Texas Instruments MSP430F5519IPN

Overview

MSP430F5519IPN from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with integrated full-speed USB 2.0 PHY, four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, DMA, and 63 GPIO pins in an 80-pin LQFP package. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems requiring USB connectivity and deterministic low-power operation.

For engineers reviewing the MSP430F5519IPN datasheet, MSP430F5519IPN pinout, MSP430F5519IPN application, or MSP430F5519IPN equivalent, key selection criteria include USB PHY integration, 63 I/O count, absence of ADC12_A (distinguishing it from F552x variants), LPM3 current of 1.9 µA at 3.0 V, and wake-up time of 3.5 µs from standby mode.

Technical Context

The MSP430F5519IPN implements a unified clock system with FLL stabilization, dual crystal support (XT1 for 32-kHz RTC, XT2 up to 32 MHz), and internal sources (VLO, REFO). Its power management includes a programmable LDO core regulator, supply voltage supervision (SVM/SVS), and five low-power modes (LPM0–LPM4.5) optimized for sub-µA retention.

Peripherals are mapped via port mapping control (P4), enabling flexible signal routing. The device uses the CPUXV2 core with constant generators for code efficiency and supports serial onboard programming without external voltage. It shares the same 80-pin LQFP (PN) package and functional block diagram as MSP430F5517IPN and MSP430F5515IPN.

Key Specifications

Pinout & Package

The MSP430F5519IPN is housed in an 80-pin LQFP (PN) package measuring 12 mm × 12 mm with exposed thermal pad (not electrically connected). Pin functions follow TI's standard port mapping architecture with multiplexed peripherals across P1–P8 and PJ ports.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power USB microcontroller applications.

Compared with MSP430F5517IPN and MSP430F5515IPN, the MSP430F5519IPN offers the highest Flash/RAM capacity in the PN-package F551x series, making it optimal for feature-rich USB firmware with extensive sensor drivers, USB class stacks, or secure boot logic - without requiring PCB redesign.

Availability

MSP430F5519IPN is available at Aetrix Electronics and suitable for USB sensor nodes, industrial protocol bridges, and battery-powered data loggers requiring stable component supply and long-term manufacturability.

Supply support for MSP430F5519IPN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer applications.

The MSP430F5519IPN belongs to the MSP430F551x ultra-low-power MCU family, designed specifically for USB-connected portable measurement systems requiring extended battery life, deterministic real-time response, and minimal external components.

FAQ

What is the maximum operating frequency of the MSP430F5519IPN?

The MSP430F5519IPN supports a maximum system clock frequency of 25 MHz, enabled by its integrated FLL-controlled DCO and optional high-frequency crystal oscillator (XT2) up to 32 MHz. This frequency allows real-time execution of USB protocol handling, timer-based sensor sampling, and communication stack processing while maintaining ultra-low-power efficiency in active mode.

Does the MSP430F5519IPN include an integrated analog-to-digital converter (ADC)?

No, the MSP430F5519IPN does not include the ADC12_A module. Per the official device comparison table (Table 3-1), ADC12_A is present only in MSP430F552x variants (e.g., MSP430F5529IPN). The MSP430F5519IPN retains all other peripherals - including USB, timers, USCI, RTC, and DMA - but omits the 12-bit ADC to differentiate its feature set and target applications focused on digital interfacing and USB connectivity rather than analog sensing.

What package type and dimensions does the MSP430F5519IPN use?

The MSP430F5519IPN uses an 80-pin LQFP (PN) package measuring 12 mm × 12 mm with standard 0.5-mm lead pitch. This package is shared with MSP430F5517IPN and MSP430F5515IPN, enabling drop-in compatibility across the F551x PN-series. The mechanical drawing and thermal pad specifications are documented in Section 8 of the SLAS590N datasheet.

How many USB endpoints does the MSP430F5519IPN support?

The MSP430F5519IPN supports eight input and eight output USB endpoints, as confirmed in the "Features" section of the SLAS590N datasheet. This endpoint count enables implementation of composite USB devices - such as simultaneous HID + CDC + MSC classes - without requiring external USB hub logic or firmware workarounds.

Is the MSP430F5519IPN pin-compatible with the MSP430F5529IPN?

No, the MSP430F5519IPN is not pin-compatible with the MSP430F5529IPN despite sharing the same 80-pin LQFP (PN) package. While both use identical physical packaging, their peripheral mappings differ: MSP430F5529IPN includes ADC12_A channels on P6–P7 pins that are assigned to comparator (CBx) or general-purpose I/O on MSP430F5519IPN. Signal assignments for shared pins (e.g., USCI, timers, USB) are consistent, but ADC-related pins are repurposed, requiring board-level verification before substitution.