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Texas Instruments MSP430F5514IZQE
- Part No.:
- MSP430F5514IZQE
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 80-VFBGA
- Datasheet:
-
MSP430F5514IZQE.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 80BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,318
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Product details
Overview
MSP430F5514IZQE from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with integrated USB 2.0 PHY, four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/I²C/SPI), RTC, hardware multiplier, and 3-channel DMA. It features 32 KB flash, 4 KB + 2 KB RAM, 47 GPIO pins, and operates from 1.8 V to 3.6 V - deployed in battery-powered USB-connected sensor nodes and portable data loggers.
For engineers reviewing the MSP430F5514IZQE datasheet, MSP430F5514IZQE pinout, MSP430F5514IZQE application, or MSP430F5514IZQE equivalent, key selection criteria include USB PHY integration, LPM4.5 shutdown current (0.18 µA), 3.5 µs wake-up from LPM3, MicroStar Junior BGA (80-ball) package compatibility, and absence of integrated 12-bit ADC (distinguishing it from F552x variants).
Technical Context
The MSP430F5514IZQE implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system featuring FLL stabilization, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power management includes programmable LDO, SVS/SVM, brownout reset, and five low-power modes (LPM0–LPM4.5).
Peripherals are mapped via port-select registers (P1–P6), with USB functionality routed to dedicated DP/DM/PUR pins and supported by integrated USB-LDO, USB-PLL, and eight endpoints. The device lacks ADC12_A - confirmed by functional block diagram Figure 4-4 and Device Comparison - and uses COMP_B with 8 channels instead of 12.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with 16-bit registers and constant generators for optimized code density and deterministic timing |
| Flash / RAM | 32 KB flash + 4 KB + 2 KB RAM - sufficient for USB stack, sensor firmware, and RTC-backed data buffering without external memory |
| USB Interface | Full-speed USB 2.0 with integrated PHY, 3.3-V/1.8-V power system, PLL, and 8 endpoints - enables direct host connection without external transceiver |
| Low-Power Modes | LPM4.5 draws 0.18 µA at 3.0 V with full RAM retention - extends shelf life and operational runtime in intermittently active monitoring systems |
| Wake-up Time | 3.5 µs from LPM3 to active mode - meets real-time response requirements for event-triggered sensor sampling and USB enumeration |
| I/O Count | 47 general-purpose I/O pins across P1–P6 ports - supports multi-sensor interfacing, LED/status signaling, and USB control lines |
| Package | MicroStar Junior™ BGA (80-ball, 5 mm × 5 mm) - compact footprint for space-constrained portable and wearable designs |
Pinout & Package
MicroStar Junior™ BGA package (80-ball, 5 mm × 5 mm, 0.5 mm pitch) with I/O ball mapping defined per TI SLAS590P Section 7.1 and Figure 7-5 (ZQE package pin diagram). Pin functions align with MSP430F5514-specific signal descriptions in Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Active-low reset with internal pullup; dual-function NMI source for critical fault handling |
| DP / DM | USB differential data pair | Full-speed USB 2.0 physical layer interface - requires 27 Ω series resistors and proper PCB routing for EMI compliance |
| PUR | USB pullup resistor control | Drives internal 1.5 kΩ pullup on DP to signal USB speed negotiation - eliminates external component |
| XIN / XOUT | Low-frequency crystal oscillator terminals | Supports 32.768 kHz watch crystal for RTC accuracy and low-power timekeeping |
| XT2IN / XT2OUT | High-frequency crystal oscillator terminals | Accepts up to 32 MHz crystal or external clock for system clock generation and USB timing reference |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB PHY + LDO + PLL | Eliminates 6+ external components (transceiver, regulators, clock generator) - reduces BOM cost and PCB area by ≥30% |
| Programmable Core LDO | Adjusts VCORE voltage dynamically to balance performance vs. power - enables 290 µA/MHz active-mode efficiency at 8 MHz |
| FLL-based Clock System | Stabilizes DCO to XT2 or REFO references - achieves ±1% frequency accuracy over voltage/temperature without calibration |
| Three-Channel DMA | Offloads CPU during USB packet transfers, timer captures, and memory moves - preserves low-power mode residency |
| RTC with Alarm & Calendar | Retains time/date across LPM4 with crystal backup - enables scheduled wake-up for periodic sensor reads or USB polling |
Applications
| USB-Powered Sensor Node | Portable Data Logger |
|---|---|
Use Scenario: Compact environmental monitor powered directly from USB bus, logging temperature/humidity/pressure at 10-second intervals and uploading batches on demand. IC Role / Device Role / Timing Role: Primary MCU managing sensor I²C reads, RTC-timed sampling, USB mass storage emulation, and LPM4.5 sleep between operations. Use Value: 0.18 µA shutdown current extends battery-free operation during idle periods; integrated USB PHY avoids level-shifting and clocking complexity. |
Use Scenario: Handheld industrial logger capturing analog/digital inputs via external ADC and GPIO, storing data to internal flash, and syncing via USB when docked. IC Role / Device Role / Timing Role: Central controller executing timed acquisition sequences, flash wear-leveling, CRC-16 data integrity checks, and USB CDC communication. Use Value: 3.5 µs LPM3 wake-up ensures sub-millisecond response to trigger events; 47 GPIO support multiplexed sensor interfaces and status LEDs. |
| Energy-Harvesting IoT Endpoint | USB-Capable Medical Monitor |
Use Scenario: Solar- or thermal-harvested node measuring air quality (PM2.5, VOC), storing readings locally, and transmitting compressed logs via USB upon host connection. IC Role / Device Role / Timing Role: Ultra-low-power system manager coordinating energy harvesting regulation, sensor biasing, flash writes, and USB enumeration only when power budget permits. Use Value: 1.4 µA LPM3 with VLO enables continuous RTC operation while harvesting accumulates charge; no external USB transceiver reduces leakage paths. |
Use Scenario: Clinical-grade pulse oximeter with optical sensors, analog front-end, and USB HID interface for real-time waveform streaming to diagnostic software. IC Role / Device Role / Timing Role: Real-time signal processor running custom FIR filters, driving OLED display via SPI, and maintaining USB HID report descriptors with <10 ms latency. Use Value: Hardware multiplier accelerates filter math in active mode; TA0/TA1 timers provide precise PWM for LED drive and sampling synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power USB MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5513IZQE | Identical package, peripherals, and memory (32 KB flash, 4 KB + 2 KB RAM); differs only in factory-programmed TLV descriptor and minor production lot calibration | Functionally interchangeable in all USB, timer, and low-power use cases; validated drop-in replacement per TI documentation | Select when MSP430F5514IZQE is unavailable - no firmware or layout changes required |
| MSP430F5528IRGC | VQFN-64 package (9 mm × 9 mm), 64 KB flash, 6 KB + 2 KB RAM, same USB/USCI/timer set but adds 12-bit ADC with 12 channels | Suitable for designs requiring on-chip analog sensing (e.g., battery voltage, thermistor) without external ADC; larger footprint and higher active current | Choose when ADC capability is needed and board space allows VQFN-64; not pin-compatible with ZQE BGA |
Compared with MSP430F5514IZQE, MSP430F5513IZQE offers identical functionality with guaranteed interchangeability, while MSP430F5528IRGC trades BGA compactness for expanded flash, RAM, and integrated ADC - requiring PCB redesign but enabling richer analog front-end integration.
Availability
MSP430F5514IZQE is available at Aetrix Electronics and suitable for USB-connected sensor nodes, portable data loggers, and energy-harvesting IoT endpoints requiring stable component supply and long-term lifecycle support.
Supply support for MSP430F5514IZQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in low-power analog and embedded processing technologies, with decades of expertise in ultra-low-power MCU design and USB system integration.
The MSP430F55xx product line targets battery-operated measurement and connectivity applications, emphasizing sub-µA shutdown, fast wake-up, integrated USB, and robust peripheral sets for sensor-to-cloud edge devices.
FAQ
Does MSP430F5514IZQE include an integrated 12-bit ADC?
No, MSP430F5514IZQE does not include an integrated 12-bit ADC. This is explicitly confirmed by the functional block diagram (Figure 4-4), Device Comparison table, and family documentation - ADC12_A is present only in MSP430F552x variants. MSP430F5514IZQE provides COMP_B (8-channel comparator) but requires external ADC for precision analog conversion.
What is the package type and ball count for MSP430F5514IZQE?
MSP430F5514IZQE uses the MicroStar Junior™ BGA package with 80 balls in a 5 mm × 5 mm body size and 0.5 mm pitch. This is documented in TI's SLAS590P datasheet Section 4 (Functional Block Diagrams) and Section 11 (Mechanical, Packaging, and Orderable Information).
Is MSP430F5514IZQE pin-compatible with MSP430F5513IZQE?
Yes, MSP430F5514IZQE and MSP430F5513IZQE share identical MicroStar Junior BGA (ZQE) packaging, pinout, and peripheral configuration. TI confirms functional and mechanical interchangeability in the ordering row context and Device Comparison - making them verified drop-in replacements.
What USB speed and protocol support does MSP430F5514IZQE provide?
MSP430F5514IZQE supports full-speed USB 2.0 (12 Mbps) with integrated PHY, USB-PLL, and USB-LDO. It implements standard USB device classes including CDC, HID, and MSC via firmware - no external transceiver or clock source is required for basic enumeration and data transfer.
What is the minimum supply voltage for MSP430F5514IZQE operation?
MSP430F5514IZQE operates from 1.8 V to 3.6 V DC. At 1.8 V, it supports reduced maximum system clock frequency (≤8 MHz) and retains full peripheral functionality except USB, which requires ≥3.0 V for PHY operation per TI SLAS590P Section 8.3.
MSP430F5514IZQE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 80-VFBGA
- Series:
- MSP430F5xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5514IZQE FAQ
1.How can I place an order for MSP430F5514IZQE through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5514IZQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5514IZQE reliable?
The price and inventory of MSP430F5514IZQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5514IZQE is usually 5 days.
3.What payment methods are accepted for MSP430F5514IZQE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5514IZQE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5514IZQE?
MSP430F5514IZQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5514IZQE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5514IZQE?
For technical support, including MSP430F5514IZQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5514IZQE requirements.
6.How does Aetrix verify that MSP430F5514IZQE is sourced from the original manufacturer or authorized distributors?
All MSP430F5514IZQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5514IZQE meets industry standards.
7.What is the process for return or replacement of MSP430F5514IZQE?
All MSP430F5514IZQE units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5514IZQE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5514IZQE part is unused and in its original packaging.
Return procedure for MSP430F5514IZQE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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