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Texas Instruments MSP430F5509IRGZR

Part No.:
MSP430F5509IRGZR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixMSP430F5509IRGZR.pdf
Description:
IC MCU 16BIT 24KB FLASH 48VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,131

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Product details

Overview

MSP430F5509IRGZR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller with integrated full-speed USB 2.0 PHY, 24 KB flash, 4 KB + 2 KB RAM, 10-bit ADC (6 external + 2 internal channels), two USCI modules (UART/IrDA/SPI/I²C), four 16-bit timers, RTC, hardware multiplier, and DMA - designed for battery-powered sensor systems and USB-connected data loggers.

For engineers reviewing the MSP430F5509IRGZR datasheet, MSP430F5509IRGZR pinout, MSP430F5509IRGZR application, or MSP430F5509IRGZR equivalent, key selection criteria include USB 2.0 host/device capability, sub-2 µA LPM3 current at 3 V, 48-pin VQFN (7 mm × 7 mm) package compatibility, and dual-USCI support for simultaneous UART + I²C or SPI interfaces in compact embedded designs.

Technical Context

The MSP430F5509IRGZR implements a unified clock system with FLL stabilization, programmable LDO core regulation, and flexible port mapping on P4 to route USCI_A1/USCI_B1 functions - enabling configurable peripheral pin assignment within the 48-pin RGZ footprint. Its USB subsystem integrates PHY, 3.3-V/1.8-V power system, and USB-PLL, eliminating external transceivers.

It supports three low-power modes optimized for real-time operation: LPM3 (1.9 µA, RTC active), LPM4 (1.1 µA, full RAM retention), and LPM4.5 (0.18 µA shutdown); wake-up from standby occurs in under 5 µs via multiple interrupt sources including timer, comparator, and USB events.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture 16-bit RISC CPU with constant generators and 25-MHz max system clock - enables efficient C code execution and deterministic real-time response.
Flash / RAM 24 KB flash (in-system programmable) + 4 KB main RAM + 2 KB USB SRAM - supports firmware updates and dual-bank buffering for USB data streaming.
USB Interface Full-speed USB 2.0 (12 Mbps) with integrated PHY, 8 IN/8 OUT endpoints, and dedicated USB-PLL - eliminates need for external USB transceiver or clock source.
ADC10_A 10-bit SAR ADC with 200 ksps sampling rate, 6 external + 2 internal input channels, and window comparator - suitable for multi-sensor analog monitoring without external signal conditioning.
Low-Power Modes LPM3: 1.9 µA @ 3 V (RTC + watchdog + full RAM); LPM4: 1.1 µA @ 3 V; LPM4.5: 0.18 µA - extends coin-cell battery life to years in periodic-sensing applications.
Timers & Peripherals Four 16-bit timers (TA0/TA1/TA2/TB0), three-channel DMA, RTC_A with alarm, and two USCI modules - enables concurrent timekeeping, PWM generation, serial communication, and data movement with minimal CPU load.
Supply Range 1.8 V to 3.6 V operation with integrated LDO - allows direct connection to single Li-ion, 2×AA, or regulated 3.3-V rails without external voltage translation.

Pinout & Package

VQFN-48 (RGZ) package, 7 mm × 7 mm body, 0.5-mm pitch, exposed thermal pad (recommended connection to DVSS).

Pin/Terminal Circuit Role Design Meaning
P1.0/TA0CLK/ACLK Port 1 bit 0 / Timer A0 clock input / Auxiliary clock Configurable as GPIO, timer clock source, or 32-kHz crystal oscillator output - critical for RTC synchronization and low-frequency timing.
P4.0–P4.5 Port 4 multiplexed USCI signals Supports USCI_A1 (UART/SPI) and USCI_B1 (I²C/SPI) via port mapping controller - enables dual-protocol serial connectivity on six pins with software-defined function routing.
PU.0/DP, PU.1/DM USB differential data pair Integrated full-speed USB physical layer interface - requires only 27-Ω series resistors and no external transceiver; PUR pin controls pull-up resistor for device enumeration.
RST/NMI/SBWTDIO Reset / Non-maskable interrupt / Spy-Bi-Wire debug I/O Single-pin 4-wire JTAG alternative for programming and debugging - reduces debug footprint and supports in-system firmware updates without dedicated debug header.
VCORE Core voltage supply Output of internal LDO; must be decoupled with 1-µF capacitor - provides stable 1.8-V core rail independent of DVCC, improving noise immunity and power efficiency.

Key Features

Feature Design Value
Ultra-low-power LPM3 1.9 µA at 3 V with RTC, watchdog, and full RAM retention - enables decade-scale operation on CR2032 batteries in environmental sensors.
Integrated USB 2.0 PHY Eliminates external transceiver and 48-MHz crystal; includes USB-PLL and dual-voltage (3.3 V/1.8 V) power system - reduces BOM count by ≥5 components and PCB area by >15 mm².
Port mapping controller Dynamic remapping of USCI functions to P4 pins - allows flexible serial interface configuration (e.g., UART + I²C simultaneously) without changing hardware layout.
Hardware multiplier (MPY32) 32-bit multiply-accumulate in ≤16 cycles - accelerates digital filtering, sensor calibration, and cryptographic operations without CPU intervention.
Three-channel DMA Enables autonomous data transfer between ADC, USB, RAM, and peripherals - frees CPU for application logic during high-throughput USB data streaming or burst-mode sensing.

Applications

USB-Powered Sensor Node Industrial Data Logger

Use Scenario: Compact, battery-backed environmental monitor that connects directly to PC or USB host for firmware updates and data retrieval.

IC Role / Device Role / Timing Role: Primary MCU with integrated USB device stack, ADC for temperature/humidity sensors, and RTC for timestamped logging.

Use Value: Eliminates external USB transceiver and crystal; 1.9 µA LPM3 extends 2×AA battery life beyond 5 years with hourly wake-ups.

Use Scenario: Ruggedized field logger capturing analog sensor data (vibration, pressure) and storing it locally before USB upload.

IC Role / Device Role / Timing Role: Real-time controller managing ADC sampling, circular buffer storage, RTC-based timestamps, and bulk USB transfers.

Use Value: Hardware DMA offloads 100% of ADC-to-USB data movement; 24 KB flash accommodates dual-application firmware images for fail-safe updates.

Wireless Headset Bridge Smart Energy Meter Interface

Use Scenario: Low-latency bridge between Bluetooth audio module and USB audio class host (e.g., PC or VoIP adapter).

IC Role / Device Role / Timing Role: USB audio device controller with UART interface to BT SoC, using USCI_A0 for command/control and USB for PCM stream.

Use Value: Sub-5 µs wake-up ensures <1-ms audio latency; integrated USB-PLL meets USB audio jitter requirements without external clock synthesis.

Use Scenario: Secure, tamper-resistant interface between metrology ASIC and utility host via USB for firmware validation and meter reading.

IC Role / Device Role / Timing Role: Trusted execution environment handling AES-128 encryption, secure boot, and USB HID-class commands for authenticated access.

Use Value: 24 KB flash stores crypto keys and secure bootloader; comparator and ADC monitor supply/voltage for tamper detection per ANSI C12.22.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430F5510IRGZR 32 KB flash, 47 I/O pins, same USB/peripheral set - differs only in memory size and pin count. Required when >24 KB application code or additional GPIOs needed for expansion headers or parallel interfaces. Select MSP430F5510IRGZR if future firmware growth or board-level scalability is prioritized over cost-sensitive 48-pin footprint.
MSP430F5508IRGZR 16 KB flash, identical 48-pin RGZ package, same USB/ADC/timer peripherals - direct pin-compatible drop-in replacement with reduced memory. Suitable for space-constrained designs where firmware fits in 16 KB and no additional flash headroom is required. Choose MSP430F5508IRGZR to reduce unit cost while retaining identical USB functionality, power profile, and PCB layout.

Compared with MSP430F5509IRGZR, MSP430F5510IRGZR offers 8 KB more flash and 16 extra I/Os for scalable designs, while MSP430F5508IRGZR provides identical USB performance and ultra-low-power operation at lower memory cost - both share the same VQFN-48 package and require no PCB changes.

Availability

MSP430F5509IRGZR is available at Aetrix Electronics and suitable for USB-connected sensor nodes, industrial data loggers, and wireless headset bridges requiring stable component supply across multi-year production cycles.

Supply support for MSP430F5509IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and system integration.

The MSP430F5509IRGZR belongs to TI's ultra-low-power MCU product line, engineered specifically for battery-operated measurement and USB-peripheral applications demanding sub-2 µA standby current and integrated connectivity.

FAQ

What USB speed and device class does the MSP430F5509IRGZR support?

The MSP430F5509IRGZR supports full-speed USB 2.0 (12 Mbps) as a device-only endpoint with integrated PHY and USB-PLL. It implements standard USB classes including CDC (virtual COM port), HID, and MSC through firmware - no external transceiver or clock source is required. The MSP430F5509IRGZR USB subsystem includes eight IN and eight OUT endpoints for flexible descriptor configuration.

Does the MSP430F5509IRGZR support crystal oscillators for precise timing?

Yes, the MSP430F5509IRGZR supports both low-frequency (32 kHz) watch crystals on XIN/XOUT (P5.4/P5.5) for RTC accuracy and high-frequency crystals up to 32 MHz on XT2IN/XT2OUT (P5.2/P5.3) for system clock precision. These crystals work with the integrated FLL to stabilize MCLK, SMCLK, and ACLK - enabling ±10 ppm timing accuracy in real-time applications. The MSP430F5509IRGZR also includes internal VLO and REFO for crystal-free operation.

How many analog input channels does the MSP430F5509IRGZR ADC support?

The MSP430F5509IRGZR features the ADC10_A module with six external analog inputs (A0–A5 on P6.0–P6.5) and two internal references (VeREF+ and VeREF− on P5.0/P5.1), totaling eight usable channels. It achieves 200 ksps sampling rate with built-in window comparator functionality - allowing threshold-triggered interrupts without CPU polling. This ADC configuration is confirmed in Table 3-1 and Section 1.3 of the SLAS645L datasheet for the MSP430F5509IRGZR.

What low-power modes are available on the MSP430F5509IRGZR and their typical currents?

The MSP430F5509IRGZR offers five low-power modes: LPM3 (1.9 µA @ 3 V, RTC active), LPM4 (1.1 µA @ 3 V, full RAM retention), and LPM4.5 (0.18 µA @ 3 V, shutdown). Active mode draws 195 µA/MHz at 8 MHz during flash execution. Wake-up from LPM3 to AM takes less than 5 µs. These values are measured and specified in Sections 1.1 and 5.5 of the MSP430F5509IRGZR datasheet.

Is the MSP430F5509IRGZR pin-compatible with other devices in the MSP430F55xx family?

Yes, the MSP430F5509IRGZR in the RGZ package is pin-compatible with MSP430F5510IRGZR, MSP430F5508IRGZR, MSP430F5507IRGZR, and MSP430F5504IRGZR - all share identical 48-pin VQFN footprints and pin functions. However, peripheral enablement varies: MSP430F5509IRGZR and MSP430F5510IRGZR support two USCI modules, while MSP430F5507IRGZR and MSP430F5504IRGZR support only one. The MSP430F5509IRGZR maintains full functional compatibility within its feature set.

MSP430F5509IRGZR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
48-VFQFN Exposed Pad
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
6K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5509IRGZR FAQ

1.How can I place an order for MSP430F5509IRGZR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F5509IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F5509IRGZR reliable?

The price and inventory of MSP430F5509IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5509IRGZR is usually 5 days.

3.What payment methods are accepted for MSP430F5509IRGZR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5509IRGZR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MSP430F5509IRGZR?

MSP430F5509IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F5509IRGZR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5509IRGZR?

For technical support, including MSP430F5509IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5509IRGZR requirements.

6.How does Aetrix verify that MSP430F5509IRGZR is sourced from the original manufacturer or authorized distributors?

All MSP430F5509IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5509IRGZR meets industry standards.

7.What is the process for return or replacement of MSP430F5509IRGZR?

All MSP430F5509IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5509IRGZR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5509IRGZR part is unused and in its original packaging.

Return procedure for MSP430F5509IRGZR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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