Texas Instruments MSP430F5528IZQER
- Part No.:
- MSP430F5528IZQER
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 80-VFBGA
- Datasheet:
-
MSP430F5528IZQER.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 80BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,422
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F5528IZQER from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with integrated USB 2.0 PHY, 12-bit ADC (12 external channels), four 16-bit timers, two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and 3-channel DMA. It operates from 1.8 V to 3.6 V and delivers 290 µA/MHz active current at 8 MHz (flash execution) - optimized for battery-powered sensor nodes and USB-connected data loggers.
For engineers reviewing the MSP430F5528IZQER datasheet, MSP430F5528IZQER pinout, MSP430F5528IZQER application, or MSP430F5528IZQER equivalent, key selection criteria include its MicroStar Junior™ BGA-80 package, 47 I/O pins, USB-capable architecture, LPM3 standby current of 1.9 µA (3.0 V), and ADC channel count versus competing F5529/F5527 variants.
Technical Context
The MSP430F5528IZQER implements a 16-bit RISC CPU with extended memory addressing, digitally controlled oscillator (DCO), and unified clock system featuring FLL stabilization, REFO/XT1/XT2/VLO sources. Its power management includes an integrated LDO with programmable core voltage and supply supervision with brownout detection.
Peripherals are mapped via port mapping control (P4), supporting flexible I/O assignment across P1–P6. The device uses a segmented memory architecture with 64 KB flash and 8 KB + 2 KB RAM, and supports serial on-board programming without external voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generators and 25-MHz max system clock |
| Flash / RAM | 64 KB flash + 8 KB + 2 KB RAM - sufficient for USB stack + sensor firmware + RTC logging |
| USB Interface | Full-speed USB 2.0 with integrated PHY, PLL, 3.3-V/1.8-V power system, and 8 endpoints |
| ADC | 12-bit SAR ADC with 200 ksps, autoscan, 12 external input channels, internal reference |
| Low-Power Modes | LPM3: 1.9 µA (3.0 V, RTC active); LPM4: 1.1 µA; LPM4.5: 0.18 µA - enables multi-year battery life |
| Wake-up Time | 3.5 µs from LPM3/LPM4 - ensures responsive event-driven operation in sensor wake cycles |
| I/O Count | 47 general-purpose I/O pins with configurable drive strength, Schmitt-trigger inputs, and port mapping |
Pinout & Package
Package: MicroStar Junior™ BGA-80 (5 mm × 5 mm, 0.5-mm pitch). Pinout validated per TI SLAS590P Rev P, Section 7.1 (Figure 7-10: ZQE Package Pin Diagram) and signal descriptions in Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / Spy-Bi-Wire debug I/O | Single-pin JTAG/SBW interface for programming and debugging; internal pullup enabled by default |
| DP / DM | USB differential data pair | Direct connection to USB host; requires no external transceiver - simplifies USB-CDC/HID designs |
| PUR | USB pullup resistor control | Enables/disables internal 1.5-kΩ pullup on DP to signal USB connect status to host |
| AVCC / AVSS | Analog power supply / ground | Separate analog domain for ADC and comparator - reduces digital noise coupling into precision measurements |
| XIN / XOUT | Low-frequency crystal oscillator terminals | Supports 32.768-kHz watch crystal for RTC accuracy ±20 ppm over temperature |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB 2.0 PHY | Eliminates need for external transceiver and level-shifting components - reduces BOM cost and PCB area |
| 12-bit ADC with autoscan | Enables simultaneous sampling across up to 12 external sensors without CPU intervention - ideal for multi-channel environmental monitoring |
| Ultra-low-power LPM3 mode | 1.9 µA at 3.0 V with RTC, watchdog, and full RAM retention - supports years of operation on coin-cell batteries |
| Unified clock system with FLL | Automatically locks DCO to XT1/XT2 references - ensures stable timing across voltage/temperature without manual calibration |
| Hardware multiplier (MPY32) | Completes 32-bit multiply in one cycle - accelerates filtering, FFT, and cryptographic operations in resource-constrained edge nodes |
Applications
| USB-Powered Sensor Hub | Portable Data Logger |
|---|---|
Use Scenario: Compact, battery-backed environmental monitor connecting directly to PC or industrial USB host for real-time data streaming and configuration. IC Role / Device Role / Timing Role: Primary MCU managing sensor acquisition (via ADC), USB CDC communication, RTC timestamping, and low-power scheduling. Use Value: Integrated USB PHY and LPM3 enable zero-external-component USB connectivity and multi-month battery life on CR2032. |
Use Scenario: Field-deployed temperature/humidity/logger recording measurements at configurable intervals and uploading batches via USB when docked. IC Role / Device Role / Timing Role: System controller executing timed ADC conversions, storing results in RAM/flash, maintaining accurate timestamps via RTC_A module. Use Value: Autoscan ADC + 47 GPIO + RTC alarm allows autonomous, long-duration logging without host interaction or external timing ICs. |
| Industrial USB Interface Adapter | Low-Power USB HID Device |
Use Scenario: Retrofit adapter converting legacy RS-232/485 fieldbus devices to USB virtual COM port for modern SCADA systems. IC Role / Device Role / Timing Role: Protocol bridge translating UART commands to USB CDC ACM class - handles flow control, framing, and error recovery. Use Value: Dual USCI modules (USCI_A0 for UART, USCI_B0 for optional I²C diagnostics) plus USB endpoint flexibility support robust bidirectional bridging. |
Use Scenario: Energy-conscious human-interface device such as USB keyboard or sensor-based remote control requiring wake-on-event and minimal idle power. IC Role / Device Role / Timing Role: USB HID class controller with GPIO matrix scanning and fast LPM3→AM wakeup (<3.5 µs) on button press or sensor trigger. Use Value: 0.18 µA LPM4.5 shutdown current and hardware-based wake logic eliminate parasitic drain - extends shelf life and operational runtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power USB MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5529IPN | 80-pin LQFP, 63 I/O, 128 KB flash, 16-channel ADC (14 ext) | Higher I/O count and flash capacity for complex USB+sensor+display systems | Select when board layout accommodates LQFP and design requires >47 GPIO or >64 KB code space |
| MSP430F5528IRGC | 64-pin VQFN, 47 I/O, same peripherals and memory as ZQE variant | Same functionality in thermally enhanced exposed-pad package - better for convection-cooled or high-reliability environments | Select when thermal performance or reflow compatibility outweighs BGA assembly requirements |
Compared with MSP430F5529IPN, the MSP430F5528IZQER trades I/O count and flash size for compact BGA packaging and identical USB/ADC/timer capability; compared with MSP430F5528IRGC, it offers identical functionality in a smaller footprint but requires BGA assembly infrastructure.
Availability
MSP430F5528IZQER is available at Aetrix Electronics and suitable for USB-connected sensor hubs, portable data loggers, and industrial interface adapters requiring stable component supply, long-term lifecycle assurance, and qualified BGA sourcing.
Supply support for MSP430F5528IZQER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in low-power design and industrial-grade reliability.
The MSP430F5528IZQER belongs to the MSP430F55xx ultra-low-power USB MCU family, engineered for energy-constrained applications where USB connectivity, precision analog sensing, and multi-year battery operation are critical - including portable instrumentation and smart industrial peripherals.
FAQ
What is the package type and pin count of the MSP430F5528IZQER?
The MSP430F5528IZQER uses a MicroStar Junior™ BGA-80 package with 80 balls arranged in a 5 mm × 5 mm array and 0.5-mm pitch. It provides 47 general-purpose I/O pins, as confirmed in TI's SLAS590P datasheet Section 3 and Figure 4-2. This BGA variant shares identical functionality with the VQFN and nFBGA versions of the MSP430F5528, differing only in mechanical form factor and ball assignment.
Does the MSP430F5528IZQER include a USB physical layer?
Yes, the MSP430F5528IZQER integrates a full-speed USB 2.0 PHY, USB-PLL, and dual-voltage (3.3-V/1.8-V) USB power system. This eliminates the need for external transceivers or level shifters. The DP/DM pins connect directly to a USB connector, and the PUR pin controls the internal 1.5-kΩ pullup resistor required for USB enumeration - all documented in Section 4.2 and Table 8-44/45 of the MSP430F5528IZQER datasheet.
How many analog input channels does the ADC support on the MSP430F5528IZQER?
The MSP430F5528IZQER features a 12-bit ADC (ADC12_A) with 12 external input channels and 2 internal channels (temperature sensor and VREF). This is explicitly stated in Section 4.2 (Functional Block Diagram) and Section 8.35–8.39 of the datasheet. It differs from the MSP430F5529's 16-channel ADC, confirming the 12-channel count applies specifically to the F5528 variant in all packages including ZQE.
What is the lowest power consumption mode available on the MSP430F5528IZQER?
The lowest power mode is LPM4.5, drawing 0.18 µA at 3.0 V with full RAM retention and supply supervisor active. This mode disables all clocks and the LDO regulator while preserving SRAM contents - enabling ultra-long storage or deep sleep between infrequent wake events. Wake-up time from LPM4.5 is not specified, but LPM4 wake-up is 3.5 µs (typical), per Section 8.26 of the MSP430F5528IZQER datasheet.
Is the MSP430F5528IZQER pin-compatible with other MSP430F5528 package variants?
No - the MSP430F5528IZQER (MicroStar Junior BGA-80) is not pin-compatible with the MSP430F5528IRGC (VQFN-64) or MSP430F5528IZXH (nFBGA-80). Ball/pin assignments differ significantly across packages, as shown in Figures 7-10 (ZQE), 7-8 (RGC), and 7-9 (ZXH) of SLAS590P. Signal routing, power pin placement, and debug interface layout require unique PCB designs for each package.
MSP430F5528IZQER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 80-VFBGA
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 47
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 10K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5528IZQER FAQ
1.How can I place an order for MSP430F5528IZQER through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5528IZQER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5528IZQER reliable?
The price and inventory of MSP430F5528IZQER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5528IZQER is usually 5 days.
3.What payment methods are accepted for MSP430F5528IZQER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5528IZQER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5528IZQER?
MSP430F5528IZQER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5528IZQER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5528IZQER?
For technical support, including MSP430F5528IZQER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5528IZQER requirements.
6.How does Aetrix verify that MSP430F5528IZQER is sourced from the original manufacturer or authorized distributors?
All MSP430F5528IZQER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5528IZQER meets industry standards.
7.What is the process for return or replacement of MSP430F5528IZQER?
All MSP430F5528IZQER units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5528IZQER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5528IZQER part is unused and in its original packaging.
Return procedure for MSP430F5528IZQER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F5528IZQER Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

