Texas Instruments MSP430F5513IRGCT
- Part No.:
- MSP430F5513IRGCT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5513IRGCT.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 64VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,662
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F5513IRGCT from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with integrated USB 2.0 PHY, four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and 3-channel DMA. It operates from 1.8 V to 3.6 V, draws 1.4 µA in LPM3 standby with VLO active, and wakes in 3.5 µs-ideal for battery-powered USB-connected sensor nodes and portable data loggers.
For engineers reviewing the MSP430F5513IRGCT datasheet, MSP430F5513IRGCT pinout, MSP430F5513IRGCT application, or MSP430F5513IRGCT equivalent, key selection criteria include its 47 I/O count, 32 KB Flash / 4 KB + 2 KB RAM memory map, VQFN-64 package, USB-capable peripheral set, and verified low-power mode current specs across LPM3/LPM4/LPM4.5.
Technical Context
The MSP430F5513IRGCT implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system featuring FLL stabilization, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power management includes an integrated LDO with programmable core voltage, SVS/SVM monitoring, and brownout reset.
Peripherals are mapped via port-select registers and support flexible signal routing: USCI_A0/A1 provide UART/IrDA/SPI; USCI_B0/B1 support I²C/SPI; USB module integrates PHY, PLL, 3.3-V/1.8-V power system, and eight endpoints; Timer_B0 offers seven capture/compare shadow registers for precise PWM and event timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators and 3.5 µs wake-up from LPM3 |
| Flash / RAM | 32 KB Flash + 4 KB + 2 KB RAM - supports in-system programming without external voltage |
| USB Interface | Full-speed USB 2.0 with integrated PHY, PLL, and dual-voltage (3.3 V/1.8 V) power system |
| Low-Power Modes | LPM3: 1.4 µA @ 3.0 V (VLO active); LPM4: 1.1 µA @ 3.0 V; LPM4.5: 0.18 µA @ 3.0 V |
| Timers | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow) |
| USCI Modules | Two USCI blocks: USCI_Ax (UART/IrDA/SPI), USCI_Bx (I²C/SPI) |
| I/O Count | 47 general-purpose I/O pins with configurable drive strength and Schmitt-trigger inputs |
Pinout & Package
VQFN-64 (RGC) package, 9 mm × 9 mm body, 0.5 mm pitch, wettable flank design for optical solder inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Active-low reset with internal pullup; doubles as SBWTDIO for Spy-Bi-Wire debug |
| DP / DM | USB differential data pair | Full-speed USB 2.0 physical interface; requires 27 Ω series resistors per TI layout guidelines |
| PUR | USB pullup resistor control | Drives internal 1.5 kΩ pullup on DP to signal USB device attachment to host |
| XIN / XOUT | Low-frequency crystal oscillator terminals | Supports 32.768 kHz watch crystal for RTC operation in LPM3 |
| XT2IN / XT2OUT | High-frequency crystal oscillator terminals | Supports up to 32 MHz crystal or external clock source for system clock generation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB PHY & power system | Eliminates need for external transceiver or LDOs-reduces BOM count and PCB area for USB device designs |
| Programmable LDO core regulator | Enables dynamic core voltage scaling to match performance needs and minimize active-mode current |
| FLL-based clock stabilization | Automatically locks DCO to reference sources (XT1, XT2, REFO, VLO) without software intervention |
| Hardware multiplier (MPY32) | Executes 32-bit multiply-accumulate in single cycle-accelerates filtering, FFT, and sensor fusion algorithms |
| RTC with alarm and calibration | Retains timekeeping in LPM3 using 32-kHz crystal; supports periodic interrupts and temperature-compensated calibration |
Applications
| USB-Powered Sensor Node | Portable Data Logger |
|---|---|
Use Scenario: Compact environmental monitor powered directly from USB bus, logging temperature/humidity/pressure at 1 Hz intervals with local storage and host upload. IC Role / Device Role / Timing Role: Main system controller executing sensor acquisition, RTC-timed sampling, USB mass-storage-class file writes, and low-power state orchestration. Use Value: LPM3 current of 1.4 µA extends battery life >1 year on coin cell when USB not connected; integrated USB PHY enables direct host communication without level shifters or transceivers. | Use Scenario: Handheld industrial logger capturing analog/digital sensor data over hours/days, with USB-triggered dump and firmware updates. IC Role / Device Role / Timing Role: Central MCU managing ADC sampling, timestamping via RTC_A, flash write wear leveling, and USB CDC/DFU class enumeration. Use Value: 32 KB Flash stores >100k samples; 47 GPIO support multiple sensor interfaces (I²C, SPI, analog); 3.5 µs wake-up ensures responsive host command handling. |
| Energy-Harvesting Edge Device | USB-Capable Industrial Controller |
Use Scenario: Solar- or thermal-harvested node performing local inference and transmitting results via USB upon host request. IC Role / Device Role / Timing Role: Ultra-low-power host-resident controller running lightweight ML model, synchronizing with RTC, and entering LPM4.5 between tasks. Use Value: 0.18 µA shutdown current minimizes leakage during energy scarcity; USB enumeration occurs within 100 ms of host connection. | Use Scenario: DIN-rail mounted controller interfacing with RS-485 fieldbus and exposing configuration via USB virtual COM port. IC Role / Device Role / Timing Role: Dual-role controller handling Modbus RTU over USCI_A0 and USB CDC over integrated PHY. Use Value: Two independent USCI modules allow concurrent serial and USB operation; 47 I/O support opto-isolated bus drivers and status LEDs without external expanders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power USB microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5514IRGCT | Same package, identical peripheral set, but 64 KB Flash / 4 KB + 2 KB RAM | Supports larger firmware images and more complex USB descriptors or protocol stacks | Select when firmware size exceeds 32 KB or future scalability is required |
| MSP430F5529IPN | 80-pin LQFP, 128 KB Flash / 8 KB + 2 KB RAM, 63 I/O, includes 12-bit ADC12_A | Required for designs needing analog sensing (e.g., battery voltage monitoring) alongside USB connectivity | Choose only if ADC functionality is mandatory; otherwise, MSP430F5513IRGCT offers lower cost and smaller footprint |
Compared with MSP430F5514IRGCT, the MSP430F5513IRGCT trades Flash capacity for cost and density; versus MSP430F5529IPN, it omits the ADC and reduces I/O count and package size-making it optimal for digital-only, space-constrained USB peripherals where minimal BOM and power are critical.
Availability
MSP430F5513IRGCT is available at Aetrix Electronics and suitable for USB-connected sensor nodes, portable data loggers, and energy-harvesting edge devices requiring stable component supply across production lifecycles.
Supply support for MSP430F5513IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The MSP430F55xx product line targets ultra-low-power USB-enabled applications, emphasizing rapid wake-up, extended battery life, and integrated system-level functions-including USB PHY, LDO, and real-time clock-to reduce external component count in portable measurement systems.
FAQ
What is the maximum system clock frequency supported by the MSP430F5513IRGCT?
The MSP430F5513IRGCT supports a maximum system clock frequency of 25 MHz, achieved via the FLL locking the DCO to high-frequency sources such as XT2 (up to 32 MHz crystal or external clock). This frequency is validated across the full operating voltage range (1.8 V to 3.6 V) and ambient temperature range (–40°C to 85°C), enabling deterministic real-time execution for time-critical USB and sensor tasks in the MSP430F5513IRGCT.
Does the MSP430F5513IRGCT include an analog-to-digital converter (ADC)?
No, the MSP430F5513IRGCT does not include an ADC. Unlike the MSP430F552x series, the MSP430F551x family-including the MSP430F5513IRGCT-omits the 12-bit ADC12_A module. This is confirmed in the device comparison tables and functional block diagrams (Figure 4-4), which show no ADC block for RGC-packaged MSP430F5513IRGCT. Designers requiring analog sensing must select an alternative part such as MSP430F5529IPN.
What USB speed and compliance level does the MSP430F5513IRGCT support?
The MSP430F5513IRGCT supports full-speed USB 2.0 (12 Mbps) with integrated PHY, meeting USB 2.0 specification requirements for device-side operation. It implements all necessary electrical signaling, endpoint management (eight total: four IN, four OUT), and protocol handling-including suspend/resume, SOF tracking, and descriptor responses-without external components. The MSP430F5513IRGCT's USB subsystem is fully compliant when used with TI's recommended layout and termination.
How many general-purpose I/O pins does the MSP430F5513IRGCT provide?
The MSP430F5513IRGCT provides 47 general-purpose I/O pins, as specified in the device description and confirmed in Figure 4-4 (functional block diagram) and Section 7 (Terminal Configuration). These are distributed across Ports P1–P6 with configurable pullup/pulldown, drive strength, and interrupt capability. This I/O count is consistent across all RGC-packaged MSP430F551x variants, including the MSP430F5513IRGCT.
What low-power modes are available on the MSP430F5513IRGCT, and what is the lowest current draw?
The MSP430F5513IRGCT supports five low-power modes: LPM0–LPM4 plus LPM4.5. The lowest operational current is 0.18 µA in LPM4.5 (shutdown mode) at 3.0 V, with full RAM retention and supply supervisor active. In LPM3 (real-time clock mode with VLO), it draws 1.4 µA at 3.0 V-enabling years of operation on small batteries. All values are measured and published in Section 8.5 of the official datasheet for the MSP430F5513IRGCT.
MSP430F5513IRGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5513IRGCT FAQ
1.How can I place an order for MSP430F5513IRGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5513IRGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5513IRGCT reliable?
The price and inventory of MSP430F5513IRGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5513IRGCT is usually 5 days.
3.What payment methods are accepted for MSP430F5513IRGCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5513IRGCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5513IRGCT?
MSP430F5513IRGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5513IRGCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5513IRGCT?
For technical support, including MSP430F5513IRGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5513IRGCT requirements.
6.How does Aetrix verify that MSP430F5513IRGCT is sourced from the original manufacturer or authorized distributors?
All MSP430F5513IRGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5513IRGCT meets industry standards.
7.What is the process for return or replacement of MSP430F5513IRGCT?
All MSP430F5513IRGCT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5513IRGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5513IRGCT part is unused and in its original packaging.
Return procedure for MSP430F5513IRGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F5513IRGCT Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

