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Texas Instruments MSP430F5328TRGCTEP

Part No.:
MSP430F5328TRGCTEP
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixMSP430F5328TRGCTEP.pdf
Description:
IC MCU 16BIT 128KB FLASH 64VQFN
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,866

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Product details

Overview

MSP430F5328TRGCTEP from Texas Instruments is an extended-temperature, radiation-tolerant mixed-signal microcontroller featuring a 16-bit RISC CPU, 128 KB flash, 10 KB RAM (8 KB + 2 KB), 12-bit ADC with autoscan, four 16-bit timers (TA0/TA1/TA2/TB0), dual USCI modules (UART/IrDA/SPI/I²C), integrated 3.3-V LDO, and real-time clock - deployed in space-grade sensor telemetry and battery-powered industrial monitoring systems.

For engineers reviewing the MSP430F5328TRGCTEP datasheet, MSP430F5328TRGCTEP pinout, MSP430F5328TRGCTEP application, or MSP430F5328TRGCTEP equivalent, key selection criteria include its –40°C to +105°C operation, LPM3 standby current of 1.9 µA at 3 V, 47 GPIOs in 64-pin VQFN (RGC), integrated power management with programmable LDO, and radiation-hardened EP-grade qualification per V62/13628-01XE.

Technical Context

The MSP430F5328TRGCTEP implements a unified clock system with FLL-based frequency stabilization, supporting up to 25 MHz system clock via XT2 (32 MHz max), DCO, REFO, and VLO sources. Its low-power architecture enables wake-up from LPM3 in 3.5 µs (typical) using ACLK or RTC-triggered interrupts.

Peripheral integration includes three-channel DMA for zero-CPU-overhead data movement between ADC, USCI, and memory; port mapping controller enabling dynamic reassignment of secondary functions on P4 pins; and hardware multiplier supporting 32-bit operations - all coordinated under a flexible power management system with programmable core voltage regulation.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture16-bit RISC CPU with constant generators, 16 general-purpose registers, and 25-MHz max system clock
Memory128 KB flash (with BSL and info segments), 10 KB RAM (8 KB + 2 KB), full in-system programmability
ADC12-bit SAR ADC with 200 KSPS, 12 channels (10 external + 2 internal), sample-and-hold, autoscan mode
TimersFour 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC with shadow registers)
CommunicationDual USCI_A (UART/IrDA/SPI) and dual USCI_B (I²C/SPI); supports simultaneous UART + I²C operation
Power ModesLPM3: 1.9 µA @ 2.2 V / 2.1 µA @ 3 V; LPM4: 1.1 µA @ 3 V; LPM4.5: 0.18 µA @ 3 V
Operating Range–40°C to +105°C; qualified per MIL-PRF-38535 Class V / Enhanced Product (EP) baseline

Pinout & Package

Package: 64-pin VQFN (RGC), 9 mm × 9 mm, 0.5 mm pitch, exposed thermal pad. Pinout conforms to TI SLAS954 pin assignment for RGC package with 47 GPIOs, 8 analog inputs (A0–A9), JTAG/Spy-Bi-Wire debug interface, and dedicated LDO input/output terminals (LDOI/LDOO).

Pin/Terminal Circuit Role Design Meaning
P1.0/TA0CLK/ACLKTimer/RTC clock I/OProvides ACLK output (divided by 1–32) or TA0 clock input; supports real-time clock calibration
P2.6/RTCCLK/DMAE0RTC/DMA triggerOutputs RTC clock signal for external synchronization; serves as DMA external event trigger
P3.0–P3.2USCI_B0 I²C interfaceConfigurable as I²C SDA/SCL/STE - enables direct connection to sensors and EEPROMs without level shifters
P5.4/XIN & P5.5/XOUTXT1 crystal oscillatorSupports 32.768 kHz watch crystal for precise RTC timing and ultra-low-power sleep modes
RST/NMI/SBWTDIOReset/debug bidirectionalActive-low reset input, NMI source, and Spy-Bi-Wire data I/O - enables single-wire firmware updates
LDOI / LDOOIntegrated LDO terminalsLDOI accepts 3.3 V ±10% input; LDOO delivers regulated 3.3 V core supply - eliminates external regulator

Key Features

Feature Design Value
Extended Temperature OperationRated for –40°C to +105°C with full parameter validation; meets V62/13628-01XE military-grade traceability
Ultra-Low-Power TimersFour independent 16-bit timers with capture/compare, PWM, and RTC integration - enables multi-sensor time-stamping
Reconfigurable Port MappingP4 pins support dynamic remapping of USCI_A1/USCI_B1 functions - simplifies PCB layout reuse across firmware variants
Hardware Acceleration32-bit hardware multiplier and three-channel DMA reduce CPU load during ADC-to-memory transfers and cryptographic routines
Robust Debug InterfaceSingle-wire Spy-Bi-Wire (SBW) and full 4-pin JTAG supported - allows in-circuit programming in space-constrained enclosures

Applications

Spacecraft Telemetry Node Industrial Data Logger

Use Scenario: Autonomous satellite subsystem collecting temperature, pressure, and radiation sensor data over extended orbital cycles.

IC Role / Device Role / Timing Role: Central controller managing sensor polling, RTC-synchronized timestamping, low-power sleep/wake scheduling, and RF packet formatting.

Use Value: LPM4.5 current of 0.18 µA extends battery life for multi-year missions; radiation-tolerant EP grade ensures reliability in high-SV environments.

Use Scenario: Ruggedized field instrument logging environmental parameters in remote oil/gas infrastructure with no mains power.

IC Role / Device Role / Timing Role: Host MCU acquiring analog sensor data via ADC autoscan, storing to flash with CRC integrity, and transmitting via UART to gateway.

Use Value: Integrated 3.3-V LDO enables single-supply operation from LiSOCl₂ batteries; 128 KB flash supports firmware updates and long-duration data buffering.

Smart Utility Meter Sensor Hub Medical Diagnostic Handheld

Use Scenario: Battery-powered smart meter concentrator aggregating gas/water flow readings and communicating via RS-485 or NB-IoT modem.

IC Role / Device Role / Timing Role: Real-time coordinator synchronizing sensor reads, managing communication handshakes, and enforcing secure boot via BSL password protection.

Use Value: Dual USCI modules allow concurrent UART (modem) and I²C (sensor hub) operation; LPM3 current of 2.1 µA enables >10-year battery life.

Use Scenario: Portable diagnostic device measuring ECG, SpO₂, and temperature with clinical-grade accuracy and USB charging.

IC Role / Device Role / Timing Role: Signal acquisition controller driving ADC with internal reference, performing real-time filtering, and managing USB CDC interface.

Use Value: 12-bit ADC with internal VREF+/VREF− and sample-and-hold achieves <1 LSB INL; 47 GPIOs support multi-channel electrode routing and LED indicators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixed-signal microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430F5329TRGCTEPSame package and pinout; adds 16 KB more flash (144 KB total) and 2 KB more RAM (12 KB total)Better suited for firmware with larger bootloader, OTA update stack, or extended data logging buffersSelect when code size exceeds 128 KB or additional RAM is required for complex state machines
MSP430F5438AIPZ80-pin LQFP; 256 KB flash, 16 KB RAM, same peripheral set but no EP qualification or extended temp ratingTargeted at commercial/industrial applications where radiation tolerance and –40°C to +105°C are not requiredChoose for cost-sensitive terrestrial designs needing higher memory density without EP-grade assurance

Compared with MSP430F5328TRGCTEP, the F5329TRGCTEP offers scalable memory headroom within identical footprint and qualification, while the F5438AIPZ trades EP robustness for higher capacity in non-mission-critical deployments - making the MSP430F5328TRGCTEP optimal for constrained, high-reliability edge nodes.

Availability

MSP430F5328TRGCTEP is available at Aetrix Electronics and suitable for spacecraft telemetry nodes, industrial data loggers, and smart utility meter sensor hubs requiring stable component supply across extended product lifecycles and harsh environmental conditions.

Supply support for MSP430F5328TRGCTEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of aerospace and defense component experience.

The MSP430F5328TRGCTEP belongs to TI's MSP430x5xx EP microcontroller family, designed specifically for high-reliability, ultra-low-power applications in extended-temperature and radiation-exposed environments such as space, avionics, and nuclear instrumentation.

FAQ

What is the operating temperature range of the MSP430F5328TRGCTEP?

The MSP430F5328TRGCTEP is rated for continuous operation from –40°C to +105°C and fully characterized across this range per MIL-PRF-38535 Class V requirements. Key parameters including LPM3 current (2.1 µA at 3 V), ADC performance, and timer accuracy are validated at both extremes, making it suitable for deployment in engine compartments, downhole tools, and low-earth-orbit satellites.

Does the MSP430F5328TRGCTEP include an integrated voltage regulator?

Yes, the MSP430F5328TRGCTEP integrates a fully programmable LDO that accepts 3.3 V ±10% on LDOI and delivers a stable 3.3 V core supply on LDOO. This eliminates the need for an external regulator, reduces BOM count, and improves power efficiency in battery-operated systems - especially critical in LPM3 and LPM4 modes where supply supervision remains active.

How many analog input channels does the MSP430F5328TRGCTEP support?

The MSP430F5328TRGCTEP supports 12 analog input channels: 10 external (A0–A9) and 2 internal (VeREF+ and VeREF−). The 12-bit ADC includes sample-and-hold, internal reference selection (1.5 V or 2.5 V), and autoscan mode - enabling sequential conversion of multiple sensors without CPU intervention, ideal for multi-parameter environmental monitoring.

What debug interfaces are supported by the MSP430F5328TRGCTEP?

The MSP430F5328TRGCTEP supports three debug interfaces: standard 4-pin JTAG (PJ.0–PJ.3 + TEST/SBWTCK + RST/NMI/SBWTDIO), two-wire Spy-Bi-Wire (RST/NMI/SBWTDIO + TEST/SBWTCK), and UART-based Bootstrap Loader (BSL) using P1.1/P1.2. All are accessible in the 64-pin RGC package and retain full functionality across the –40°C to +105°C range.

Is the MSP430F5328TRGCTEP pin-compatible with other MSP430F53xx devices?

Yes, the MSP430F5328TRGCTEP is pin-compatible with MSP430F5329TRGCTEP and MSP430F5319TRGCTEP in the 64-pin RGC package. All share identical pin functions, electrical characteristics, and thermal pad layout - enabling drop-in memory upgrades (e.g., 128 KB → 144 KB flash) without PCB redesign or firmware changes beyond linker script updates.

MSP430F5328TRGCTEP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
64-VFQFN Exposed Pad
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
10K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5328TRGCTEP FAQ

1.How can I place an order for MSP430F5328TRGCTEP through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F5328TRGCTEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F5328TRGCTEP reliable?

The price and inventory of MSP430F5328TRGCTEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5328TRGCTEP is usually 5 days.

3.What payment methods are accepted for MSP430F5328TRGCTEP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5328TRGCTEP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MSP430F5328TRGCTEP?

MSP430F5328TRGCTEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F5328TRGCTEP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5328TRGCTEP?

For technical support, including MSP430F5328TRGCTEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5328TRGCTEP requirements.

6.How does Aetrix verify that MSP430F5328TRGCTEP is sourced from the original manufacturer or authorized distributors?

All MSP430F5328TRGCTEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5328TRGCTEP meets industry standards.

7.What is the process for return or replacement of MSP430F5328TRGCTEP?

All MSP430F5328TRGCTEP units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5328TRGCTEP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5328TRGCTEP part is unused and in its original packaging.

Return procedure for MSP430F5328TRGCTEP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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