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Texas Instruments MSP430FR2033IG56R

Name: MSP430FR2033IG56R
Brand: Texas Instruments
SKU: MSP430FR2033IG56R
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MSP430FR2033IG56R

Manufacturer:: Texas Instruments

Category:: Microcontrollers

Package:: 56-TFSOP (0.240", 6.10mm Width)

Datasheet:: MSP430FR2033IG56R.pdf

Description:: IC MCU 16BIT 15.5KB FRAM 56TSSOP

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Product details

Overview

MSP430FR2033IG56R from Texas Instruments is a 16-bit RISC ultra-low-power microcontroller featuring 15.5 KB FRAM (15360 + 512 B), 2 KB SRAM, dual eUSCI modules (UART/I²C/SPI), 10-bit 8-channel ADC, and two Timer_A3 peripherals - deployed in battery-powered industrial sensor nodes and smoke detectors requiring sub-µA standby operation.

For engineers reviewing the MSP430FR2033IG56R datasheet, MSP430FR2033IG56R pinout, MSP430FR2033IG56R application, or MSP430FR2033IG56R equivalent, key selection criteria include LPM3.5 current (0.4 µA with VLO), capacitive-touch-capable I/O count (52 pins), TSSOP-56 package footprint, and FRAM endurance (10¹⁵ write cycles) for frequent data logging.

Technical Context

The MSP430FR2033IG56R integrates a 16-MHz DCO with FLL-based frequency locking, on-chip REFO (32 kHz), VLO (10 kHz), and XT1 crystal oscillator support - enabling precise RTC operation at 0.77 µA in LPM3.5 with external 32.768-kHz crystal. Its memory subsystem unifies program, constants, and data in FRAM with built-in ECC and configurable write protection.

Peripherals include two independent Timer_A3 modules (each with three capture/compare registers), eUSCI_A0 (UART/IrDA/SPI), eUSCI_B0 (SPI/I²C), and a 10-bit ADC with internal 1.5-V reference and 200 ksps sample rate - all accessible via 52 GPIOs, 16 of which serve as interrupt-capable wake sources from LPM3.5.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Architecture	16-bit RISC core with constant generators; enables high code efficiency and <10 µs wake-from-LPM to active mode
FRAM Capacity	15360 B program + 512 B information FRAM; nonvolatile, radiation-resistant, 10¹⁵ write endurance
RAM Size	2048 B SRAM; retains data in LPM3.5 and supports fast context switching during low-power operation
ADC Resolution & Speed	10-bit SAR ADC with 8 input channels and 200 ksps sampling; includes internal 1.5-V reference for stable measurement
Low-Power Mode LPM3.5	0.4 µA with VLO, 0.77 µA with 32.768-kHz crystal; enables real-time clock functionality while minimizing system power
Package & Pins	TSSOP-56 (G56); 52 functional I/Os - all configurable as capacitive touch inputs without external components
Communication Interfaces	eUSCI_A0 (UART/IrDA/SPI) and eUSCI_B0 (SPI/I²C); supports simultaneous serial protocols with independent clock domains

Pinout & Package

TSSOP-56 (G56) package, 14.0 mm × 6.1 mm body size, 0.5 mm pitch; thermally enhanced for industrial ambient operation up to 85°C.

Pin/Terminal	Circuit Role	Design Meaning
RST/NMI/SBWTDIO	Reset / NMI input / SBW data I/O	Single-pin debug interface for programming and reset; requires no external pull-up in SBW mode
TEST/SBWTCK	SBW test clock input	Enables in-system programming and debugging using TI's MSP-FET or LaunchPad tools
P1.0–P1.7	Analog/digital I/O with ADC/AUX functions	8-pin group supporting UART (UCA0TXD/RXD), SPI (UCA0SIMO/SOMI), and analog inputs A0–A7
P4.0/TA1.1, P4.1/XIN, P4.2/XOUT	Timer capture / crystal oscillator interface	Supports external 32.768-kHz crystal for RTC; TA1.1 enables edge-triggered event capture
P5.0–P5.3	eUSCI_B0 I²C/SPI interface	Provides I²C (SCL/SDA) and SPI (STE/CLK/SIMI/SOMI) on shared pins - selectable via software configuration
P2.0–P2.7	Interrupt-capable GPIO	All 8 pins support wake-from-LPM3.5; critical for motion or alarm-triggered system activation

Key Features

Feature	Design Value
Ferroelectric RAM (FRAM)	Unified 15.5 KB nonvolatile memory with ECC, eliminating need for separate EEPROM and enabling instant write-on-power-loss
Ultra-Low-Power Modes	LPM3.5 at 0.4 µA (VLO) or 0.77 µA (32.768-kHz crystal) sustains RTC and wake logic without external RTC IC
Capacitive Touch I/O	All 52 GPIOs support CTSIO - enables button/slider HMI without dedicated touch controller or external RC network
Dual Enhanced USCI	eUSCI_A0 (UART/IrDA/SPI) + eUSCI_B0 (SPI/I²C) allow concurrent sensor bus (I²C) and host interface (UART) without resource contention
Integrated Clock System	On-chip DCO (±1% accuracy), REFO, VLO, MODCLK, and XT1 support - reduces BOM cost by eliminating external oscillators in most configurations

Applications

Smoke Detectors	Glass Breakage Sensors
Use Scenario: Standalone battery-operated unit detecting ionization or photoelectric smoke events with local alarm and wireless reporting. IC Role / Device Role / Timing Role: Primary MCU executing sensor signal processing, alarm decision logic, and low-duty-cycle RF transmission timing. Use Value: LPM3.5 current of 0.77 µA extends 10-year battery life; FRAM enables reliable event logging across 10¹⁵ power cycles.	Use Scenario: Acoustic sensor node mounted on windows or glass surfaces, analyzing high-frequency vibration signatures for break detection. IC Role / Device Role / Timing Role: Real-time audio front-end controller acquiring and preprocessing FFT-ready samples via 10-bit ADC at 200 ksps. Use Value: Integrated 1.5-V reference ensures consistent ADC gain across temperature; 16-bit timers trigger precise sampling windows aligned to acoustic events.
Industrial Sensor Nodes	HMI Controllers
Use Scenario: Wireless temperature/humidity/pressure node in factory automation, transmitting calibrated readings every 5 minutes over Sub-GHz or BLE. IC Role / Device Role / Timing Role: Low-power coprocessor managing sensor polling, calibration math, CRC-16 checksum generation, and sleep/wake scheduling. Use Value: Dual eUSCI modules enable simultaneous I²C sensor reads and UART-to-RF bridge; FRAM stores calibration coefficients without wear-out risk.	Use Scenario: Touch-enabled control panel for HVAC or lighting systems, supporting slider, proximity, and button gestures in harsh EMI environments. IC Role / Device Role / Timing Role: Capacitive touch engine and UI state machine running directly on MCU - no external touch ASIC required. Use Value: All 52 GPIOs support CTSIO with hardware-accelerated baseline tracking; eliminates external RC networks and reduces PCB layer count.

Smoke Detectors

Glass Breakage Sensors

Use Scenario: Standalone battery-operated unit detecting ionization or photoelectric smoke events with local alarm and wireless reporting.

IC Role / Device Role / Timing Role: Primary MCU executing sensor signal processing, alarm decision logic, and low-duty-cycle RF transmission timing.

Use Value: LPM3.5 current of 0.77 µA extends 10-year battery life; FRAM enables reliable event logging across 10¹⁵ power cycles.

Use Scenario: Acoustic sensor node mounted on windows or glass surfaces, analyzing high-frequency vibration signatures for break detection.

IC Role / Device Role / Timing Role: Real-time audio front-end controller acquiring and preprocessing FFT-ready samples via 10-bit ADC at 200 ksps.

Use Value: Integrated 1.5-V reference ensures consistent ADC gain across temperature; 16-bit timers trigger precise sampling windows aligned to acoustic events.

Industrial Sensor Nodes

HMI Controllers

Use Scenario: Wireless temperature/humidity/pressure node in factory automation, transmitting calibrated readings every 5 minutes over Sub-GHz or BLE.

IC Role / Device Role / Timing Role: Low-power coprocessor managing sensor polling, calibration math, CRC-16 checksum generation, and sleep/wake scheduling.

Use Value: Dual eUSCI modules enable simultaneous I²C sensor reads and UART-to-RF bridge; FRAM stores calibration coefficients without wear-out risk.

Use Scenario: Touch-enabled control panel for HVAC or lighting systems, supporting slider, proximity, and button gestures in harsh EMI environments.

IC Role / Device Role / Timing Role: Capacitive touch engine and UI state machine running directly on MCU - no external touch ASIC required.

Use Value: All 52 GPIOs support CTSIO with hardware-accelerated baseline tracking; eliminates external RC networks and reduces PCB layer count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MSP430FR2032IG56R	8 KB + 512 B FRAM, 1 KB SRAM, 8-channel ADC - same pinout and peripheral set	Lower memory capacity limits firmware complexity and data buffering depth	Select when application firmware fits within 8 KB and data logging volume is modest
MSP430FR2355TRHBR	64-pin VQFN, 32 KB FRAM, 6 KB RAM, enhanced analog (12-bit ADC, op-amps), 4x eUSCI	Requires PCB redesign; supports higher-fidelity sensing and richer HMI but increases BOM cost	Choose for next-generation designs needing analog signal conditioning or larger code space without changing architecture

Compared with MSP430FR2032IG56R, the MSP430FR2033IG56R delivers 94% more FRAM and double the RAM for extended data buffering and feature-rich firmware - while maintaining identical TSSOP-56 footprint and power profile. Against MSP430FR2355TRHBR, it trades peripheral richness and package size for lower cost and proven deployment maturity in cost-sensitive sensor endpoints.

Availability

MSP430FR2033IG56R is available at Aetrix Electronics and suitable for industrial sensor management, smoke/fire detection, and capacitive HMI controllers requiring stable component supply and long-term production continuity.

Supply support for MSP430FR2033IG56R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and system integration.

The MSP430FR2033IG56R belongs to TI's MSP430FR2xx ultra-low-power FRAM microcontroller family - designed specifically for battery-operated sensing, monitoring, and control applications where memory endurance and sub-µA sleep current are critical.

FAQ

What is the maximum operating frequency of the MSP430FR2033IG56R CPU?

The MSP430FR2033IG56R features a 16-bit RISC CPU with a digitally controlled oscillator (DCO) that operates up to 16 MHz. This frequency is maintained with ±1% accuracy at room temperature using the on-chip reference and FLL loop - enabling deterministic real-time execution for time-critical sensor sampling and communication tasks within the MSP430FR2033IG56R.

Does the MSP430FR2033IG56R support external crystal oscillators?

Yes, the MSP430FR2033IG56R supports an external 32.768-kHz crystal via XIN/XOUT pins (P4.1/P4.2) for precision real-time clock operation. This configuration achieves 0.77 µA current in LPM3.5 mode and is validated per TI's MSP430 32-kHz Crystal Oscillators design guidelines - a capability confirmed in the SLASE45E datasheet Section 5.3 and Figure 4-2.

How many I/O pins does the MSP430FR2033IG56R have, and what special functions do they support?

The MSP430FR2033IG56R provides 52 functional I/O pins in its TSSOP-56 package. All pins support general-purpose digital I/O and capacitive touch sensing (CTSIO) without external components. Additionally, 16 pins (P1.x and P2.x) serve as interrupt-capable wake sources from LPM3.5, and multiple pins multiplex ADC inputs, timer capture/compare, and eUSCI signals - as detailed in Table 4-1 of the SLASE45E datasheet.

What is the FRAM endurance specification for the MSP430FR2033IG56R?

The MSP430FR2033IG56R integrates ferroelectric RAM with 10¹⁵ write cycle endurance - orders of magnitude higher than flash or EEPROM. This allows frequent data logging (e.g., sensor readings every second) for over 31 million years without wear-out, making it ideal for applications where reliability under continuous write stress is essential - a specification explicitly stated in the "Low-power ferroelectric RAM (FRAM)" section of the SLASE45E datasheet.

Can the MSP430FR2033IG56R operate from a single 1.8-V supply?

Yes, the MSP430FR2033IG56R operates across a wide supply range of 1.8 V to 3.6 V. At 1.8 V, it maintains full functionality including FRAM access, ADC operation, and peripheral clocks - though minimum supply voltage is constrained by SVS threshold levels. This capability is confirmed in the "Embedded microcontroller" feature list and Recommended Operating Conditions table (Section 5.3) of the SLASE45E datasheet.

MSP430FR2033IG56R Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Package/Case:: 56-TFSOP (0.240", 6.10mm Width)

Series:: MSP430™ FRAM

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: MSP430 CPU16

Core Size:: 16-Bit

Speed:: 16MHz

Connectivity:: I2C, IrDA, SCI, SPI, UART/USART

Peripherals:: Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O:: 52

Program Memory Size:: 15.5KB (15.5K x 8)

Program Memory Type:: FRAM

EEPROM Size:: -

RAM Size:: 2K x 8

Voltage - Supply (Vcc/Vdd):: 1.8V ~ 3.6V

Data Converters:: A/D 8x10b

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

MSP430FR2033IG56R FAQ

1.How can I place an order for MSP430FR2033IG56R through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430FR2033IG56R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430FR2033IG56R reliable?

The price and inventory of MSP430FR2033IG56R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2033IG56R is usually 5 days.

3.What payment methods are accepted for MSP430FR2033IG56R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR2033IG56R transactions.

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4.How is shipping managed for MSP430FR2033IG56R?

MSP430FR2033IG56R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430FR2033IG56R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430FR2033IG56R?

For technical support, including MSP430FR2033IG56R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2033IG56R requirements.

6.How does Aetrix verify that MSP430FR2033IG56R is sourced from the original manufacturer or authorized distributors?

All MSP430FR2033IG56R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2033IG56R meets industry standards.

7.What is the process for return or replacement of MSP430FR2033IG56R?

All MSP430FR2033IG56R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2033IG56R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430FR2033IG56R part is unused and in its original packaging.

Return procedure for MSP430FR2033IG56R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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