Texas Instruments MSP430F5632IPZR
- Part No.:
- MSP430F5632IPZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MSP430F5632IPZR.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430F5632IPZR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 256 KB flash, 16 KB + 2 KB RAM, USB 2.0 full-speed interface, dual 12-bit DACs, four 16-bit timers, two USCI modules (UART/IrDA/SPI/I²C), and 74 GPIO pins in a 100-pin LQFP package. It targets battery-powered sensor systems and portable measurement devices requiring fast wake-up (3 µs) and RTC-backed operation.
For engineers reviewing the MSP430F5632IPZR datasheet, MSP430F5632IPZR pinout, MSP430F5632IPZR application, or MSP430F5632IPZR equivalent, key selection criteria include USB integration without external PHY, ultra-low standby current (1.8 µA at 3.0 V), 12-bit ADC channel count (0 external inputs), DAC presence, and LQFP-100 package compatibility with industrial layout constraints.
Technical Context
The MSP430F5632IPZR implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system including FLL, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power architecture integrates a programmable LDO, supply voltage supervisor (SVS), brownout reset (BOR), and five low-power modes (LPM0–LPM4.5).
Peripherals are tightly coupled via 6-channel DMA and share memory-mapped registers. The USB subsystem includes integrated PHY, 3.3-V/1.8-V power system, USB-PLL, and eight endpoints - all operating independently of main CPU execution. The absence of ADC12_A and DAC12_A channels (per Device Comparison Table 6-1) distinguishes it from higher-pin-count variants like MSP430F5638.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators; enables high code efficiency for embedded firmware in resource-constrained applications. |
| Flash / RAM | 256 KB flash + 16 KB + 2 KB SRAM; supports large firmware images and USB buffer allocation without external memory. |
| USB Interface | Full-speed USB 2.0 with integrated PHY and power system; eliminates need for external transceiver or level-shifting components. |
| Low-Power Modes | LPM3: 1.8 µA at 3.0 V with RTC active; LPM4.5: 0.3 µA shutdown; enables multi-year battery life in always-on monitoring nodes. |
| Wake-up Time | 3 µs from LPM3 to active mode; ensures responsive real-time control in interrupt-driven sensor polling or event detection. |
| I/O Count | 74 GPIO pins in LQFP-100 package; provides ample routing flexibility for multi-peripheral industrial interfaces and debug signals. |
| Operating Voltage | 1.8 V to 3.6 V supply range; compatible with single-cell Li-ion, Li-polymer, or dual-AA alkaline battery systems. |
Pinout & Package
LQFP-100 (PZ) package, 14 mm × 14 mm body size, 0.5 mm pitch, thermally enhanced with exposed thermal pad (per TI SLAS650G Section 11).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / Spy-Bi-Wire debug I/O | Single-pin JTAG-compatible debug interface; enables in-system programming and real-time debugging without dedicated header. |
| XIN / XOUT | Low-frequency crystal oscillator input/output | Supports 32.768 kHz watch crystal for precise RTC timing and low-power sleep synchronization. |
| XT2IN / XT2OUT | High-frequency crystal oscillator input/output | Accepts up to 32 MHz crystal or external clock source for USB timing, high-speed sampling, or CPU boost. |
| DVCC1 / DVCC2 / AVCC1 | Digital and analog supply rails | Separate digital core (DVCC), USB power (DVCC2), and analog reference (AVCC1) rails minimize noise coupling in mixed-signal operation. |
| P6.6 / P6.7 / P7.6 / P7.7 | DAC output terminals | Four dedicated DAC output pins supporting dual-channel synchronized voltage generation for analog actuation or calibration. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB PHY and power system | Eliminates external USB transceiver and LDOs; reduces BOM count and PCB area for compact USB-enabled designs. |
| Programmable LDO with regulated core voltage | Enables dynamic voltage scaling to match processing load, optimizing active-mode power across 1.8–3.6 V operation. |
| Hardware multiplier (MPY32) | Accelerates 32-bit arithmetic for FFT, PID, or sensor fusion algorithms without consuming CPU cycles or flash space. |
| 6-channel DMA controller | Offloads data movement between peripherals (USB, ADC, timers) and memory, freeing CPU for application logic during burst transfers. |
| RTC_B module with battery backup | Maintains accurate timekeeping during main power loss using VBAT rail; supports alarm wake-up and calendar functions. |
Applications
| Industrial Sensor Node | USB-Capable Data Logger |
|---|---|
Use Scenario: Remote temperature/humidity monitoring unit powered by AA batteries, transmitting logs via USB mass storage upon docking. IC Role / Device Role / Timing Role: Main controller executing sensor polling, RTC-timed sampling, USB enumeration, and FAT32 file writes. Use Value: 0.3 µA LPM4.5 shutdown extends battery life beyond 5 years; integrated USB avoids external PHY cost and layout complexity. |
Use Scenario: Portable handheld meter recording analog waveforms and exporting CSV files via USB cable to PC. IC Role / Device Role / Timing Role: Real-time waveform acquisition engine with DMA-driven ADC sampling, USB bulk transfer, and on-device timestamping. Use Value: 3 µs wake-up ensures sub-millisecond response to trigger events; dual DAC outputs enable simultaneous calibration signal generation. |
| Smart Thermostat Interface | USB-Enabled Motor Control Board |
Use Scenario: Wall-mounted HVAC controller with LCD, touch keys, and USB service port for firmware updates and diagnostics. IC Role / Device Role / Timing Role: System orchestrator managing display refresh, button debounce, USB DFU bootloader, and ambient sensor fusion. Use Value: 74 GPIO pins support direct LCD segment drive and keypad matrix; LDO regulation stabilizes display contrast across battery discharge curve. |
Use Scenario: Brushless DC motor driver board with Hall-effect feedback, USB-based parameter tuning, and overcurrent protection. IC Role / Device Role / Timing Role: Motion control co-processor generating PWM via Timer_B, reading position sensors, and accepting USB commands. Use Value: Four 16-bit timers provide independent PWM channels for 3-phase commutation; USB interface enables field calibration without proprietary tools. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5637IPZR | 192 KB flash, same 74-pin LQFP package, identical peripheral set except reduced flash capacity. | Suitable where firmware footprint is under 192 KB and cost optimization is prioritized over future code expansion headroom. | Select when flash margin is sufficient and BOM cost reduction is critical; pinout and software compatibility are maintained. |
| MSP430F5636IPZR | 128 KB flash, same package and peripheral configuration, no ADC/DAC channels - matches MSP430F5632IPZR feature set exactly. | Targeted at USB-centric control applications where analog peripherals are unused, enabling lowest-cost variant in family. | Choose for pure USB host/device control tasks without analog signal chain; shares identical register map and migration path. |
Compared with MSP430F5632IPZR, MSP430F5637IPZR trades 64 KB flash for lower unit cost while retaining all peripherals, whereas MSP430F5636IPZR offers identical analog-less functionality at further reduced density - both maintain full pin and software compatibility for seamless design reuse.
Availability
MSP430F5632IPZR is available at Aetrix Electronics and suitable for industrial sensor nodes, USB data loggers, and smart thermostat interfaces requiring stable component supply across long-lifecycle production programs.
Supply support for MSP430F5632IPZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430F563x product line was designed for ultra-low-power mixed-signal applications demanding integrated USB, rich timer resources, and extended battery life - targeting portable instrumentation and intelligent edge nodes.
FAQ
What is the maximum system clock frequency supported by MSP430F5632IPZR?
The MSP430F5632IPZR supports a maximum system clock frequency of 20 MHz, achieved via its integrated FLL control loop using either internal DCO or external high-frequency crystal (XT2) up to 32 MHz. This frequency governs CPU execution speed, peripheral timing, and USB frame generation - all verified in TI's SLAS650G specification table 8.19 (DCO Frequency) and section 4 functional block diagrams.
Does MSP430F5632IPZR include an analog-to-digital converter (ADC)?
No, the MSP430F5632IPZR does not include an ADC12_A module. Per Table 6-1 (Device Comparison) in the official datasheet SLAS650G, the "ADC12_A (Ch)" column for MSP430F5632 shows "–", confirming zero external or internal ADC channels - unlike MSP430F5638 which lists "12 ext, 4 int". This omission is intentional for USB-focused control applications.
What USB speed and endpoint configuration does MSP430F5632IPZR support?
The MSP430F5632IPZR supports full-speed USB 2.0 (12 Mbps) with eight bidirectional endpoints (four IN, four OUT), integrated PHY, and dedicated 3.3-V/1.8-V USB power system. This configuration enables CDC, HID, and MSC class implementations without external components - confirmed in sections 1 (Features), 4 (Functional Block Diagram), and 8.50–8.52 of SLAS650G.
What is the standby current consumption of MSP430F5632IPZR in LPM3 mode?
In LPM3 (standby mode) with watchdog, crystal oscillator, and supply supervisor active plus full RAM retention, the MSP430F5632IPZR consumes 1.8 µA at 2.2 V and 2.1 µA at 3.0 V (typical values per section 1, Features). This ultra-low current enables multi-year operation on coin-cell or primary battery sources in always-listening applications.
Which package type and pin count does MSP430F5632IPZR use?
The MSP430F5632IPZR uses a 100-pin LQFP (PZ) package with 14 mm × 14 mm body size and 0.5 mm pitch, as documented in the Device Information table (page 1) and Package Option Addendum (Section 11) of SLAS650G. This package provides 74 usable I/O pins alongside power, ground, and debug signals.
MSP430F5632IPZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 74
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 18K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5632IPZR FAQ
1.How can I place an order for MSP430F5632IPZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5632IPZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5632IPZR reliable?
The price and inventory of MSP430F5632IPZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5632IPZR is usually 5 days.
3.What payment methods are accepted for MSP430F5632IPZR?
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MSP430F5632IPZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5632IPZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5632IPZR?
For technical support, including MSP430F5632IPZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5632IPZR requirements.
6.How does Aetrix verify that MSP430F5632IPZR is sourced from the original manufacturer or authorized distributors?
All MSP430F5632IPZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5632IPZR meets industry standards.
7.What is the process for return or replacement of MSP430F5632IPZR?
All MSP430F5632IPZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5632IPZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5632IPZR part is unused and in its original packaging.
Return procedure for MSP430F5632IPZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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