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Texas Instruments MSP430F5522IZQER
- Part No.:
- MSP430F5522IZQER
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 80-VFBGA
- Datasheet:
-
MSP430F5522IZQER.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 80BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,484
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Product details
Overview
MSP430F5522IZQER from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with integrated USB 2.0 PHY, 12-bit ADC (12-channel), four 16-bit timers, two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and 3-channel DMA. It operates from 1.8 V to 3.6 V and delivers 290 µA/MHz active current at 8 MHz (flash execution). It targets battery-powered USB-connected sensor nodes and portable data loggers.
For engineers reviewing the MSP430F5522IZQER datasheet, MSP430F5522IZQER pinout, MSP430F5522IZQER application, or MSP430F5522IZQER equivalent, key selection criteria include its 47 I/O count, MicroStar Junior BGA-80 package, USB 2.0 compliance, 12-bit ADC with autoscan, LPM4.5 shutdown current of 0.18 µA, and compatibility with TI's MSP430Ware™ and LaunchPad™ ecosystem.
Technical Context
The MSP430F5522IZQER implements a 16-bit RISC CPU with constant generators and digitally controlled oscillator (DCO), enabling 3.5 µs wake-up from LPM3 standby. Its unified clock system integrates FLL stabilization, VLO and REFO internal sources, XT1 (32 kHz), and XT2 (up to 32 MHz).
Power management includes a programmable LDO core regulator, supply voltage supervisor (SVS), brownout reset (BOR), and five low-power modes (LPM0–LPM4.5). The USB subsystem features integrated 3.3-V/1.8-V power rails, USB-PLL, and eight endpoints-supporting full-speed device-mode operation without external PHY components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16-bit registers and constant generators for optimized code density and low-cycle instruction execution |
| Max System Clock | 25 MHz - enables real-time signal processing and USB frame timing compliance |
| USB Interface | Full-speed USB 2.0 device mode with integrated PHY, PLL, and dual-voltage power system - eliminates external transceiver |
| ADC Resolution & Channels | 12-bit SAR ADC with 12 input channels (10 external + 2 internal) and autoscan - supports multi-sensor acquisition without firmware overhead |
| Low-Power Modes | LPM4.5 draws 0.18 µA at 3.0 V - extends shelf life and operational runtime in energy-harvesting or coin-cell applications |
| I/O Count | 47 general-purpose I/O pins with configurable drive strength, Schmitt-trigger inputs, and port mapping control - supports flexible peripheral routing |
| Memory | 64 KB flash + 4 KB + 2 KB RAM - sufficient for USB stack, sensor fusion algorithms, and local data buffering |
Pinout & Package
MicroStar Junior™ BGA-80 package (5 mm × 5 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture-sensitive level 3 (MSL-3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Active-low reset with built-in pullup; also serves as NMI source for critical fault handling |
| DP / DM | USB differential data pair | Direct connection to USB host; integrated termination and slew-rate control - no external resistors required |
| PUR | USB pullup resistor control | Enables/disables internal 1.5-kΩ pullup on DP to signal USB device attachment and speed negotiation |
| AVCC / AVSS | Analog power supply / ground | Separate analog domain for ADC and comparator - reduces digital noise coupling into precision measurements |
| XIN / XOUT | Low-frequency crystal oscillator terminals | Supports 32.768-kHz watch crystal for RTC accuracy and low-power timekeeping independent of main clock |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB 2.0 PHY | Eliminates need for external transceiver and associated passives - reduces BOM cost and PCB area by ≥12 mm² |
| 12-bit ADC with autoscan | Automatically sequences up to 12 channels per conversion trigger - enables synchronized multi-sensor sampling without CPU intervention |
| Ultra-low-power LPM4.5 | 0.18 µA shutdown current preserves RAM state while disabling all clocks and regulators - ideal for tamper-detection or wake-on-event designs |
| Hardware multiplier (MPY32) | Completes 32-bit multiply in one cycle - accelerates FFT, PID, and cryptographic operations in resource-constrained firmware |
| Unified clock system with FLL | Stabilizes DCO output across voltage/temperature using reference clock feedback - ensures timing accuracy without external crystal for main system clock |
Applications
| Portable Data Logger | USB-Connected Sensor Hub |
|---|---|
Use Scenario: Battery-powered environmental monitor logging temperature, humidity, and pressure every 5 minutes over 6 months. IC Role / Device Role / Timing Role: Central controller managing sensor interfaces, ADC sampling, RTC timestamping, USB mass-storage-class data dump, and ultra-low-power sleep scheduling. Use Value: LPM4.5 current of 0.18 µA extends coin-cell life beyond 18 months; integrated USB avoids external PHY and simplifies regulatory USB compliance. |
Use Scenario: Industrial sensor node aggregating readings from 8 analog sensors and 2 I²C devices, then uploading via USB to host PC. IC Role / Device Role / Timing Role: Mixed-signal aggregator with simultaneous 12-channel ADC autoscan, dual-USCI (I²C + UART), and USB device interface for bulk data transfer. Use Value: 47 GPIOs enable direct sensor connection; 12-bit ADC linearity (±1 LSB INL) ensures measurement fidelity; USB endpoint flexibility supports custom class descriptors. |
| Energy-Harvesting IoT Node | USB Firmware Updater Module |
Use Scenario: Solar- or thermal-harvested node powering intermittent BLE beacon and USB configuration interface. IC Role / Device Role / Timing Role: Power-aware system manager coordinating energy harvesting, capacitor charging, LPM3 RTC wakeups, and burst-mode USB communication. Use Value: 1.9 µA LPM3 current with RTC active allows precise 10-second wakeup intervals; VLO and REFO support clocking during ultra-low-voltage brownout conditions. |
Use Scenario: Field-deployable module that accepts new firmware over USB and reprograms attached peripherals via SPI/I²C. IC Role / Device Role / Timing Role: Secure bootloader host with USB DFU class support, flash memory protection, and DMA-accelerated firmware write verification. Use Value: On-chip 64 KB flash and hardware CRC16 enable robust firmware validation; serial programming requires no external voltage - simplifies field service. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power USB MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5528IRGC | VQFN-64 package (9 mm × 9 mm); identical peripheral set and electrical specs; 47 I/Os | Better thermal dissipation and reworkability; requires different PCB layout and stencil | Select when board assembly uses QFN reflow or thermal performance exceeds BGA limits |
| MSP430F5529IPN | LQFP-80 package; 63 I/Os; adds 4-channel ADC (16 total), 16 KB RAM, and 128 KB flash | Higher I/O count and memory support more complex USB classes (e.g., CDC ACM + HID) and larger sensor arrays | Select when design requires >47 GPIOs or extended RAM for USB descriptor caching and buffer management |
Compared with MSP430F5528IRGC, the MSP430F5522IZQER offers identical functionality in a smaller 5 mm × 5 mm BGA footprint - advantageous for space-constrained wearables. Compared with MSP430F5529IPN, it trades I/O count and memory for reduced package size and lower assembly cost, making it optimal for cost- and area-sensitive USB sensor endpoints.
Availability
MSP430F5522IZQER is available at Aetrix Electronics and suitable for portable data loggers, USB-connected sensor hubs, and energy-harvesting IoT nodes requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for MSP430F5522IZQER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on power efficiency, reliability, and system-level integration.
The MSP430F55xx product line targets ultra-low-power mixed-signal applications demanding USB connectivity, precision sensing, and extended battery life - designed specifically for portable instrumentation, industrial monitoring, and energy-conscious edge devices.
FAQ
What is the package type and mounting compatibility of the MSP430F5522IZQER?
The MSP430F5522IZQER uses a MicroStar Junior™ BGA-80 package (5 mm × 5 mm, 0.5 mm pitch) with solder-ball interconnect. It requires controlled-depth reflow profiling and X-ray inspection for void detection. The package is not compatible with land-grid array (LGA) or QFN footprints - PCB layout must follow TI's ZQE mechanical drawings (SLAS590P Section 11) to ensure reliable solder joint formation and thermal performance.
Does the MSP430F5522IZQER support USB host functionality?
No, the MSP430F5522IZQER supports USB device mode only - it implements a full-speed USB 2.0 device controller with integrated PHY, USB-PLL, and endpoint buffers. It cannot act as a USB host or OTG controller. For host capability, TI recommends the MSP430FR6989 with external USB host controller IC or migration to C2000™ or Sitara™ processors with dedicated USB host stacks.
What ADC input channels are available on the MSP430F5522IZQER?
The MSP430F5522IZQER features a 12-bit ADC (ADC12_A) with 12 total input channels: 10 external analog inputs (A0–A9) mapped across P1–P6 ports, plus two internal channels - temperature sensor and VREF/2 (VMID). Channel selection is controlled via ADC12MCTLx registers, and autoscan mode supports sequential conversion of up to 12 channels per trigger event.
How does the power management system of the MSP430F5522IZQER reduce system-level energy consumption?
The MSP430F5522IZQER reduces system energy via five programmable low-power modes (LPM0–LPM4.5), a fully integrated LDO with adjustable core voltage, and autonomous peripheral operation. In LPM3, RTC, watchdog, and RAM retention operate at 1.9 µA; in LPM4.5, only supply supervisor remains active at 0.18 µA. Peripherals like USCI and timers can trigger wake-up without CPU involvement - minimizing active-mode duty cycle in sensor polling applications.
Is the MSP430F5522IZQER pin-compatible with other members of the MSP430F552x family?
No - the MSP430F5522IZQER is not pin-compatible with other MSP430F552x variants due to differing packages: MSP430F5522IZQER uses MicroStar Junior BGA-80, while MSP430F5528IRGC uses VQFN-64 and MSP430F5529IPN uses LQFP-80. Pin functions and ball/pad assignments differ across packages; migration requires PCB redesign and signal routing validation per TI's respective package drawings.
MSP430F5522IZQER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 80-VFBGA
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 10K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5522IZQER FAQ
1.How can I place an order for MSP430F5522IZQER through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5522IZQER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5522IZQER reliable?
The price and inventory of MSP430F5522IZQER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5522IZQER is usually 5 days.
3.What payment methods are accepted for MSP430F5522IZQER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5522IZQER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5522IZQER?
MSP430F5522IZQER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5522IZQER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5522IZQER?
For technical support, including MSP430F5522IZQER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5522IZQER requirements.
6.How does Aetrix verify that MSP430F5522IZQER is sourced from the original manufacturer or authorized distributors?
All MSP430F5522IZQER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5522IZQER meets industry standards.
7.What is the process for return or replacement of MSP430F5522IZQER?
All MSP430F5522IZQER units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5522IZQER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5522IZQER part is unused and in its original packaging.
Return procedure for MSP430F5522IZQER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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