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Texas Instruments MSP430F5310IRGCR
- Part No.:
- MSP430F5310IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5310IRGCR.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:15,025
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Product details
Overview
MSP430F5310IRGCR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 32 KB Flash, 6 KB RAM, dual USCI modules (UART/IrDA/SPI/I²C), 10-bit ADC with 12 channels (10 external + 2 internal), RTC with alarm, and four 16-bit timers (TA0/TA1/TA2/TB0). It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and portable instrumentation.
For engineers reviewing the MSP430F5310IRGCR datasheet, MSP430F5310IRGCR pinout, MSP430F5310IRGCR application, or MSP430F5310IRGCR equivalent, key selection criteria include its 47 I/O count in 64-pin VQFN, LPM3 current of 1.9 µA at 2.2 V, sub-5-µs wake-up time, integrated LDO, and dual-USCI flexibility for concurrent serial protocols in space-constrained designs.
Technical Context
The MSP430F5310IRGCR implements a 16-bit RISC CPUXV2 core with constant generators and hardware multiplier supporting 32-bit operations. Its Unified Clock System (UCS) integrates FLL, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz), enabling precise clock domain management across active and low-power modes.
Power management includes programmable LDO output (VCORE), supply voltage supervisor (SVM/SVS), brownout reset, and five low-power modes (LPM0–LPM4.5). The port mapping controller on Port 4 allows dynamic remapping of USCI signals, though simultaneous use of all USCI functions is constrained by pin availability in the 64-pin RGC package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators and 32-bit hardware multiplier - enables efficient C code execution and real-time math in sensor fusion or motor control loops. |
| Memory | 32 KB Flash / 6 KB RAM - sufficient for standalone firmware with bootloader, sensor drivers, and communication stacks without external memory. |
| ADC | 10-bit SAR ADC, 200 kSPS, 12 input channels (10 external + 2 internal) - supports multi-sensor analog acquisition with window comparator for threshold-triggered wake-up. |
| Timers | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC) - provides independent PWM generation, capture timing, and RTC backup with alarm interrupt capability. |
| USCI Modules | Two USCI peripherals: USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (I²C/SPI) - enables concurrent wired communication (e.g., UART debug + I²C sensor bus) with automatic baud-rate detection. |
| Low-Power Performance | LPM3 current = 1.9 µA @ 2.2 V (RTC active, full RAM retention); wake-up < 5 µs - extends coin-cell battery life to years in periodic-sampling applications like thermostats or remote meters. |
| Package & I/O | VQFN-64 (9 mm × 9 mm), 47 GPIO - high pin density supports complex peripheral interfacing while maintaining thermal performance via exposed pad (to be connected to VSS). |
Pinout & Package
Package: VQFN-64 (RGC), 9 mm × 9 mm body size with exposed thermal pad (recommended connection to VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Primary ACLK input / Timer_A0 clock source | Accepts 32-kHz crystal or external clock for real-time clock and low-frequency timer operation; critical for RTC accuracy and LPM3 stability. |
| P2.6/RTCCLK/DMAE0 | RTC clock input / DMA trigger | Provides dedicated clock path to RTC module; also serves as DMA event trigger for autonomous data transfers during low-power operation. |
| P4.0–P4.4/USCI1 signals | USCI_B1/USCI_A1 configurable pins | Port-mapped I²C (SCL/SDA) and UART (TXD/RXD) - requires software configuration via PMAP; enables flexible serial interface assignment without PCB redesign. |
| RST/NMI/SBWTDIO | Reset / NMI input / Spy-Bi-Wire debug I/O | Single-pin debug interface supports programming and real-time debugging with minimal footprint; NMI enables edge-triggered wake-up from any low-power mode. |
| VCORE | Internally regulated core voltage output | Supplies CPU and digital logic at programmable voltage (1.3–1.45 V); decoupling capacitor required - no external load permitted per TI specification. |
Key Features
| Feature | Design Value |
|---|---|
| Fully integrated LDO | Programmable VCORE (1.3–1.45 V) reduces external component count and improves power efficiency across supply voltage range (1.8–3.6 V). |
| Dual USCI modules | Independent UART/IrDA/SPI and I²C/SPI interfaces allow concurrent communication with host MCU and multiple sensors without resource contention. |
| Real-time clock with alarm | Hardware RTC runs in LPM3 with crystal or VLO clock; alarm interrupt wakes CPU on calendar/time event - eliminates polling overhead in time-based applications. |
| Port mapping controller (P4) | Dynamic remapping of USCI signals onto Port 4 pins enables flexible PCB layout and firmware-driven interface reconfiguration without hardware change. |
| 3-channel DMA | Autonomous data movement between peripherals (e.g., ADC → RAM, UART TX buffer → USCI) reduces CPU load and extends low-power mode duration. |
Applications
| Smart Thermostat Control | Hand-Held Digital Multimeter |
|---|---|
|
Use Scenario: Battery-powered HVAC controller sampling temperature/humidity every 30 seconds, logging data, and updating display. IC Role / Device Role / Timing Role: Main system controller executing sensor readout, calibration, display refresh, and wireless transmission scheduling. Use Value: LPM3 current of 1.9 µA at 2.2 V enables >5-year CR2032 battery life; RTC alarm triggers precise periodic wake-up without CPU intervention. |
Use Scenario: Portable multimeter acquiring voltage, current, and resistance with auto-ranging and LCD display. IC Role / Device Role / Timing Role: Central measurement engine managing ADC sequencing, analog front-end control, and segmented LCD driver timing. Use Value: 10-bit ADC with 12-channel input supports simultaneous analog sensing paths; hardware multiplier accelerates RMS calculation for AC measurements. |
| Digital Motor Control Interface | Remote IR Sensor Node |
|
Use Scenario: Compact BLDC motor controller monitoring hall-effect sensors, driving gate drivers, and communicating status via UART. IC Role / Device Role / Timing Role: Real-time motion controller generating PWM waveforms using Timer_B's 7 capture/compare registers and synchronizing feedback capture. Use Value: Sub-5-µs wake-up from LPM0 ensures deterministic response to fault interrupts; dual USCI supports UART diagnostics and SPI to external gate driver IC. |
Use Scenario: Wireless occupancy sensor using IR PIR detector, ambient light sensor, and BLE module - transmitting only on motion detection. IC Role / Device Role / Timing Role: Low-power event coordinator sampling PIR output via comparator, triggering wake-up, and initiating BLE transmission sequence. Use Value: Comparator_B with window function detects motion thresholds autonomously; LPM4.5 shutdown mode draws only 0.18 µA to maximize standby duration between events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5309IRGCR | 24 KB Flash, same 6 KB RAM, identical peripherals and pinout - differs only in program memory size. | Suitable where firmware footprint is ≤24 KB; retains full compatibility for ADC, timers, USCI, and low-power features. | Select when cost optimization is prioritized and application code fits within reduced Flash; no hardware or firmware changes required. |
| MSP430F5308IRGCR | 16 KB Flash, same RAM and peripheral set; otherwise electrically and mechanically identical to MSP430F5310IRGCR. | Applicable for simpler sensor nodes or legacy firmware requiring less than 16 KB Flash; maintains same I/O count and low-power behavior. | Choose for entry-level implementations where feature set matches but memory headroom is not needed; drop-in replacement in RGC package. |
Compared with MSP430F5309IRGCR and MSP430F5308IRGCR, the MSP430F5310IRGCR offers greater firmware capacity (32 KB) for advanced algorithms or field-upgradable features, while preserving identical low-power performance, peripheral integration, and 64-pin VQFN footprint - making it the highest-memory variant in this pin-compatible family.
Availability
MSP430F5310IRGCR is available at Aetrix Electronics and suitable for smart thermostat control, hand-held digital multimeters, and remote IR sensor nodes requiring stable component supply and long-term industrial availability.
Supply support for MSP430F5310IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.
The MSP430F5310IRGCR belongs to the MSP430F5xx ultra-low-power MCU family, engineered for extended battery life in portable measurement, sensing, and metering applications where energy efficiency and integration are critical.
FAQ
What is the maximum system clock frequency supported by the MSP430F5310IRGCR?
The MSP430F5310IRGCR supports a maximum system clock (MCLK) frequency of 25 MHz, achieved via the FLL-controlled DCO or external high-frequency crystal (XT2) up to 32 MHz. This enables high-speed computation for real-time control tasks while maintaining compatibility with TI's MSP430F5xx Family User's Guide timing constraints. The MSP430F5310IRGCR datasheet specifies timing parameters for all clock domains under recommended operating conditions.
Does the MSP430F5310IRGCR support crystal oscillators for both low- and high-frequency operation?
Yes, the MSP430F5310IRGCR supports dual crystal oscillator inputs: XT1 accepts 32-kHz watch crystals for RTC and low-frequency timing, while XT2 supports high-frequency crystals up to 32 MHz for system clock generation. Both are fully integrated into the Unified Clock System (UCS) and can be selected dynamically in firmware. The MSP430F5310IRGCR pinout reserves P5.4/XIN and P5.5/XOUT for XT1, and P5.2/XT2IN and P5.3/XT2OUT for XT2.
How many general-purpose I/O pins does the MSP430F5310IRGCR provide in its 64-pin VQFN package?
The MSP430F5310IRGCR provides 47 general-purpose I/O pins in the 64-pin VQFN (RGC) package, as confirmed in the Device Information table and functional block diagrams. These include P1–P6, PU, and PJ ports with configurable functionality. Unused pins (e.g., NC, VCORE) are not counted as GPIO. The MSP430F5310IRGCR's I/O count remains consistent across all RGC-package variants in the F53xx family.
Can the MSP430F5310IRGCR operate from a single 1.8-V supply without external regulators?
Yes, the MSP430F5310IRGCR operates over a supply voltage range of 1.8 V to 3.6 V and includes an integrated LDO that generates the regulated VCORE voltage internally. No external regulator is required for core logic operation. The MSP430F5310IRGCR's LDO supports programmable output levels (1.3–1.45 V) and maintains stable operation down to 1.8 V DVCC, enabling direct connection to Li-ion or coin-cell sources.
Is the MSP430F5310IRGCR pin-compatible with other devices in the MSP430F53xx family?
Yes, the MSP430F5310IRGCR is pin-compatible with MSP430F5309IRGCR and MSP430F5308IRGCR in the 64-pin RGC package - sharing identical pin functions, electrical characteristics, and mechanical dimensions. Differences are limited to Flash size (32 KB vs. 24 KB vs. 16 KB); all three devices use the same footprint, thermal pad layout, and signal assignments. The MSP430F5310IRGCR datasheet confirms this in the Device Comparison table and Package Option Addendum.
MSP430F5310IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5310IRGCR FAQ
1.How can I place an order for MSP430F5310IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5310IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5310IRGCR reliable?
The price and inventory of MSP430F5310IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5310IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430F5310IRGCR?
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MSP430F5310IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5310IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5310IRGCR?
For technical support, including MSP430F5310IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5310IRGCR requirements.
6.How does Aetrix verify that MSP430F5310IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5310IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5310IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5310IRGCR?
All MSP430F5310IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5310IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5310IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5310IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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