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Texas Instruments MSP430F5324IZQER
- Part No.:
- MSP430F5324IZQER
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 80-VFBGA
- Datasheet:
-
MSP430F5324IZQER.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 80BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MSP430F5324IZQER from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 64 KB flash, 6 KB RAM, integrated 3.3-V LDO, 12-bit ADC (10 external + 2 internal channels), two USCI modules (UART/IrDA/SPI/I²C), four 16-bit timers (TA0/TA1/TA2/TB0), RTC, hardware multiplier, and 47 GPIO pins - designed for battery-powered sensor systems and data loggers requiring sub-2 µA standby current.
For engineers reviewing the MSP430F5324IZQER datasheet, MSP430F5324IZQER pinout, MSP430F5324IZQER application, or MSP430F5324IZQER equivalent, key selection criteria include LPM3 current (1.9 µA at 3 V), wake-up time (3.5 µs), ADC resolution and channel count, timer architecture, USCI interface flexibility, and MicroStar Junior BGA (80-pin, 5 mm × 5 mm) package compatibility with high-density PCB layouts.
Technical Context
The MSP430F5324IZQER implements a digitally controlled oscillator (DCO) with FLL stabilization, supports dual crystal sources (XT1 for 32-kHz RTC, XT2 up to 32 MHz), and integrates a unified clock system with programmable ACLK/SMCLK/MCLK dividers. Its power management includes an on-chip LDO with configurable core voltage, SVM/SVS monitoring, and brownout reset.
Peripherals are memory-mapped and interrupt-driven: the 12-bit ADC12_A supports autoscan across 12 channels with internal reference and sample-and-hold; Timer_B0 provides seven capture/compare registers with shadowing; USCI_A0/A1 support enhanced UART with auto-baud detection and IrDA, while USCI_B0/B1 support I²C and SPI in master/slave modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators and 32-bit hardware multiplier - enables efficient C code execution and real-time math operations. |
| Flash / RAM | 64 KB flash + 6 KB RAM (including 2 KB of auxiliary RAM) - sufficient for complex sensor fusion algorithms and firmware updates in field-deployed devices. |
| LPM3 Current | 1.9 µA at 3 V (typical) with RTC, watchdog, and full RAM retention - extends battery life to years in intermittent-sampling applications. |
| ADC Resolution | 12-bit SAR ADC with 10 external + 2 internal input channels, 200 ksps max sampling rate - supports precision analog sensing without external signal conditioning. |
| Timer Resources | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC with shadow registers) - enables simultaneous PWM generation, input capture, and real-time event sequencing. |
| USCI Interfaces | Two USCI_A (UART/IrDA/SPI) and two USCI_B (I²C/SPI) modules - allows concurrent wired communication with multiple sensors, displays, and host controllers. |
| Package | MicroStar Junior™ BGA, 80-pin, 5 mm × 5 mm - provides compact footprint and thermal performance suitable for space-constrained IoT edge nodes. |
Pinout & Package
Package: MicroStar Junior™ BGA (80-pin, 5 mm × 5 mm, 0.5 mm pitch). Thermal pad must be connected to VSS per TI recommendation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug I/O | Single-pin multifunction interface for safe reset assertion, NMI-triggered fault handling, and Spy-Bi-Wire programming/debugging. |
| P1.0/TA0CLK/ACLK | Port 1.0 / Timer_A0 clock input / Auxiliary clock output | Configurable as GPIO, external clock source for TA0, or buffered ACLK output - enables flexible clock tree routing and low-jitter timing references. |
| P5.4/XIN & P5.5/XOUT | Low-frequency crystal oscillator terminals | Supports 32.768-kHz watch crystal for RTC operation with automatic calibration - ensures accurate timekeeping during LPM3 with minimal external components. |
| P2.6/RTCCLK/DMAE0 | RTC clock output / DMA trigger enable | Provides synchronous RTC tick signal to peripherals and triggers DMA transfers on calendar events - eliminates CPU polling for time-based data acquisition. |
| P3.0–P3.1/UCB0SIMO/SOMI | I²C data lines (SDA/SCL) | Dedicated USCI_B0 pins for standard-mode (100 kHz) and fast-mode (400 kHz) I²C - simplifies connection to temperature, humidity, and environmental sensors. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible power management | Five low-power modes (LPM0–LPM4.5) with sub-µA shutdown (0.18 µA) and 3.5 µs wake-up - enables energy harvesting and coin-cell operation in remote sensors. |
| Integrated LDO | On-chip 3.3-V regulator with programmable core voltage (1.8–3.6 V) - eliminates external LDO, reduces BOM cost, and improves supply rejection in noisy environments. |
| Autoscan ADC | Hardware-controlled sequential conversion across up to 12 channels without CPU intervention - supports continuous multi-sensor monitoring with deterministic timing. |
| Real-time clock with alarm | Calendar mode with year/month/day/hour/minute/second, alarm interrupt, and battery-backed operation - enables scheduled wake-up and time-stamped logging. |
| Three-channel DMA | Automates data movement between peripherals (ADC, USCI, RAM) - frees CPU for computation while maintaining high-throughput sensor data flow. |
Applications
| Wireless Sensor Node | Portable Data Logger |
|---|---|
|
Use Scenario: Battery-powered environmental monitor transmitting temperature, humidity, and light data via BLE or LoRaWAN every 15 minutes. IC Role / Device Role / Timing Role: Main controller executing sensor readout, data preprocessing, RTC-scheduled transmission, and ultra-low-power sleep management. Use Value: 1.9 µA LPM3 current and 3.5 µs wake-up minimize active time, extending CR2032 battery life beyond 2 years without recharging. |
Use Scenario: Handheld device recording vibration, pressure, and acceleration during field equipment inspections, storing data to internal flash. IC Role / Device Role / Timing Role: Central data acquisition unit synchronizing multi-channel ADC sampling, timestamping with RTC, and managing flash write endurance. Use Value: 12-bit ADC with autoscan and 200 ksps sampling captures transient events; 64 KB flash stores >10,000 timestamped records locally. |
| Smart Meter Interface | Industrial Condition Monitor |
|
Use Scenario: Sub-metering module interfacing with utility meter pulse outputs and RS-485 communication for energy usage aggregation. IC Role / Device Role / Timing Role: Pulse counter and protocol translator bridging mechanical meter pulses to Modbus RTU over RS-485 via USCI_B0. Use Value: Dual USCI modules allow simultaneous UART (host command) and I²C (local sensor) communication; LDO ensures stable 3.3-V supply despite fluctuating input. |
Use Scenario: Predictive maintenance node attached to motor housing, measuring temperature and acoustic emission for anomaly detection. IC Role / Device Role / Timing Role: Real-time signal processor running FFT-based feature extraction on ADC samples, triggering alerts via USCI_A0 UART. Use Value: Hardware multiplier accelerates DSP routines; 47 GPIO support thermistor biasing, amplifier control, and status LEDs without external logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5326IZQER | Same package and peripherals, but 96 KB flash and 8 KB RAM - no change in I/O count or ADC channel count. | Preferred when firmware complexity or OTA update partitioning requires larger program memory. | Select MSP430F5326IZQER if future firmware expansion or dual-bank bootloading is required; otherwise, MSP430F5324IZQER offers optimal cost/performance for fixed-function designs. |
| MSP430F5328IRGC | VQFN-64 (9 mm × 9 mm) package with identical 47 I/O, 64 KB flash, and peripheral set - differs only in封装 form factor and thermal pad layout. | Better suited for manual assembly or thermal dissipation-critical designs where BGA rework is impractical. | Choose MSP430F5328IRGC for prototyping or production with QFN-compatible processes; MSP430F5324IZQER is preferred for miniaturized, high-volume PCBs. |
Compared with MSP430F5326IZQER and MSP430F5328IRGC, the MSP430F5324IZQER delivers identical real-time capability and ultra-low-power performance in the smallest footprint, making it ideal for size-constrained, battery-operated edge nodes where memory headroom is not required.
Availability
MSP430F5324IZQER is available at Aetrix Electronics and suitable for wireless sensor nodes, portable data loggers, and smart meter interfaces requiring stable component supply and long-term industrial lifecycle support.
Supply support for MSP430F5324IZQER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.
The MSP430F532x family targets portable measurement and battery-powered sensing applications, emphasizing extended runtime, integrated analog front-ends, and robust real-time control in harsh environments.
FAQ
What is the maximum system clock frequency supported by the MSP430F5324IZQER?
The MSP430F5324IZQER supports a maximum system clock (MCLK) frequency of 25 MHz, achieved using the FLL-stabilized DCO or external high-frequency crystal (XT2) up to 32 MHz. This enables real-time processing of sensor data at rates compatible with 200 ksps ADC sampling and high-speed USCI communication without CPU bottlenecking.
Does the MSP430F5324IZQER support hardware real-time clock functionality with calendar mode?
Yes, the MSP430F5324IZQER includes the RTC_A module supporting calendar mode (year/month/day/hour/minute/second), alarm interrupts, and battery-backed operation when supplied from a backup source. It uses the 32.768-kHz crystal on P5.4/P5.5 and maintains time accuracy during LPM3 with 1.9 µA current draw.
How many universal serial communication interfaces (USCI) does the MSP430F5324IZQER have, and what protocols do they support?
The MSP430F5324IZQER has two USCI_A modules (USCI_A0 and USCI_A1) supporting UART, IrDA, and SPI, and two USCI_B modules (USCI_B0 and USCI_B1) supporting I²C and SPI. This enables concurrent use of UART for host debugging, I²C for sensor communication, and SPI for display or memory interfacing - all without software bit-banging.
What is the ADC configuration of the MSP430F5324IZQER, and does it include internal reference voltage?
The MSP430F5324IZQER features the ADC12_A module: a 12-bit SAR converter with 10 external analog inputs and 2 internal channels (temperature sensor and VREF), 200 ksps max sampling rate, autoscan mode, and integrated 1.5-V/2.0-V/2.5-V internal reference - eliminating need for external voltage references in most precision sensing applications.
Is the MSP430F5324IZQER pin-compatible with other members of the MSP430F532x family in the same package?
Yes, the MSP430F5324IZQER shares identical pinout and electrical characteristics with MSP430F5326IZQER and MSP430F5328IZQER in the MicroStar Junior BGA (ZQE) package. All three support the same 47 GPIO, peripheral mapping, and power domains - enabling drop-in replacement for memory or feature scaling within the same PCB layout.
MSP430F5324IZQER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 80-VFBGA
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5324IZQER FAQ
1.How can I place an order for MSP430F5324IZQER through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5324IZQER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5324IZQER reliable?
The price and inventory of MSP430F5324IZQER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5324IZQER is usually 5 days.
3.What payment methods are accepted for MSP430F5324IZQER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5324IZQER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5324IZQER?
MSP430F5324IZQER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5324IZQER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5324IZQER?
For technical support, including MSP430F5324IZQER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5324IZQER requirements.
6.How does Aetrix verify that MSP430F5324IZQER is sourced from the original manufacturer or authorized distributors?
All MSP430F5324IZQER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5324IZQER meets industry standards.
7.What is the process for return or replacement of MSP430F5324IZQER?
All MSP430F5324IZQER units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5324IZQER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5324IZQER part is unused and in its original packaging.
Return procedure for MSP430F5324IZQER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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