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Texas Instruments MSP430FR2153TDBT
- Part No.:
- MSP430FR2153TDBT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
MSP430FR2153TDBT.pdf
- Description:
- IC MCU 16BIT 16KB FRAM 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:221
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Product details
Overview
MSP430FR2153TDBT from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller in 38-pin TSSOP package, operating from 1.8 V to 3.6 V across –40°C to 105°C. It integrates 16 KB program FRAM + 512 B data FRAM, 2 KB RAM, a 12-bit 200 ksps SAR ADC, two enhanced comparators, and dual eUSCI_A/B modules for UART/I²C/SPI - deployed in smoke detectors, sensor transmitters, and circuit breakers.
For engineers reviewing the MSP430FR2153TDBT datasheet, MSP430FR2153TDBT pinout, MSP430FR2153TDBT application, or MSP430FR2153TDBT equivalent, key selection criteria include its 34 I/O count, LPM3.5 standby current of 620 nA (with SVS enabled), FRAM endurance (10¹⁵ writes), integrated 6-bit DAC reference, and support for 32-kHz crystal oscillator timing.
Technical Context
The MSP430FR2153TDBT implements a 16-bit RISC CPU with constant generator and 24-MHz DCO+FLL clock system offering ±1% accuracy at room temperature. Its power management module supports six low-power modes, including LPM3.5 (620 nA) and LPM4.5 (42 nA), with wake-up capability from all I/O pins on P1–P4.
Peripherals include three Timer_B3 modules (3×CCR each), one Timer_B7 (7×CCR), RTC counter, 16-bit CRC engine, MPY32 hardware multiplier, and Manchester codec. Unlike MSP430FR235x variants, it omits Smart Analog Combo (SAC) modules but retains full eCOMP, ADC, and ROM library (20 KB) support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generator; enables high code efficiency and deterministic interrupt latency. |
| Max Operating Frequency | 24 MHz via DCO+FLL; allows real-time signal processing at sub-10 µs wake-up from LPM. |
| Memory | 16 KB FRAM (program) + 512 B FRAM (data) + 2 KB RAM; unified nonvolatile memory eliminates flash erase delays. |
| ADC | 12-bit SAR, 12-channel, 200 ksps; supports internal 1.5/2.0/2.5 V references and sample-and-hold. |
| Low-Power Modes | LPM3.5 draws 620 nA (32-kHz crystal active, SVS enabled); enables decade-scale battery operation in sensor nodes. |
| eUSCI Peripherals | 2× eUSCI_A (UART/IrDA/SPI) + 2× eUSCI_B (SPI/I²C); supports simultaneous wired industrial comms and debug. |
| Operating Temperature | –40°C to 105°C; qualified for harsh environments like smoke detectors and circuit breakers. |
Pinout & Package
Package: 38-pin TSSOP (DBT), 9.7 mm × 4.4 mm body size, surface-mount, leaded package with standard JEDEC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC / DVSS | Main power pair | Digital/analog supply (1.8–3.6 V); requires 4.7–10 µF bulk + 0.1 µF ceramic decoupling per rail. |
| RST/NMI/SBWTDIO TEST/SBWTCK |
Reset & Spy-Bi-Wire debug | Single-wire JTAG interface for programming and debugging; NMI supports external event capture. |
| P1.x–P4.x (34 pins) | General-purpose I/O | All support interrupt/wake-up from LPM3.5/LPM4.5; configurable pull-up/down and slew rate control. |
| XIN / XOUT | LFXT crystal terminals | Supports 32.768 kHz crystal for RTC and low-power timing; internal load caps configurable via registers. |
| UCB0SOMI/UCB0SCL UCB1SOMI/UCB1SCL |
I²C interfaces | Two independent I²C masters/slaves; UCB1 supports only I²C (not SPI), enabling dual sensor bus control. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 16 KB program + 512 B data FRAM with ECC, 10¹⁵ write cycles, radiation-resistant, no wear leveling required. |
| Ultra-Low-Power Operation | LPM3.5 = 620 nA (32-kHz crystal active); LPM4.5 = 42 nA (SVS disabled); enables >10-year coin-cell lifetime. |
| Integrated Analog Front-End | 12-bit ADC (12 ch, 200 ksps), two eCOMP with programmable hysteresis and 6-bit DAC reference, 1.5–2.5 V internal refs. |
| ROM Library | 20 KB factory-programmed ROM includes driver libraries (GPIO, UART, I²C, ADC) and FFT routines - reduces firmware size and boot time. |
| Clock System Flexibility | On-chip REFO (32 kHz), DCO (up to 24 MHz), VLO (10 kHz), MODOSC, plus external HFXT (≤24 MHz) and LFXT (32 kHz). |
Applications
| Smoke and Heat Detectors | Sensor Transmitters |
|---|---|
|
Use Scenario: Battery-powered residential/commercial smoke alarms requiring decade-scale operation and fast wake-on-event response. IC Role / Device Role / Timing Role: Main system controller handling analog smoke chamber signal conditioning, temperature compensation, and alarm triggering logic. Use Value: LPM3.5 current of 620 nA extends CR123A battery life beyond 10 years; FRAM enables reliable event logging without flash wear-out. |
Use Scenario: Industrial 4–20 mA or digital (I²C/UART) sensor nodes transmitting pressure, humidity, or gas readings over RS-485 or LoRaWAN gateways. IC Role / Device Role / Timing Role: Signal acquisition and preprocessing unit interfacing with analog sensors, performing ADC conversion, and managing comms protocol stacks. Use Value: Integrated 12-bit ADC with internal references and 20 KB ROM drivers reduce BOM and firmware development time by >30%. |
| Circuit Breakers | Battery Pack Management |
|
Use Scenario: DIN-rail mounted AC/DC circuit protection devices monitoring current, voltage, and thermal faults in industrial panels. IC Role / Device Role / Timing Role: Real-time fault detection engine using ADC sampling, comparator thresholds, and RTC-based trip delay timing. Use Value: Extended –40°C to 105°C rating ensures reliability in enclosure-heated environments; 24 MHz DCO enables <10 µs wake-up for sub-cycle fault response. |
Use Scenario: Rechargeable Li-ion/LiPo battery packs requiring cell voltage monitoring, temperature sensing, and charge/discharge control in portable tools or medical devices. IC Role / Device Role / Timing Role: Embedded battery gauge and protection co-processor managing ADC reads, thermistor inputs, and safety cutoff signals. Use Value: FRAM's 10¹⁵ write endurance supports continuous logging of 1000+ charge cycles without memory degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2153TRHA | 40-pin VQFN (6 mm × 6 mm); same FRAM/RAM/ADC/peripheral set; thermal pad requires VSS connection. | Better thermal performance and higher I/O density (36 pins vs. 34); suited for space-constrained PCBs with thermal dissipation needs. | Select when board layout allows VQFN and thermal management is prioritized over through-hole compatibility. |
| MSP430FR2155TDBT | Same 38-pin TSSOP package but with 32 KB FRAM + 4 KB RAM; identical peripherals and pinout. | Enables larger firmware images and extended data logging buffers; no change to hardware design or layout. | Choose when firmware complexity or data retention requirements exceed 16 KB FRAM capacity. |
Compared with MSP430FR2153TRHA and MSP430FR2155TDBT, the MSP430FR2153TDBT offers optimal cost-performance balance for mid-complexity sensor nodes where 16 KB FRAM suffices and TSSOP assembly is preferred.
Availability
MSP430FR2153TDBT is available at Aetrix Electronics and suitable for smoke detectors, sensor transmitters, and circuit breakers requiring stable component supply, long-term manufacturability, and industrial temperature qualification.
Supply support for MSP430FR2153TDBT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and system integration.
The MSP430FR215x series is designed for ultra-low-power sensing and measurement applications - targeting battery-operated industrial, building automation, and safety-critical endpoints where FRAM reliability and extended temperature operation are essential.
FAQ
What is the maximum operating frequency of the MSP430FR2153TDBT?
The MSP430FR2153TDBT supports a maximum core clock frequency of 24 MHz via its digitally controlled oscillator (DCO) with frequency-locked loop (FLL). This enables deterministic real-time processing while maintaining ultra-low-power operation, and the device wakes from LPM3.5 to active mode in under 10 µs. The MSP430FR2153TDBT achieves this without external crystals for main clocking, though HFXT up to 24 MHz is supported.
Does the MSP430FR2153TDBT include Smart Analog Combo (SAC) modules?
No, the MSP430FR2153TDBT does not include Smart Analog Combo (SAC) modules. SAC functionality is exclusive to the MSP430FR235x family (e.g., MSP430FR2353). The MSP430FR2153TDBT retains two enhanced comparators (eCOMP), a 12-bit ADC, and programmable gain amplifier (PGA) support via its op-amp peripherals, but lacks the configurable SAC-L3 blocks found in higher-tier variants.
What is the FRAM endurance specification for the MSP430FR2153TDBT?
The MSP430FR2153TDBT features ferroelectric RAM with 10¹⁵ write cycle endurance - orders of magnitude higher than flash or EEPROM. This allows continuous data logging, parameter updates, or firmware patching without wear-out concerns. The FRAM also includes built-in error correction code (ECC) and configurable write protection, making the MSP430FR2153TDBT ideal for mission-critical logging in smoke detectors and industrial sensors.
How many I/O pins does the MSP430FR2153TDBT provide in its TSSOP package?
The MSP430FR2153TDBT in the 38-pin TSSOP (DBT) package provides 34 general-purpose I/O pins across ports P1–P4. All 34 pins support interrupt generation and can wake the device from all low-power modes including LPM3.5 and LPM4.5. Pin multiplexing enables shared functions such as UART, I²C, SPI, timer capture/compare, and analog inputs - confirmed in TI's SLASEC4D datasheet Section 4.3.
What development tools are officially supported for the MSP430FR2153TDBT?
Texas Instruments officially supports the MSP430FR2153TDBT with the MSP-EXP430FR2355 LaunchPad™ development kit (software-compatible), the MSP-TS43048PT target socket board (adaptable via pin mapping), and free MSP430Ware™ software within Code Composer Studio™ IDE. Debugging uses Spy-Bi-Wire (SBW) via TEST/SBWTCK and RST/NMI pins. No dedicated LaunchPad exists for the FR215x, but the FR2355 kit is fully functional due to identical peripheral architecture and register mapping.
MSP430FR2153TDBT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- MSP430™ FRAM
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR2153TDBT FAQ
1.How can I place an order for MSP430FR2153TDBT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR2153TDBT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR2153TDBT reliable?
The price and inventory of MSP430FR2153TDBT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2153TDBT is usually 5 days.
3.What payment methods are accepted for MSP430FR2153TDBT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR2153TDBT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR2153TDBT?
MSP430FR2153TDBT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR2153TDBT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR2153TDBT?
For technical support, including MSP430FR2153TDBT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2153TDBT requirements.
6.How does Aetrix verify that MSP430FR2153TDBT is sourced from the original manufacturer or authorized distributors?
All MSP430FR2153TDBT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2153TDBT meets industry standards.
7.What is the process for return or replacement of MSP430FR2153TDBT?
All MSP430FR2153TDBT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2153TDBT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR2153TDBT part is unused and in its original packaging.
Return procedure for MSP430FR2153TDBT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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