Texas Instruments MSP430F5310IRGCT
- Part No.:
- MSP430F5310IRGCT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5310IRGCT.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 64VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,450
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Product details
Overview
MSP430F5310IRGCT from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 32 KB Flash, 6 KB RAM, dual USCI modules (UART/IrDA/SPI/I²C), 10-bit 200 kSPS ADC with window comparator, RTC, four 16-bit timers (TA0/TA1/TA2/TB0), hardware multiplier, and integrated 3.3-V LDO. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems requiring sub-2 µA standby current and <5 µs wake-up.
For engineers reviewing the MSP430F5310IRGCT datasheet, MSP430F5310IRGCT pinout, MSP430F5310IRGCT application, or MSP430F5310IRGCT equivalent, key selection criteria include its 48-pin VQFN (RGCT) package, 47 I/O pins, dual-USCI flexibility for concurrent serial protocols, and verified low-power operation down to 1.1 µA in LPM4 mode - critical for portable metering and timer applications.
Technical Context
The MSP430F5310IRGCT implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system (UCS) supporting FLL-stabilized MCLK up to 25 MHz, REFO (32.768 kHz), VLO (10 kHz), XT1 (32 kHz crystal), and XT2 (up to 32 MHz crystal). Its power management includes programmable LDO core regulation, SVM/SVS brownout detection, and five low-power modes (LPM0–LPM4.5).
Peripherals are mapped via port mapping controller (P4), enabling dynamic reconfiguration of USCI signals on port 4 pins. The device integrates 3-channel DMA, CRC16 engine, and EEM (enhanced embedded memory) for efficient Flash programming - all optimized for deterministic real-time response in measurement-critical embedded control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators; enables compact, high-efficiency C code execution in resource-constrained systems. |
| Flash / RAM | 32 KB Flash / 6 KB RAM; supports in-system programming and full RAM retention in LPM3/LPM4 for fast wake-up state recovery. |
| Supply Range | 1.8 V to 3.6 V; compatible with single-cell Li-ion, alkaline, or coin-cell batteries without external regulators. |
| LPM3 Current | 1.9 µA at 2.2 V (RTC + watchdog + supervisor active); enables multi-year operation in always-on sensor nodes. |
| ADC Performance | 10-bit, 200 kSPS with 12-channel input mux (10 external + 2 internal); supports windowed threshold detection for autonomous event triggering. |
| Timer Resources | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC); enables simultaneous PWM generation, capture, and RTC synchronization. |
| USCI Modules | Two independent USCI blocks: USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (I²C/SPI); allows concurrent wired communication without software arbitration. |
Pinout & Package
VQFN-48 (RGCT) package, 7 mm × 7 mm, exposed thermal pad (recommended connection to VSS). Pin count: 48; I/O count: 47 (including dedicated JTAG/SBW debug pins).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / Debug I/O | Active-low reset with NMI capability; dual-function pin for Spy-Bi-Wire programming and debugging without external header. |
| P1.0/TA0CLK/ACLK | Port 1 bit 0 / Timer A0 clock / Auxiliary clock | Configurable as GPIO, timer clock source, or 32.768 kHz crystal oscillator output for RTC timing. |
| P4.0–P4.4 | Port 4 multiplexed USCI signals | Supports dynamic mapping of UCB1STE/UCA1CLK, UCB1SIMO/UCB1SDA, UCB1SOMI/UCB1SCL, UCB1CLK/UCA1STE, UCA1TXD/UCA1SIMO - enabling flexible serial interface routing. |
| P5.4/XIN & P5.5/XOUT | XT1 crystal oscillator terminals | Connects to 32.768 kHz watch crystal for precision RTC operation with automatic calibration support. |
| VCORE | Internal core voltage supply | Not user-accessible; requires 1.8 µF ceramic capacitor to ground per TI design guidelines for stable LDO regulation. |
Key Features
| Feature | Design Value |
|---|---|
| Unified Clock System (UCS) | FLL-based frequency stabilization with selectable sources (VLO, REFO, XT1, XT2); eliminates need for external clock ICs in most designs. |
| Low-Power Modes | Five configurable modes (LPM0–LPM4.5); LPM4.5 draws only 0.18 µA at 3 V - ideal for long-term storage or deep sleep states. |
| Hardware Multiplier | 32-bit multiply-accumulate support in single-cycle operation; accelerates filtering, PID, and sensor fusion algorithms without CPU overhead. |
| Real-Time Clock (RTC_A) | Calendar mode with alarm, prescaler, and battery-backup capability; maintains time across power cycles using AVCC/AVSS rails. |
| DMA Controller | 3-channel peripheral-to-memory/mem-to-mem transfers; offloads ADC sampling, UART buffering, and timer capture tasks from CPU. |
Applications
| Remote Sensor Node | Digital Thermostat |
|---|---|
Use Scenario: Battery-powered environmental sensor collecting temperature/humidity data every 30 seconds and transmitting via UART to gateway. IC Role / Device Role / Timing Role: Main system controller executing sensor readout, ADC conversion, RTC-timed wake-up, and UART transmission. Use Value: Sub-2 µA LPM3 current extends 2xAA battery life beyond 5 years; <5 µs wake-up ensures minimal energy loss during periodic sampling. | Use Scenario: Wall-mounted HVAC controller monitoring ambient temperature, driving display, and managing relay outputs based on setpoint logic. IC Role / Device Role / Timing Role: Real-time decision engine with RTC-driven scheduling, analog sensor interface, and I²C-connected display driver. Use Value: Integrated 10-bit ADC with window comparator triggers immediate response to temperature thresholds; dual USCI enables simultaneous display update and sensor polling. |
| Hand-Held Multimeter | Digital Timer/Stopwatch |
Use Scenario: Portable test instrument measuring voltage/current/resistance with auto-ranging and LCD display. IC Role / Device Role / Timing Role: Signal acquisition processor handling analog front-end conditioning, ADC sequencing, and SPI-driven LCD refresh. Use Value: 200 kSPS ADC resolution supports 4½-digit accuracy; hardware multiplier accelerates RMS calculations in real time. | Use Scenario: Precision timing device with start/stop/lap functions, backlight control, and battery-level monitoring. IC Role / Device Role / Timing Role: Timekeeping and UI manager using RTC_A calendar mode, GPIO-driven buttons, and PWM-controlled LED backlight. Use Value: RTC_A alarm and interrupt capability enables accurate lap timing; LPM4 mode reduces idle current to 1.1 µA for extended standby. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5309IRGCT | 24 KB Flash, same peripherals and package; lower program memory but identical I/O count and power profile. | Suitable where firmware size <24 KB suffices and cost optimization is prioritized over future code expansion headroom. | Select when application firmware fits within 24 KB and no additional Flash margin is required for field updates or feature growth. |
| MSP430F5308IRGCT | 16 KB Flash, same 48-pin VQFN package and peripheral set; reduced memory footprint with identical low-power behavior. | Ideal for fixed-function devices like simple timers or basic sensor loggers where code size is tightly constrained. | Choose for cost-sensitive, memory-efficient deployments where 16 KB Flash meets all functional requirements and upgrade path is not needed. |
Compared with MSP430F5309IRGCT and MSP430F5308IRGCT, the MSP430F5310IRGCT provides 32 KB Flash headroom for complex firmware, secure bootloader space, or future feature integration - making it the optimal choice for scalable, long-lifecycle industrial and consumer devices requiring field-upgradable intelligence.
Availability
MSP430F5310IRGCT is available at Aetrix Electronics and suitable for remote sensor nodes, digital thermostats, and hand-held meters requiring stable component supply, long-term manufacturability, and consistent ultra-low-power performance across temperature ranges.
Supply support for MSP430F5310IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of expertise in ultra-low-power design.
The MSP430F5310IRGCT belongs to the MSP430F5xx ultra-low-power MCU family, engineered specifically for portable measurement, sensing, and timing applications where battery life, precision analog integration, and deterministic real-time response are critical.
FAQ
What is the maximum system clock frequency supported by the MSP430F5310IRGCT?
The MSP430F5310IRGCT supports a maximum system clock (MCLK) frequency of 25 MHz, achieved via its integrated FLL control loop using XT2 (up to 32 MHz crystal) or internal DCO. This is confirmed in Section 1.1 Features and Figure 1-1 of the SLAS677F datasheet. The MSP430F5310IRGCT delivers deterministic real-time performance while maintaining ultra-low active-mode current of 195 µA/MHz at 8 MHz and 3 V.
Does the MSP430F5310IRGCT support crystal oscillators for both low-frequency and high-frequency operation?
Yes, the MSP430F5310IRGCT supports dual crystal oscillators: XT1 accepts a 32.768 kHz watch crystal for RTC and ACLK generation, while XT2 supports crystals up to 32 MHz for high-speed MCLK/SMCLK. Pin assignments P5.4/XIN and P5.5/XOUT are dedicated to XT1; XT2 uses P5.2/XT2IN and P5.3/XT2OUT. This dual-crystal capability is explicitly documented in the Functional Block Diagram (Figure 1-2) and Section 5.14–5.15 of the SLAS677F datasheet.
How many I/O pins does the MSP430F5310IRGCT provide in its VQFN-48 (RGCT) package?
The MSP430F5310IRGCT in the 48-pin VQFN (RGCT) package provides 47 general-purpose I/O pins, as confirmed in Table 3-1 (Device Comparison) and Section 1.3 Description of the SLAS677F datasheet. This includes all port pins (P1–P6, PU, PJ) except power, ground, and dedicated debug pins (RST/NMI, TEST/SBWTCK, TCK/TMS/TDI/TDO), which are counted separately.
What are the low-power mode current specifications for the MSP430F5310IRGCT?
The MSP430F5310IRGCT achieves 1.9 µA in LPM3 (RTC active, full RAM retention), 1.1 µA in LPM4 (off mode), and 0.18 µA in LPM4.5 (shutdown mode) - all at 3 V, per Section 1.1 Features and Section 5.5 of SLAS677F. These values are measured with integrated LDO enabled and exclude external circuitry, enabling multi-year battery life in always-on applications.
Can the MSP430F5310IRGCT simultaneously operate UART and I²C interfaces?
Yes, the MSP430F5310IRGCT integrates two independent USCI modules (USCI_A0/A1 and USCI_B0/B1), allowing concurrent UART and I²C operation. Section 1.1 confirms "Two Universal Serial Communication Interfaces (USCIs)" with separate A- and B-type functionality. Pin mapping on Port 4 (P4.0–P4.4) supports dynamic assignment of UCA1TXD/UCA1RXD and UCB1SCL/UCB1SDA, enabling true hardware-level protocol isolation without software arbitration.
MSP430F5310IRGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5310IRGCT FAQ
1.How can I place an order for MSP430F5310IRGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5310IRGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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For technical support, including MSP430F5310IRGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5310IRGCT requirements.
6.How does Aetrix verify that MSP430F5310IRGCT is sourced from the original manufacturer or authorized distributors?
All MSP430F5310IRGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5310IRGCT meets industry standards.
7.What is the process for return or replacement of MSP430F5310IRGCT?
All MSP430F5310IRGCT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5310IRGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5310IRGCT part is unused and in its original packaging.
Return procedure for MSP430F5310IRGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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