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Texas Instruments MSP430F5324IRGCR
- Part No.:
- MSP430F5324IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5324IRGCR.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:7,574
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Product details
Overview
MSP430F5324IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 64 KB flash, 6 KB RAM, integrated 3.3-V LDO, 12-bit ADC (10 external + 2 internal channels), three 16-bit timers (TA0/TA1/TA2 and TB0), two USCIs (UART/IrDA/SPI/I²C), RTC, and hardware multiplier - designed for battery-powered sensor systems and data loggers operating at 1.8–3.6 V.
For engineers reviewing the MSP430F5324IRGCR datasheet, MSP430F5324IRGCR pinout, MSP430F5324IRGCR application, or MSP430F5324IRGCR equivalent, key selection criteria include standby current (1.9 µA in LPM3), wake-up time (3.5 µs), 47 GPIO count, VQFN-64 package footprint, and compatibility with TI's MSP430F5xx toolchain and energy-aware IDE.
Technical Context
The MSP430F5324IRGCR implements a unified clock system with FLL-based frequency stabilization, dual crystal support (XT1 for 32-kHz RTC, XT2 up to 32 MHz), and low-power internal sources (VLO, REFO). Its power management includes programmable core voltage regulation via integrated LDO and brownout detection with hysteresis.
Peripherals are memory-mapped and interrupt-driven: ADC12_A supports autoscan across 12 channels with internal reference; USCI modules provide independent UART/IrDA/SPI and I²C operation; Timer_B0 features 7 capture/compare registers with shadowing for glitch-free PWM; and DMA enables zero-CPU-overhead data transfers between peripherals and memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators and 32-bit hardware multiplier - enables compact, deterministic code for real-time sensor processing. |
| Memory | 64 KB flash + 6 KB RAM (8 KB + 2 KB configuration per family) - sufficient for firmware with protocol stacks and buffered logging. |
| Power Modes | LPM3 standby: 1.9 µA at 3 V; LPM4 off mode: 1.1 µA; LPM4.5 shutdown: 0.18 µA - extends coin-cell battery life to multi-year operation. |
| ADC | 12-bit SAR ADC with 200 ksps, autoscan, 10 external + 2 internal channels, internal reference - supports simultaneous multi-sensor acquisition without external refs. |
| Timers | TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC with shadow registers) - enables concurrent PWM generation, input capture, and RTC/calendar functions. |
| Communication | USCI_A0/A1: UART/IrDA/SPI; USCI_B0/B1: I²C/SPI - allows dual-interface connectivity (e.g., UART to host + I²C to sensors) with independent clock domains. |
| I/O Count | 47 general-purpose I/O pins with configurable drive strength, Schmitt-trigger inputs, and port mapping control - matches compact PCB layouts in space-constrained nodes. |
Pinout & Package
VQFN-64 (RGC) package, 9 mm × 9 mm body, 0.5-mm pitch, exposed thermal pad (to be connected to VSS per TI recommendation).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Port 1 bit 0 / Timer A0 clock input / Auxiliary clock output | Configurable as GPIO or dedicated clock source for timer or system clock tree - enables flexible timing architecture. |
| P2.6/RTCCLK/DMAE0 | Port 2 bit 6 / RTC clock input / DMA enable 0 | Supports external 32.768-kHz crystal for precision RTC or triggers DMA on event - critical for time-stamped data logging. |
| P3.0/UCB0SIMO/UCB0SDA | Port 3 bit 0 / SPI master-out-slave-in / I²C serial data | Shared function pin enabling either SPI or I²C communication - reduces pin count while supporting common sensor interfaces. |
| P5.4/XIN & P5.5/XOUT | Crystal oscillator input/output | Connects to 32-kHz watch crystal for RTC operation - requires external load capacitors per layout guidelines. |
| RST/NMI/SBWTDIO | Reset / non-maskable interrupt / Spy-Bi-Wire debug I/O | Single-pin debug interface enables programming and real-time debugging with minimal PCB footprint and no external header. |
| LDOO & LDOI | LDO output and input rails | Integrated 3.3-V regulator supplies core logic; LDOI accepts 3.3–3.6 V input - eliminates need for external LDO in many designs. |
| VCORE | Core voltage supply | Provides regulated voltage to CPU and SRAM - decoupling required per datasheet to maintain stability during active mode transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | 1.9 µA LPM3 current enables >5-year operation on CR2032 battery in periodic-sensing applications. |
| FLL-controlled clock system | Digitally controlled oscillator locks to crystals or external clocks - ensures accurate timing without manual calibration. |
| Integrated LDO | Programmable core voltage regulation simplifies power design and improves noise immunity over discrete regulators. |
| Autoscan ADC | Hardware-accelerated sequential conversion across 12 channels - eliminates CPU polling overhead in multi-sensor systems. |
| 3-channel DMA | Enables background data movement between ADC, USCI, and memory - preserves low-power modes during high-throughput transfers. |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting readings via UART to LoRaWAN gateway. IC Role / Device Role / Timing Role: Main controller executing sensor readout, timestamping via RTC, UART framing, and low-power sleep scheduling. Use Value: 1.9 µA LPM3 current and 3.5 µs wake-up minimize duty-cycle overhead, extending field deployment to 7+ years on single CR2032. | Use Scenario: Standalone environmental monitor recording temperature, pressure, and voltage every 10 seconds to internal flash. IC Role / Device Role / Timing Role: Real-time data acquisition engine with autoscan ADC, RTC alarm wakeup, and flash write management. Use Value: Integrated 64 KB flash and 6 KB RAM eliminate external memory; 12-bit ADC with internal reference ensures stable measurements without BOM cost increase. |
| Portable Medical Monitor | Smart Building Occupancy Sensor |
Use Scenario: Wearable pulse oximeter using analog front-end and I²C-connected optical sensor. IC Role / Device Role / Timing Role: Signal processor running analog acquisition, digital filtering, and I²C sensor control with precise timing via Timer_A. Use Value: Hardware multiplier accelerates FIR filtering; 47 GPIO support multiple analog inputs and LED indicators within tight size constraints. | Use Scenario: Ceiling-mounted PIR + ambient light sensor node detecting occupancy and adjusting lighting via DALI interface. IC Role / Device Role / Timing Role: Multi-peripheral coordinator managing PIR interrupts, light ADC sampling, and DALI UART communication. Use Value: Dual USCI modules allow concurrent I²C (light sensor) and UART (DALI) operation - no software arbitration or time-slicing required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5326IRGCR | Same 64-pin VQFN package, identical peripheral set, but with 96 KB flash and 8 KB RAM | Preferred when firmware complexity or data buffering requirements exceed 64 KB flash capacity | Select MSP430F5326IRGCR if future firmware expansion or larger protocol stacks are anticipated. |
| MSP430F5328IRGCR | Same 64-pin VQFN package, identical memory (128 KB flash, 10 KB RAM), and full peripheral complement | Suitable for designs requiring higher code density margin or extended data logging buffer depth | Choose MSP430F5328IRGCR when additional flash/RAM headroom justifies minor BOM cost increase. |
Compared with MSP430F5326IRGCR and MSP430F5328IRGCR, the MSP430F5324IRGCR delivers optimal cost-performance balance for fixed-function sensor nodes where 64 KB flash and 6 KB RAM are sufficient - reducing component cost without sacrificing ultra-low-power capability or peripheral integration.
Availability
MSP430F5324IRGCR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and portable medical monitors requiring stable component supply and long-term lifecycle support.
Supply support for MSP430F5324IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430F532x product line targets ultra-low-power portable measurement applications - emphasizing extended battery life, integrated analog peripherals, and rapid wake-up from deep sleep states.
FAQ
What is the maximum system clock frequency supported by the MSP430F5324IRGCR?
The MSP430F5324IRGCR supports up to 25 MHz system clock frequency via its FLL-controlled DCO or external high-frequency crystal (XT2) up to 32 MHz. This enables real-time signal processing and high-speed communication while maintaining ultra-low-power efficiency in active mode - a key capability confirmed in Section 8.19 (DCO Frequency) and Section 8.16 (XT2) of the SLAS678G datasheet for the MSP430F5324IRGCR.
Does the MSP430F5324IRGCR include an integrated voltage regulator?
Yes, the MSP430F5324IRGCR integrates a fully programmable LDO that generates a regulated 3.3-V core supply from a 3.3–3.6-V input on LDOI. This eliminates the need for an external regulator in most designs and is documented in Section 8.44 (LDO-PWR) and functional block diagrams for the MSP430F5324IRGCR in the SLAS678G datasheet.
How many analog input channels does the ADC on the MSP430F5324IRGCR support?
The MSP430F5324IRGCR features a 12-bit ADC (ADC12_A) with 10 external analog input channels plus 2 internal channels (temperature sensor and VREF), totaling 12 usable channels. This configuration is explicitly specified in Table 6-1 (Device Comparison) and Section 8.35–8.39 of the SLAS678G datasheet for the MSP430F5324IRGCR.
What debug interface does the MSP430F5324IRGCR use?
The MSP430F5324IRGCR uses the 2-wire Spy-Bi-Wire (SBW) interface via the RST/NMI/SBWTDIO pin for programming and debugging - compatible with TI's MSP-FET and IAR/Code Composer Studio tools. This is confirmed in Section 7.2 (Signal Descriptions) and Section 8.46 (JTAG and Spy-Bi-Wire Interface) of the SLAS678G datasheet for the MSP430F5324IRGCR.
Is the MSP430F5324IRGCR pin-compatible with other devices in the MSP430F532x family?
Yes, the MSP430F5324IRGCR shares identical pinout and package (VQFN-64, RGC) with MSP430F5326IRGCR and MSP430F5328IRGCR - enabling direct substitution in existing designs. This compatibility is verified in Figure 7-2 (64-Pin RGC Package) and Table 6-1 of the SLAS678G datasheet for the MSP430F5324IRGCR.
MSP430F5324IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5324IRGCR FAQ
1.How can I place an order for MSP430F5324IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5324IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5324IRGCR reliable?
The price and inventory of MSP430F5324IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5324IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430F5324IRGCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5324IRGCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5324IRGCR?
MSP430F5324IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5324IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5324IRGCR?
For technical support, including MSP430F5324IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5324IRGCR requirements.
6.How does Aetrix verify that MSP430F5324IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5324IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5324IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5324IRGCR?
All MSP430F5324IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5324IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5324IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5324IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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