements.
6.How does Aetrix verify that MSP430F5309IRGZT is sourced from the original manufacturer or authorized distributors?
All MSP430F5309IRGZT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5309IRGZT meets industry standards.
7.What is the process for return or replacement of MSP430F5309IRGZT?
All MSP430F5309IRGZT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5309IRGZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5309IRGZT part is unused and in its original packaging.
Return procedure for MSP430F5309IRGZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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