Texas Instruments MSP430F5326IRGCR

Overview

MSP430F5326IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with integrated 3.3-V LDO, 96 KB flash, 8 KB+2 KB RAM, 47 GPIO, 12-bit ADC (10 external + 2 internal channels), two USCI modules (UART/IrDA/SPI/I²C), and four 16-bit timers - designed for battery-powered sensor nodes and portable data loggers operating from 1.8 V to 3.6 V.

For engineers reviewing the MSP430F5326IRGCR datasheet, MSP430F5326IRGCR pinout, MSP430F5326IRGCR application, or MSP430F5326IRGCR equivalent, key selection criteria include standby current (1.9 µA in LPM3), wake-up time (3.5 µs), ADC resolution and channel count, timer flexibility (TA0/TA1/TA2/TB0), and VQFN-64 package compatibility with space-constrained PCB layouts.

Technical Context

The MSP430F5326IRGCR implements a unified clock system with FLL-based frequency stabilization, dual crystal support (XT1 for 32-kHz RTC, XT2 up to 32 MHz), and three internal sources (VLO, REFO, DCO). Its power management includes programmable core voltage regulation via integrated LDO and brownout detection with hysteresis.

Peripherals are memory-mapped and interrupt-driven: the 12-bit ADC supports autoscan across 12 channels with internal reference; USCI_A0/A1 provide UART/IrDA/SPI; USCI_B0/B1 support I²C and SPI; and Timer_B0 offers seven capture/compare registers with shadowing for glitch-free PWM generation.

Key Specifications

Pinout & Package

VQFN-64 (RGC) package, 9 mm × 9 mm, 0.5 mm pitch, exposed thermal pad (to be connected to VSS per TI recommendation).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.

Compared with MSP430F5326IRGCR, MSP430F5328IRGC offers identical functionality with updated silicon errata, while MSP430F5324IRGC trades flash capacity for lower unit cost - both maintain pin-for-pin compatibility, same LPM3 current (1.9 µA), and identical ADC/timer/USCI peripheral implementation.

Availability

MSP430F5326IRGCR is available at Aetrix Electronics and suitable for wireless sensor nodes, portable data loggers, and industrial condition monitors requiring stable component supply and long-lifecycle support.

Supply support for MSP430F5326IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of microcontroller innovation.

The MSP430F5326IRGCR belongs to the MSP430F5xx ultra-low-power MCU family, engineered specifically for extended-battery-life measurement systems where nanowatt sleep modes and fast wake-up are critical to system energy budget.

FAQ

What is the maximum system clock frequency supported by the MSP430F5326IRGCR?

The MSP430F5326IRGCR supports up to 25 MHz system clock frequency using its digitally controlled oscillator (DCO) with FLL stabilization. This frequency is achievable with XT2 crystal (up to 32 MHz) or internal sources, and is validated across the full 1.8 V–3.6 V supply range per TI's SLAS678G specification table. The MSP430F5326IRGCR maintains timing compliance at 25 MHz in active mode with typical current draw of 290 µA/MHz at 3 V.

Does the MSP430F5326IRGCR include an integrated voltage regulator?

Yes, the MSP430F5326IRGCR integrates a fully programmable low-dropout (LDO) regulator that accepts 1.8 V–3.6 V input on LDOI and delivers a stable, adjustable core voltage (1.8 V–3.0 V) on VCORE. This eliminates the need for an external regulator in most designs and is explicitly confirmed in the device description and functional block diagram for the RGC-package variants (MSP430F5328/5326/5324).

How many analog input channels does the 12-bit ADC in the MSP430F5326IRGCR support?

The MSP430F5326IRGCR's ADC12_A module supports 12 total channels: 10 external analog inputs (A0–A9) and 2 internal sources (temperature sensor and VREF+/VeREF+). This configuration is explicitly defined in Table 6-1 (Device Comparison) and Figure 4-2 (functional block diagram for RGC-package devices), distinguishing it from the 14-channel variant used in PN-package family members.

What is the wake-up time from LPM3 standby mode for the MSP430F5326IRGCR?

The MSP430F5326IRGCR wakes up from LPM3 (standby mode with RTC, watchdog, and supervisor active) in 3.5 µs typical, as specified in Section 1 Features and Table 8.26 (Wake-up Times From Low-Power Modes). This value is measured from interrupt assertion to first instruction fetch and applies identically across all RGC-package devices including MSP430F5326IRGCR.

Which package type is used by the MSP430F5326IRGCR, and what are its key mechanical features?

The MSP430F5326IRGCR uses the VQFN-64 (RGC) package: 9 mm × 9 mm body, 0.5 mm lead pitch, and an exposed thermal pad on the underside. TI documentation (Figure 7-2 and Section 11) specifies connecting this pad to VSS for optimal thermal performance and EMI reduction - a mandatory layout requirement confirmed in the "TI recommends connecting the exposed thermal pad to VSS" note.