Texas Instruments MSP430F5510IRGCT
- Part No.:
- MSP430F5510IRGCT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5510IRGCT.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 64VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:580
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F5510IRGCT from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller with integrated full-speed USB 2.0 PHY, 32 KB flash, 4 KB + 2 KB RAM, 10-bit ADC (200 ksps, 8 channels), dual USCI modules (UART/IrDA/SPI/I²C), four 16-bit timers, RTC, and hardware multiplier. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems requiring USB connectivity and precise timing.
For engineers reviewing the MSP430F5510IRGCT datasheet, MSP430F5510IRGCT pinout, MSP430F5510IRGCT application, or MSP430F5510IRGCT equivalent, key selection criteria include USB PHY integration, 47 I/O count in 64-pin VQFN, LPM4.5 shutdown current (0.18 µA), RTC alarm capability, and port-mapped USCI flexibility on P4 for embedded host interface design.
Technical Context
The MSP430F5510IRGCT implements a unified clock system with FLL stabilization, dual crystal oscillators (XT1 up to 32 kHz, XT2 up to 32 MHz), VLO and REFO internal sources, and programmable LDO core regulation. Its CPUXV2 core supports 25-MHz operation with constant generators for optimized code density.
Peripherals are organized around three-channel DMA, port mapping controller (PMC) for dynamic USCI signal routing on P4, and independent power domains (DVCC/AVCC/VUSB/V18) enabling selective peripheral activation. The USB subsystem includes integrated 3.3-V/1.8-V regulators, USB-PLL, and eight bidirectional endpoints - all managed without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators; enables compact, deterministic firmware for real-time sensor processing. |
| Flash / RAM | 32 KB flash (in-system programmable) + 4 KB main RAM + 2 KB USB SRAM; USB SRAM usable as general-purpose RAM when USB inactive. |
| USB Interface | Full-speed (12 Mbps) USB 2.0 with integrated PHY, PLL, and dual-voltage power system; eliminates external transceiver and voltage translators. |
| ADC Performance | 10-bit SAR ADC at 200 ksps with 8 input channels (6 external, 2 internal); includes window comparator for autonomous threshold monitoring. |
| Low-Power Modes | LPM4.5 draws 0.18 µA at 3 V; wake-up from LPM3 in <5 µs; RTC + watchdog + supervisor active in standby with full RAM retention. |
| Timer Resources | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers); supports PWM, capture, and interval timing with DMA trigger capability. |
| I/O Count & Flexibility | 47 GPIO pins in 64-pin VQFN (RGC); USCI functions dynamically mapped to P4 via port mapping controller - no fixed pinout constraints. |
Pinout & Package
VQFN package with 64 pins, 9 mm × 9 mm body size, exposed thermal pad (recommended connection to DVSS). Pinout conforms to TI's RGC mechanical standard (SLAS645L, Figure 4-1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Primary timer clock / auxiliary low-frequency clock input | Accepts external 32.768-kHz crystal or digital clock; feeds ACLK domain for RTC and low-power peripherals. |
| P5.4/XIN & P5.5/XOUT | XT1 oscillator terminals | Supports 32.768-kHz watch crystal; essential for RTC accuracy and low-power sleep mode timing. |
| PU.0/DP & PU.1/DM | USB differential data pair | Direct full-speed USB physical layer interface; requires no external termination or ESD protection diodes per TI design guidelines. |
| PUR | USB pull-up resistor control | Internal 1.5-kΩ pull-up to VBUS enables USB device enumeration; controlled by software for attach/detach signaling. |
| RST/NMI/SBWTDIO | Reset / non-maskable interrupt / debug I/O | Single-pin multifunction interface for reset assertion, NMI event detection, and Spy-Bi-Wire programming/debug access. |
| VCORE | Core voltage supply | Output of integrated LDO; supplies regulated 1.8 V to CPU and digital logic; voltage level programmable via PMM registers. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB 2.0 PHY + power system | Eliminates external USB transceiver, 3.3-V regulator, and 1.8-V LDO - reduces BOM count and PCB area by ≥5 components. |
| Port mapping controller (PMC) | Enables runtime reassignment of USCI_A1/USCI_B1 signals to any of eight P4 pins - simplifies layout and supports multiple interface configurations from one PCB. |
| Three-channel DMA | Offloads CPU during ADC conversions, USB transfers, and timer captures - enables zero-wait-state data movement while CPU remains in LPM3. |
| Programmable LDO with VCORE output | Adjusts core voltage between 1.8 V and 2.2 V to trade performance vs. power; supports dynamic voltage scaling for burst-mode execution. |
| RTC with alarm and calibration | Hardware real-time clock runs independently in LPM3/LPM4; alarm interrupt wakes CPU; ±2 ppm calibration register compensates crystal drift. |
Applications
| USB-Powered Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-backed environmental monitor connects directly to PC or industrial gateway via USB for firmware updates and bulk data upload. IC Role / Device Role / Timing Role: MSP430F5510IRGCT acts as sensor hub, USB device controller, and real-time data aggregator with RTC timestamping. Use Value: Integrated USB PHY and 0.18 µA LPM4.5 enable multi-year battery life with periodic USB wake-up; 200 ksps ADC supports high-resolution analog sensing. |
Use Scenario: Standalone logger records temperature, humidity, and vibration in remote equipment cabinets, storing data to external SPI flash. IC Role / Device Role / Timing Role: MSP430F5510IRGCT serves as master controller with RTC-driven sampling intervals and USB mass-storage-class interface for data retrieval. Use Value: Dual USCI modules allow concurrent SPI flash communication and USB data transfer; 47 GPIO support multi-sensor parallel interfacing. |
| USB HID Peripheral | Low-Power USB Bridge |
Use Scenario: Wireless headset base station translates Bluetooth LE commands into USB HID reports for PC gaming or conferencing software. IC Role / Device Role / Timing Role: MSP430F5510IRGCT implements USB HID class descriptor and handles real-time packet translation with minimal latency. Use Value: Hardware multiplier accelerates encryption/decryption; USCI_A0 UART interfaces to BT module at 1 Mbps; LPM3 maintains readiness with 1.9 µA current. |
Use Scenario: Legacy RS-232 or I²C sensor connects to modern USB host via compact adapter board with no external level shifters. IC Role / Device Role / Timing Role: MSP430F5510IRGCT functions as protocol bridge - converting UART/I²C frames to USB CDC or vendor-specific class packets. Use Value: Port mapping controller allows flexible pin assignment for mixed-protocol routing; integrated VBUS sensing enables automatic plug-detection and power management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller-with-USB applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5529IPN | 64-pin LQFP package; identical peripheral set but higher 16-KB RAM (6 KB + 2 KB USB SRAM); same 32 KB flash and USB PHY. | Preferred where PCB layout favors LQFP over VQFN or where additional RAM is required for complex USB descriptors or buffering. | Select MSP430F5529IPN if board space allows larger footprint and firmware requires >4 KB main RAM; pinout differs - not drop-in compatible. |
| MSP430F5638IZQW | 80-pin nFBGA (5 mm × 5 mm); adds LCD controller and enhanced DMA; same USB, ADC, and timer resources; 256 KB flash. | Suitable for human-interface devices with segment LCD display; higher flash supports bootloader + application separation. | Choose MSP430F5638IZQW only when LCD driving or >32 KB code storage is mandatory; package and pinout incompatible with MSP430F5510IRGCT. |
Compared with MSP430F5529IPN and MSP430F5638IZQW, the MSP430F5510IRGCT delivers optimal balance of USB integration, ultra-low-power operation, and compact 64-pin VQFN packaging - making it ideal for space-constrained, battery-operated USB peripherals where RAM demand stays within 4 KB.
Availability
MSP430F5510IRGCT is available at Aetrix Electronics and suitable for USB sensor nodes, industrial data loggers, HID peripherals, and low-power USB bridges requiring stable component supply across production lifecycles.
Supply support for MSP430F5510IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with decades of leadership in ultra-low-power microcontrollers.
The MSP430F5510IRGCT belongs to the MSP430F5xx USB-capable microcontroller family, designed specifically for energy-sensitive applications requiring native USB device functionality without external PHY components.
FAQ
What USB speed and device class support does the MSP430F5510IRGCT provide?
The MSP430F5510IRGCT supports full-speed USB 2.0 (12 Mbps) as a device-only endpoint with integrated PHY, PLL, and dual-voltage regulators. It does not support USB host or OTG modes. TI provides USB stack libraries for CDC, HID, and MSC classes - all fully compatible with the MSP430F5510IRGCT's eight bidirectional endpoints and DMA-accelerated transfers.
Does the MSP430F5510IRGCT require external crystals for USB operation?
No - the MSP430F5510IRGCT uses its internal USB-PLL locked to the high-frequency XT2 oscillator (up to 32 MHz) for USB timing; an external crystal on XT2 is required for USB compliance, but no separate USB-specific crystal is needed. The 32.768-kHz XT1 crystal is optional and used only for RTC accuracy or low-power clocking, not USB functionality.
How many I/O pins are available on the MSP430F5510IRGCT in its RGC package?
The MSP430F5510IRGCT in the 64-pin VQFN (RGC) package provides 47 general-purpose I/O pins. All pins support configurable drive strength, Schmitt-trigger inputs, and interrupt capability. USCI functions are routed dynamically via the port mapping controller on P4, allowing flexible peripheral pin assignment without hardware redesign.
What is the lowest power consumption state supported by the MSP430F5510IRGCT?
The MSP430F5510IRGCT achieves 0.18 µA in LPM4.5 (shutdown mode) at 3 V with VCORE powered down and only the RST/NMI pin active. This mode retains no RAM but offers fastest wake-up among deepest sleep states. For full RAM retention with lowest active current, LPM3 draws 1.9 µA at 2.2 V with RTC, watchdog, and supply supervision enabled.
Can the MSP430F5510IRGCT operate without an external debugger interface?
Yes - the MSP430F5510IRGCT supports in-system programming via its built-in bootloader (BSL) using UART or USB, eliminating the need for JTAG or Spy-Bi-Wire hardware during field firmware updates. However, JTAG/SBW (via RST/NMI and TEST/SBWTCK pins) remains available for full-featured debugging and boundary-scan testing during development.
MSP430F5510IRGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5510IRGCT FAQ
1.How can I place an order for MSP430F5510IRGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5510IRGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5510IRGCT reliable?
The price and inventory of MSP430F5510IRGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5510IRGCT is usually 5 days.
3.What payment methods are accepted for MSP430F5510IRGCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5510IRGCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5510IRGCT?
MSP430F5510IRGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5510IRGCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5510IRGCT?
For technical support, including MSP430F5510IRGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5510IRGCT requirements.
6.How does Aetrix verify that MSP430F5510IRGCT is sourced from the original manufacturer or authorized distributors?
All MSP430F5510IRGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5510IRGCT meets industry standards.
7.What is the process for return or replacement of MSP430F5510IRGCT?
All MSP430F5510IRGCT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5510IRGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5510IRGCT part is unused and in its original packaging.
Return procedure for MSP430F5510IRGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F5510IRGCT Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

