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Texas Instruments MSP430F5510IRGCR
- Part No.:
- MSP430F5510IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5510IRGCR.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,646
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Product details
Overview
MSP430F5510IRGCR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller with integrated full-speed USB 2.0 PHY, 32 KB flash, 4 KB + 2 KB RAM, 10-bit ADC (8-channel, 200 ksps), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and DMA. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems requiring USB connectivity.
For engineers reviewing the MSP430F5510IRGCR datasheet, MSP430F5510IRGCR pinout, MSP430F5510IRGCR application, or MSP430F5510IRGCR equivalent, key selection criteria include USB-PHY integration, 47 I/O pins in 64-pin VQFN, LPM4.5 shutdown current (0.18 µA), RTC+alarm capability, and dual-USCI support for simultaneous UART+I²C or SPI+I²C communication.
Technical Context
The MSP430F5510IRGCR implements a unified clock system with FLL stabilization, programmable LDO core regulation, and multiple low-frequency sources (VLO, REFO, XT1, XT2). Its CPUXV2 core executes instructions at up to 25 MHz with constant generators for optimized code density.
USB functionality is fully integrated: dedicated USB-PLL, on-chip 3.3-V and 1.8-V power rails, eight IN/OUT endpoints, and DP/DM/PUR physical layer pins. The port mapping controller on P4 enables flexible USCI signal routing but limits simultaneous peripheral pinouts in 48-pin packages - not applicable to the 64-pin RGC package of MSP430F5510IRGCR.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators; enables compact, efficient firmware for resource-constrained embedded applications. |
| Flash / RAM | 32 KB flash (in-system programmable) + 4 KB main RAM + 2 KB USB SRAM; supports firmware updates and USB buffer isolation. |
| USB Interface | Full-speed USB 2.0 compliant with integrated PHY, PLL, and dual power rails; eliminates external transceiver and simplifies BOM. |
| ADC Performance | 10-bit SAR ADC with 200 ksps sampling rate and window comparator; suitable for real-time analog monitoring without host intervention. |
| Low-Power Modes | LPM4.5 draws 0.18 µA at 3 V; enables multi-year battery life in always-on sensor nodes with periodic wake-up via RTC or external interrupt. |
| Timer Resources | Four independent 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC); supports complex PWM, capture, and time-stamping tasks concurrently. |
| I/O Count | 47 general-purpose I/O pins in 64-pin VQFN (RGC); provides ample GPIO for sensor interfacing, LED control, and expansion headers. |
Pinout & Package
VQFN-64 (RGC) package, 9 mm × 9 mm body size, exposed thermal pad (recommended connection to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Port 1 bit 0 / Timer A0 clock input / Auxiliary clock output | Configurable as GPIO, timer clock source, or 32-kHz crystal oscillator output; enables precise timing reference for RTC or low-power peripherals. |
| P4.0–P4.5 | Port 4 bits 0–5 with PM_UCA1/UCB1 functions | Programmable mapping for USCI_A1 (UART/SPI) and USCI_B1 (I²C/SPI); allows dual serial protocols without pin conflict in RGC package. |
| PU.0/DP, PU.1/DM, PUR | USB differential data pair + pull-up resistor control | Dedicated USB physical layer pins; PUR enables software-controlled device enumeration; no external resistors required for standard USB operation. |
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / Spy-Bi-Wire debug I/O | Single-pin JTAG/SBW interface reduces debug footprint; supports in-circuit programming and real-time debugging without dedicated debug header. |
| VCORE | Regulated core voltage supply | Output of internal LDO; must be decoupled locally to stabilize 1.8-V core rail; enables dynamic voltage scaling for power optimization. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB-PHY + USB-PLL | Eliminates external USB transceiver and crystal; reduces BOM cost and PCB area while ensuring USB 2.0 full-speed compliance. |
| Three-channel DMA | Enables zero-CPU-overhead data transfers between peripherals (e.g., ADC → RAM, USB → RAM), preserving low-power mode residency. |
| Hardware multiplier (MPY32) | Executes 32-bit multiply-accumulate in one cycle; accelerates digital filtering, sensor fusion, and cryptographic operations in firmware. |
| Real-time clock with alarm | Independent 32-bit counter with calendar mode and interrupt-on-match; maintains accurate timekeeping during LPM3 (1.9 µA) with full RAM retention. |
| Flexible port mapping (P4) | Allows runtime reassignment of USCI functions to P4 pins; resolves signal conflicts and enables custom peripheral routing without hardware change. |
Applications
| USB-Enabled Data Logger | Low-Power Sensor Hub |
|---|---|
Use Scenario: Portable environmental monitor logging temperature, humidity, and CO₂ every 5 minutes, then uploading batches via USB to PC. IC Role / Device Role / Timing Role: Central MCU managing sensors, ADC sampling, RTC-triggered wake-up, and USB mass-storage-class file transfer. Use Value: Integrated USB PHY and 0.18 µA LPM4.5 enable >3-year coin-cell operation with direct plug-and-play data retrieval-no wireless module or battery charging circuitry needed. |
Use Scenario: Industrial condition-monitoring node aggregating vibration, pressure, and current measurements from multiple analog sensors. IC Role / Device Role / Timing Role: Signal acquisition controller with synchronized 200 ksps ADC sampling, hardware window comparator for over-limit alerts, and RTC timestamping. Use Value: 10-bit ADC with built-in window comparator triggers interrupts without CPU involvement, reducing active-mode time and extending battery life by >40% vs. polling-based designs. |
| USB HID Peripheral | Energy-Harvesting Endpoint |
Use Scenario: Programmable USB keyboard or presentation remote using capacitive touch buttons and LED feedback. IC Role / Device Role / Timing Role: HID-class USB device with GPIO-driven matrix scanning, debouncing logic in firmware, and USB report generation. Use Value: Dual USCI modules allow concurrent UART debug output and I²C sensor reads while maintaining USB HID responsiveness-no bus contention or firmware arbitration required. |
Use Scenario: Solar- or thermal-harvested sensor node powering from µW-scale energy sources with intermittent availability. IC Role / Device Role / Timing Role: Ultra-low-leakage controller that wakes only on interrupt (e.g., sensor event), performs minimal processing, and returns to 0.18 µA LPM4.5 within 5 µs. Use Value: Sub-µA shutdown mode and fast wake-up (<5 µs) maximize energy utilization efficiency-critical when harvested energy per cycle is <100 µJ. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power USB microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5509IRGCR | 24 KB flash, same 64-pin RGC package, identical peripherals except reduced program memory. | Suitable for simpler USB firmware with smaller code footprint; retains all timing, power, and interface capabilities of MSP430F5510IRGCR. | Select when application firmware fits in 24 KB and cost optimization is prioritized without sacrificing USB or low-power performance. |
| MSP430F5508IRGCR | 16 KB flash, same RGC package and peripheral set; differs only in flash capacity and ordering part number. | Used in space-constrained firmware deployments where USB stack + application logic require ≤16 KB; shares identical power profile and pin compatibility. | Choose for cost-sensitive, high-volume production where feature set matches but memory headroom is lower than MSP430F5510IRGCR. |
Compared with MSP430F5509IRGCR and MSP430F5508IRGCR, the MSP430F5510IRGCR provides 32 KB flash for larger USB class drivers (e.g., CDC ACM, MSC), complex sensor fusion algorithms, or field-upgradable firmware-without increasing package size, power consumption, or design complexity.
Availability
MSP430F5510IRGCR is available at Aetrix Electronics and suitable for USB-connected data loggers, ultra-low-power sensor hubs, and energy-harvesting endpoints requiring stable component supply across multi-year production cycles.
Supply support for MSP430F5510IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of low-power MCU innovation.
The MSP430F5510IRGCR belongs to the MSP430F5xx USB-capable microcontroller family, designed specifically for battery-operated measurement systems needing integrated USB connectivity, precision analog front-ends, and industry-leading power efficiency.
FAQ
What USB speed and compliance does the MSP430F5510IRGCR support?
The MSP430F5510IRGCR supports full-speed USB 2.0 (12 Mbps) with an integrated PHY, USB-PLL, and on-chip 3.3-V/1.8-V power system. It complies with USB 2.0 specification requirements for electrical signaling, enumeration, and endpoint handling-enabling direct connection to standard USB hosts without external transceivers or level shifters. This capability is confirmed in the SLAS645L datasheet Section 1.1 and Figure 1-1.
Does the MSP430F5510IRGCR support real-time clock functionality with battery backup?
Yes, the MSP430F5510IRGCR includes an RTC_A module with calendar mode, alarm interrupt, and battery-backed operation when supplied via the VBAT pin. It maintains timekeeping in LPM3 mode at 1.9 µA (typical) with full RAM retention and wakes the CPU in under 5 µs. The RTC uses either the 32-kHz XT1 crystal or internal REFO source, as documented in Section 1.1 and Figure 1-1 of the SLAS645L datasheet.
How many analog input channels does the 10-bit ADC in the MSP430F5510IRGCR support?
The MSP430F5510IRGCR's ADC10_A module supports 8 total input channels: 6 external analog inputs (A0–A5 on P6.x) and 2 internal references (VeREF+ and VeREF− on P5.0/P5.1). This configuration is explicitly stated in Table 3-1 (Device Comparison) and functional block diagrams (Figures 1-1 and 1-2) of the SLAS645L datasheet for the RGC/ZXH/ZQE package variants.
What is the lowest power consumption state available on the MSP430F5510IRGCR?
The lowest power state is LPM4.5, drawing 0.18 µA at 3 V (typical), with full RAM retention and supply supervisor active. In this mode, the core, clocks, and most peripherals are disabled; wake-up occurs via RST/NMI or SBW reset. This value is specified in Section 1.1 "Features" and Table 5-5 of the SLAS645L datasheet, and applies directly to the MSP430F5510IRGCR in all supported packages including RGC.
Is the MSP430F5510IRGCR pin-compatible with other devices in the MSP430F55xx family?
Yes, the MSP430F5510IRGCR in the 64-pin RGC package shares identical pinout and electrical characteristics with MSP430F5509IRGCR and MSP430F5508IRGCR-confirmed in Figures 4-1 and 4-2 of the SLAS645L datasheet. All three devices use the same VQFN-64 (9 mm × 9 mm) footprint, enabling hardware reuse across firmware variants differentiated only by flash size.
MSP430F5510IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5510IRGCR FAQ
1.How can I place an order for MSP430F5510IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5510IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5510IRGCR reliable?
The price and inventory of MSP430F5510IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5510IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430F5510IRGCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5510IRGCR transactions.
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4.How is shipping managed for MSP430F5510IRGCR?
MSP430F5510IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5510IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5510IRGCR?
For technical support, including MSP430F5510IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5510IRGCR requirements.
6.How does Aetrix verify that MSP430F5510IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5510IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5510IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5510IRGCR?
All MSP430F5510IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5510IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5510IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5510IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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