Texas Instruments MSP430F5514IRGCT

Overview

MSP430F5514IRGCT from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with integrated USB 2.0 PHY, four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/I²C/SPI), RTC, hardware multiplier, and 3-channel DMA. It operates from 1.8 V to 3.6 V, achieves 1.4 µA standby (LPM3) at 3.0 V, and supports USB-connected sensor data loggers requiring low-power host interface and real-time timestamping.

For engineers reviewing the MSP430F5514IRGCT datasheet, MSP430F5514IRGCT pinout, MSP430F5514IRGCT application, or MSP430F5514IRGCT equivalent, key selection criteria include USB 2.0 PHY integration, 47 I/O pins in 64-pin VQFN, LPM3/LPM4 current specs, RTC+USB coexistence, and absence of integrated 12-bit ADC (unlike F552x variants).

Technical Context

The MSP430F5514IRGCT implements a 16-bit RISC CPU with constant generators and digitally controlled oscillator (DCO), enabling 3.5 µs wake-up from LPM3. Its unified clock system integrates FLL, REFO, VLO, XT1 (32 kHz), and XT2 (up to 32 MHz), supporting precise USB timing via dedicated USB-PLL and internal 3.3-V/1.8-V USB power system.

Power management includes a programmable LDO core regulator, supply voltage supervisor (SVS), brownout reset (BOR), and five low-power modes (LPM0–LPM4.5). The device lacks ADC12_A but retains COMP_B (8-channel comparator), CRC16 engine, and EEM (enhanced erase module) for flash security.

Key Specifications

Pinout & Package

Package: 64-pin VQFN (RGC), 9 mm × 9 mm body, 0.5 mm pitch, exposed thermal pad. RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power USB MCU applications.

Compared with MSP430F5529IPN and STM32L073RZT6, the MSP430F5514IRGCT delivers the lowest LPM3/LPM4 currents and integrated USB PHY in a compact 64-pin VQFN-critical for space-constrained, long-life USB peripherals where analog conversion is handled externally.

Availability

MSP430F5514IRGCT is available at Aetrix Electronics and suitable for USB-connected sensor nodes, industrial data loggers, and portable medical monitors requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for MSP430F5514IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in low-power design.

The MSP430F55xx family targets ultra-low-power USB-enabled applications, emphasizing rapid wake-up, integrated power management, and minimal external components for battery-operated measurement and interface devices.

FAQ

Does the MSP430F5514IRGCT include an integrated 12-bit analog-to-digital converter (ADC)?

No, the MSP430F5514IRGCT does not include the ADC12_A module. This distinguishes it from the MSP430F552x series (e.g., MSP430F5529), which integrate a 12-bit, 200-ksps ADC with autoscan. The MSP430F5514IRGCT retains the 8-channel Comparator_B for basic threshold detection but relies on external ADCs or sensor ICs with digital outputs for precision analog acquisition. This simplifies the die and reduces cost for USB-centric applications where analog sensing is secondary.

What is the package type and thermal characteristics of the MSP430F5514IRGCT?

The MSP430F5514IRGCT uses a 64-pin VQFN (RGC) package with a 9 mm × 9 mm body and 0.5 mm pitch. Its thermal resistance (θ_JA) is 31.2°C/W under standard JEDEC 2-layer board conditions, and θ_JC is 5.5°C/W. The exposed thermal pad must be soldered to a solid copper plane for optimal heat dissipation, especially during sustained USB enumeration or high-frequency timer operation. This package supports reflow profiles compliant with IPC/JEDEC J-STD-020.

How does the MSP430F5514IRGCT achieve USB 2.0 full-speed compliance without external components?

The MSP430F5514IRGCT achieves USB 2.0 full-speed (12 Mbps) compliance through its integrated USB-PHY, USB-PLL, and dual-voltage USB-LDO (3.3 V and 1.8 V). The PHY includes on-die termination resistors (1.5-kΩ pullup on DP, 15-kΩ pulldown on DM), ESD protection (±8 kV HBM), and differential signaling circuitry. The USB-PLL locks to the 48-MHz clock required for USB frames, derived from the internal DCO or XT2 crystal-eliminating need for external oscillators, level shifters, or termination resistors.

Can the MSP430F5514IRGCT operate from a single 3.0-V supply for both analog and digital domains?

Yes, the MSP430F5514IRGCT can operate from a single 3.0-V supply applied to DVCC and AVCC. Its integrated LDO generates VCORE (1.3–1.45 V) for the CPU and digital logic, while AVCC powers the comparator and USB analog blocks. The device specifies AVCC = DVCC = 3.0 V as a recommended operating condition, and all I/Os are 3.0-V tolerant. No separate analog rail is required unless external sensors demand tighter reference stability than the internal REFO provides.

What debug interfaces are supported by the MSP430F5514IRGCT?

The MSP430F5514IRGCT supports Spy-Bi-Wire (SBW) and JTAG debugging via the RST/NMI/SBWTDIO and TEST/SBWTCK pins. SBW uses a 2-wire interface (clock + bidirectional data) compatible with TI's MSP-FET and LaunchPad debuggers, occupying minimal PCB space. JTAG is available in 4-wire mode for legacy tools. Both interfaces support full-speed execution control, register inspection, flash programming, and real-time variable monitoring without halting the USB or RTC modules.