Texas Instruments MSP430F5514IRGCR

Overview

MSP430F5514IRGCR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with integrated USB 2.0 PHY, four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and 3-channel DMA. It features 64 KB flash, 6 KB + 2 KB RAM, 47 GPIO pins, and operates from 1.8 V to 3.6 V. It targets USB-connected sensor nodes and portable data loggers requiring fast wake-up (3.5 µs) and sub-2 µA LPM3 current.

For engineers reviewing the MSP430F5514IRGCR datasheet, MSP430F5514IRGCR pinout, MSP430F5514IRGCR application, or MSP430F5514IRGCR equivalent, key selection criteria include USB PHY integration, 47-pin VQFN package compatibility, LPM3 standby current at 2.2 V/3.0 V, RTC+watch crystal support, and absence of integrated 12-bit ADC (unlike F552x variants).

Technical Context

The MSP430F5514IRGCR implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system featuring FLL stabilization, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power management includes programmable LDO core regulation, SVS/SVM supervision, and brownout reset.

Peripherals are mapped via port-select registers (P1–P6), with USB functionality routed exclusively to DP/DM/PUR pins and supported by dedicated USB-LDO, USB-PLL, and endpoint control logic. Timer_B0 provides seven capture/compare shadow registers for precise PWM or event timing in battery-constrained systems.

Key Specifications

Pinout & Package

VQFN-64 (RGC) package, 9 mm × 9 mm body size, 0.5 mm pitch, exposed thermal pad. Pin mapping validated per TI SLAS590P Figure 7-5 (64-pin RGC pin diagram) and Section 7.2 signal descriptions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power USB microcontroller applications.

Compared with MSP430F5529IPN and MSP430F5515IPN, the MSP430F5514IRGCR offers optimal balance of USB integration, compact VQFN-64 packaging, and 47 GPIO - making it ideal for space-constrained, battery-powered USB peripherals where on-chip ADC is unnecessary.

Availability

MSP430F5514IRGCR is available at Aetrix Electronics and suitable for USB-connected sensor nodes, portable data loggers, and diagnostic tools requiring stable component supply and long-term lifecycle support.

Supply support for MSP430F5514IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in low-power design.

The MSP430F55xx product line delivers ultra-low-power mixed-signal MCUs optimized for battery-operated USB peripherals, sensor systems, and portable instrumentation requiring extended runtime and rapid wake-up response.

FAQ

Does MSP430F5514IRGCR include an integrated 12-bit analog-to-digital converter?

No, the MSP430F5514IRGCR does not include an integrated 12-bit ADC. Unlike the MSP430F552x series, the MSP430F551x family (including MSP430F5514IRGCR) omits the ADC12_A module. Designers requiring analog sensing must use external ADCs or select an F552x variant such as MSP430F5529IPN. This omission reduces die size and power in USB-focused applications where analog inputs are handled externally.

What is the package type and thermal pad configuration for MSP430F5514IRGCR?

The MSP430F5514IRGCR uses a 64-pin VQFN package (RGC suffix) with 9 mm × 9 mm body size and 0.5 mm pitch. It includes an exposed thermal pad centered on the underside, which must be soldered to a PCB copper pour for thermal dissipation and electrical grounding. TI recommends connecting the thermal pad to DVSS using multiple vias to minimize junction temperature rise during sustained USB or timer operation.

Can MSP430F5514IRGCR operate from a single 3.3-V supply without level shifting?

Yes, the MSP430F5514IRGCR supports single-supply operation from 3.3 V applied to DVCC and AVCC, with internal LDO regulating VCORE to ~1.45 V. All I/O pins are 3.3-V tolerant (with Schmitt-trigger inputs), and the integrated USB-PHY operates natively at 3.3 V for DP/DM signaling - eliminating need for external level shifters in standard USB 2.0 full-speed designs.

How many USB endpoints does MSP430F5514IRGCR support, and what types are available?

The MSP430F5514IRGCR supports eight USB endpoints: one control endpoint (EP0) and seven configurable IN/OUT endpoints (EP1–EP7). Endpoint types include bulk, interrupt, and isochronous - programmable via USBADDR, USBIEP, and USBCTL registers. This enables simultaneous HID keyboard, CDC ACM, and vendor-specific interface implementations without external USB controller logic.

Is MSP430F5514IRGCR compatible with the MSP430F5529 LaunchPad development kit?

No, the MSP430F5514IRGCR is not directly compatible with the MSP-EXP430F5529LP LaunchPad due to differences in pin count (64 vs. 80), package type (VQFN vs. LQFP), and missing ADC/peripheral features. However, TI's MSP-TS430RGC64USB 64-pin target board is specifically designed for RGC-package devices like MSP430F5514IRGCR and supports JTAG/SBW debugging, power measurement, and USB signal routing.