My Inquiry
My Account
Texas Instruments MSP430F5524IZQER
- Part No.:
- MSP430F5524IZQER
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 80-VFBGA
- Datasheet:
-
MSP430F5524IZQER.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 80BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,834
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F5524IZQER from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with integrated USB 2.0 PHY, 64 KB flash, 4 KB + 2 KB RAM, 12-bit ADC (10 external + 2 internal channels), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and 3-channel DMA. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes requiring USB connectivity and deterministic low-power operation.
For engineers reviewing the MSP430F5524IZQER datasheet, MSP430F5524IZQER pinout, MSP430F5524IZQER application, or MSP430F5524IZQER equivalent, key selection considerations include its 47 I/O pin count, MicroStar Junior™ BGA-80 package, USB 2.0 full-speed support with integrated LDO/PLL/PWR, 12-bit ADC autoscan capability, and LPM4.5 shutdown current of 0.18 µA at 3.0 V.
Technical Context
The MSP430F5524IZQER implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system featuring FLL stabilization, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power architecture includes a programmable LDO, supply voltage supervisor (SVS), brownout reset (BOR), and five low-power modes (LPM0–LPM4.5) with 3.5 µs wakeup from LPM3.
Peripherals are mapped via port mapping control (P4), supporting flexible I/O assignment. The USB subsystem integrates DP/DM transceivers, USB-PHY, USB-PLL, and dual-voltage (3.3 V/1.8 V) power regulation - all enabled without external components. The 12-bit ADC supports sample rates up to 200 ksps with internal reference and autoscan across 12 channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators for optimized code density and execution efficiency |
| Flash / RAM | 64 KB flash memory with segment erase; 4 KB + 2 KB RAM with full retention in LPM3/LPM4 |
| USB Interface | Full-speed USB 2.0 compliant with integrated PHY, PLL, 3.3-V/1.8-V regulators, and 8 endpoints |
| ADC | 12-bit SAR ADC with 200 ksps max rate, autoscan, internal reference, and 10 external analog inputs |
| Low-Power Modes | LPM4.5 draws 0.18 µA at 3.0 V; LPM3 draws 1.9 µA at 3.0 V with RTC + crystal active |
| Timers | Four 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers) |
| USCI Modules | Two USCI peripherals: USCI_Ax (UART/IrDA/SPI), USCI_Bx (I²C/SPI); independent clock domains |
Pinout & Package
MicroStar Junior™ BGA-80 (ZQE) package, 5 mm × 5 mm, 0.5 mm pitch, bottom-side solder balls. Pinout validated per TI SLAS590P Rev P, Figure 7-10 (ZQE package pin diagram).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Active-low reset with Schmitt trigger; supports NMI edge detection and JTAG/SBW entry |
| DP / DM | USB differential data pair | Full-speed USB 2.0 transceiver pins; require no external termination or pull-ups |
| PUR | USB pull-up resistor control | Internal 1.5-kΩ pull-up to 3.3 V; enables USB enumeration when driven high |
| AVCC / AVSS | Analog power supply / ground | Separate 3.3-V analog domain for ADC, REF, and comparator; decoupling required |
| XIN / XOUT | Low-frequency crystal oscillator terminals | Supports 32.768-kHz watch crystal for RTC; internal load caps configurable via UCSCTL6 |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low standby current | 1.9 µA at 3.0 V in LPM3 with RTC + crystal active - enables multi-year battery life in data loggers |
| Integrated USB power system | On-chip 3.3-V and 1.8-V USB LDOs eliminate need for external regulators in USB-powered designs |
| Flexible clocking | FLL-stabilized DCO with multiple sources (VLO, REFO, XT1, XT2) enables robust timing across temperature/voltage |
| Hardware accelerator | 32-bit hardware multiplier completes signed/unsigned multiply in one cycle - accelerates math-intensive firmware |
| Peripheral mapping | Port mapping control (P4) allows dynamic reassignment of peripheral functions to GPIO pins - simplifies PCB layout reuse |
Applications
| USB Sensor Node | Data Logger |
|---|---|
Use Scenario: Portable environmental monitor with temperature/humidity sensors, logging data locally and uploading via USB to host PC. IC Role / Device Role / Timing Role: Central MCU managing sensor acquisition, timestamped storage in flash, USB mass-storage-class file transfer, and RTC-based wake scheduling. Use Value: LPM4.5 shutdown (0.18 µA) extends battery life between uploads; integrated USB PHY eliminates external transceiver BOM cost. | Use Scenario: Industrial vibration logger deployed in remote equipment, capturing accelerometer data at fixed intervals and storing to internal flash. IC Role / Device Role / Timing Role: Low-power controller executing timed ADC sampling, CRC-16 checksum generation, flash write management, and RTC alarm-triggered wakeups. Use Value: 1.9 µA LPM3 current with RTC active enables >2-year operation on coin cell; autoscan ADC reduces firmware overhead per channel. |
| USB Human Interface Device | Smart Meter Interface Module |
Use Scenario: Configurable USB HID device (e.g., custom keyboard/mouse) with programmable button mapping and LED feedback. IC Role / Device Role / Timing Role: USB endpoint manager handling HID report descriptors, interrupt IN/OUT transfers, and GPIO-driven user interface logic. Use Value: Eight configurable USB endpoints support complex descriptor sets; USCI_A0 UART enables debug console over same USB connector. | Use Scenario: Utility meter add-on module providing USB-CDC interface for firmware updates and real-time energy parameter readout. IC Role / Device Role / Timing Role: Secure bridge between metrology ASIC (SPI/I²C) and host PC, enforcing authentication before flash update. Use Value: Dual USCI modules allow concurrent SPI (to metrology IC) and USB-CDC (to host); hardware multiplier accelerates AES-128 encryption routines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power USB MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5528IRGC | VQFN-64 package (9 mm × 9 mm); identical peripheral set and memory (64 KB flash / 4 KB+2 KB RAM) | Requires different PCB footprint and thermal pad layout; no BGA rework constraints | Select for prototyping or volume production where BGA assembly is unavailable or cost-prohibitive |
| MSP430F5522IZQER | Same ZQE-80 package; reduced flash (32 KB) and RAM (4 KB+2 KB); identical USB/ADC/timer/peripheral configuration | Suitable for cost-sensitive designs with smaller firmware footprint and lower data buffering needs | Select when application firmware fits within 32 KB flash and does not require extended data buffering or complex USB descriptors |
Compared with MSP430F5524IZQER, MSP430F5528IRGC offers identical functionality in a reflow-friendly QFN package but trades board area for assembly simplicity, while MSP430F5522IZQER retains the same BGA footprint and USB/ADC capabilities at lower memory cost - enabling tiered product variants without layout changes.
Availability
MSP430F5524IZQER is available at Aetrix Electronics and suitable for USB-connected sensor nodes, portable data loggers, smart meter interfaces, and industrial HIDs requiring stable component supply and long-term lifecycle support.
Supply support for MSP430F5524IZQER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430F55xx product line was designed for ultra-low-power, USB-enabled embedded systems where battery life, integration density, and rapid time-to-market are critical - targeting sensor fusion, portable instrumentation, and USB-peripheral edge devices.
FAQ
What is the maximum operating frequency of the MSP430F5524IZQER?
The MSP430F5524IZQER supports a maximum system clock frequency of 25 MHz, achieved via the FLL-controlled DCO using high-frequency crystal (XT2) or internal reference sources. This frequency is validated across the full 1.8 V to 3.6 V supply range and –40°C to 85°C temperature range per TI SLAS590P Rev P Section 8.19.
Does the MSP430F5524IZQER include an integrated USB transceiver?
Yes, the MSP430F5524IZQER integrates a full-speed USB 2.0 transceiver (PHY), USB-PLL, and dual-voltage (3.3 V/1.8 V) USB power system. No external USB transceiver, resistors, or regulators are required - only DP/DM routing and proper PCB layout per TI's USB design guidelines.
How many analog input channels does the ADC support on the MSP430F5524IZQER?
The MSP430F5524IZQER features a 12-bit ADC (ADC12_A) with 12 total channels: 10 external analog inputs (A0–A9) and 2 internal sources (temperature sensor and VREF/2). This is confirmed in the functional block diagram (Figure 4-2) and Section 8.35–8.39 of the SLAS590P datasheet.
What low-power modes are supported by the MSP430F5524IZQER, and what is the lowest current draw?
The MSP430F5524IZQER supports five low-power modes (LPM0–LPM4.5). The lowest active-retention mode is LPM4.5 (shutdown), drawing 0.18 µA at 3.0 V with full RAM retention and supply supervisor active. LPM3 (RTC active with 32-kHz crystal) draws 1.9 µA at 3.0 V - both values are typical and specified in Section 8.5 of SLAS590P.
Is the MSP430F5524IZQER pin-compatible with other devices in the MSP430F55xx family?
No - the MSP430F5524IZQER uses the MicroStar Junior™ BGA-80 (ZQE) package, which is not pin-compatible with QFN-64 (RGC), LQFP-80 (PN), or nFBGA-80 (ZXH) variants. While peripheral functionality overlaps significantly across the F552x series, pin assignments, ball/pad layouts, and power domain routing differ by package type and must be verified per each device's specific pin diagram.
MSP430F5524IZQER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 80-VFBGA
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5524IZQER FAQ
1.How can I place an order for MSP430F5524IZQER through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5524IZQER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5524IZQER reliable?
The price and inventory of MSP430F5524IZQER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5524IZQER is usually 5 days.
3.What payment methods are accepted for MSP430F5524IZQER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5524IZQER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5524IZQER?
MSP430F5524IZQER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5524IZQER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5524IZQER?
For technical support, including MSP430F5524IZQER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5524IZQER requirements.
6.How does Aetrix verify that MSP430F5524IZQER is sourced from the original manufacturer or authorized distributors?
All MSP430F5524IZQER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5524IZQER meets industry standards.
7.What is the process for return or replacement of MSP430F5524IZQER?
All MSP430F5524IZQER units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5524IZQER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5524IZQER part is unused and in its original packaging.
Return procedure for MSP430F5524IZQER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F5524IZQER Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
