Texas Instruments MSP430FR2153TDBTR
- Part No.:
- MSP430FR2153TDBTR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
MSP430FR2153TDBTR.pdf
- Description:
- IC MCU 16BIT 16KB FRAM 38TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430FR2153TDBTR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller in 38-pin TSSOP package, featuring 16KB program FRAM + 512B data FRAM, 2KB RAM, 12-bit SAR ADC (12-channel, 200 ksps), two enhanced comparators with integrated 6-bit DAC, and dual eUSCI_A (UART/IrDA/SPI) and eUSCI_B (SPI/I²C) modules. It operates from 1.8 V to 3.6 V across –40°C to 105°C and targets battery-powered sensor signal conditioning and industrial monitoring.
For engineers reviewing the MSP430FR2153TDBTR datasheet, MSP430FR2153TDBTR pinout, MSP430FR2153TDBTR application, or MSP430FR2153TDBTR equivalent, key selection criteria include FRAM endurance (10¹⁵ writes), LPM3.5 current (620 nA), 24-MHz DCO accuracy (±1% at room temperature), and I/O count (34 pins) in compact TSSOP-38.
Technical Context
This MCU implements a 16-bit RISC CPU with constant generator and 24-MHz digitally controlled oscillator (DCO) locked via FLL to internal or external references. Its power management module supports six low-power modes, including LPM3.5 (620 nA with RTC active) and LPM4.5 (42 nA shutdown), enabled by SVS monitoring of DVCC.
The analog subsystem integrates a 12-bit SAR ADC with programmable sample-and-hold, two eCOMP units (one with 100-ns response, one with 1.5-µA low-power mode), and shared internal voltage references (1.5/2.0/2.5 V). Unlike MSP430FR235x variants, MSP430FR2153TDBTR excludes Smart Analog Combo (SAC) modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generator; enables high code efficiency for sensor firmware with minimal memory footprint. |
| FRAM Capacity | 16KB program FRAM + 512B data FRAM; supports 10¹⁵ write cycles and radiation-resistant nonvolatile storage without wear leveling. |
| ADC Performance | 12-bit SAR ADC, 12 single-ended channels, 200 ksps sampling; sufficient for precision temperature, smoke, or current sensing in safety-critical endpoints. |
| Low-Power Modes | LPM3.5 draws 620 nA (with 32.768-kHz crystal & SVS enabled); enables multi-year battery life in wireless sensor transmitters. |
| Operating Voltage | 1.8 V to 3.6 V; compatible with coin-cell (e.g., CR2032) and Li-ion battery systems without external regulators. |
| Temperature Range | –40°C to 105°C; validated for use in circuit breakers, smoke detectors, and industrial enclosures without derating. |
| Communication Peripherals | Two eUSCI_A (UART/IrDA/SPI) and two eUSCI_B (SPI/I²C); supports wired industrial comms (e.g., Modbus RTU over UART) and sensor hub interfacing. |
Pinout & Package
Package: 38-pin TSSOP (DBT), 9.7 mm × 4.4 mm body size, lead pitch 0.65 mm. Thermal pad not present (unlike VQFN variants).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC / DVSS | Main digital/analog power pair | Single 1.8–3.6 V supply domain; requires 4.7 µF + 0.1 µF decoupling per TI layout guidelines. |
| RST/NMI/SBWTDIO | Reset, non-maskable interrupt, Spy-Bi-Wire data I/O | Enables in-system programming and debugging via 2-wire interface; NMI supports fast fault detection. |
| P1.0–P1.7, P2.0–P2.7, P3.0–P3.7, P4.0–P4.7, P5.0–P5.4, P6.0–P6.6 | Configurable GPIO with interrupt capability | 34 total I/Os; P1–P4 support wake-up from all LPMs including LPM4.5, critical for event-driven sensing. |
| UCA0TXD/UCA0RXD, UCA1TXD/UCA1RXD | eUSCI_A UART channels | Dual full-duplex UARTs enable simultaneous host communication and peripheral bridging (e.g., RS-485 + BLE module). |
| UCB0SCL/UCB0SDA, UCB1SCL/UCB1SDA | eUSCI_B I²C interfaces | Two independent I²C masters/slaves allow daisy-chained sensor networks (e.g., temp/humidity/pressure on same bus). |
| A0–A11 | ADC input channels | 12 dedicated analog inputs mapped to ports; supports differential measurements using eCOMP hysteresis and internal reference. |
| COMP0.0/COMP0.1, COMP1.0/COMP1.1 | Enhanced comparator inputs/outputs | Two rail-to-rail comparators with programmable hysteresis; used for threshold detection in smoke/heat alarms without CPU intervention. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 16KB program + 512B data FRAM enables instant nonvolatile logging of sensor events (e.g., smoke alarm triggers) with zero write latency and no erase cycles. |
| Ultra-Low-Power Operation | LPM3.5 current of 620 nA allows >10-year operation on a single CR2032 cell in intermittent-read applications like optical toll tags. |
| Integrated Analog Front-End | 12-bit ADC + dual eCOMP + internal 1.5/2.0/2.5 V references eliminate need for external precision voltage sources in battery-pack monitors. |
| Robust Clock System | On-chip 24-MHz DCO with ±1% accuracy (room temp), plus LFXT/REFO/VLO oscillators - ensures reliable timing across voltage/temperature without external crystals in cost-sensitive designs. |
| Hardware Acceleration | 32-bit hardware multiplier (MPY32) and CRC16 engine accelerate FFT-based signal analysis (e.g., vibration diagnostics) and firmware integrity checks. |
Applications
| Smoke and Heat Detectors | Sensor Transmitters |
|---|---|
Use Scenario: Standalone residential or commercial fire alarm unit with optical smoke chamber and thermistor-based heat sensing. IC Role / Device Role / Timing Role: Central controller executing smoke algorithm, driving piezo alarm, managing self-test, and logging fault events to FRAM. Use Value: Extended –40°C to 105°C operation ensures reliability in attic-mounted units; LPM3.5 current extends battery life beyond UL 217 requirements. | Use Scenario: Wireless or wired industrial sensor node measuring pressure, flow, or humidity in HVAC or process control systems. IC Role / Device Role / Timing Role: Signal conditioner, ADC manager, and protocol translator (e.g., Modbus RTU over UART to 4–20 mA loop or I²C to sensor array). Use Value: Integrated 12-bit ADC and dual comparators reduce BOM count; FRAM stores calibration coefficients and last-known-good sensor readings during power loss. |
| Circuit Breakers | Battery Pack Management |
Use Scenario: DIN-rail mounted electronic trip unit monitoring current, voltage, and temperature for overload/short-circuit protection. IC Role / Device Role / Timing Role: Real-time current sampling via ADC, thermal monitoring, and fault-triggered relay control with precise timing (RTC + Timer_B). Use Value: 105°C rating matches enclosure thermal limits; 24-MHz DCO enables sub-microsecond response to overcurrent events. | Use Scenario: Secondary protection IC in multi-cell Li-ion packs, monitoring cell voltages, temperatures, and balancing status. IC Role / Device Role / Timing Role: Analog monitor (ADC on cell taps), comparator-based overvoltage/undervoltage detection, and FRAM-based cycle-count logging. Use Value: FRAM endurance supports >100,000 charge/discharge cycles; 1.8 V minimum supply enables operation down to deeply discharged pack states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2153TRHA | Same core, FRAM, RAM, and peripherals; differs only in 40-pin VQFN (RHA) package with thermal pad. | Requires PCB redesign for smaller 6×6 mm footprint and thermal pad grounding; better thermal performance in high-duty-cycle apps. | Select when board space is constrained and thermal dissipation >150 mW is required; not drop-in compatible with TSSOP layout. |
| MSP430FR2155TDBTR | Identical package and pinout; adds 16KB more program FRAM (32KB total) and 2KB more RAM (4KB total). | Enables larger firmware (e.g., OTA update stack + crypto libraries); no change to analog/peripheral configuration or power profile. | Select when future firmware expansion or data buffering (e.g., extended sensor history) is anticipated; fully pin-compatible upgrade path. |
Compared with MSP430FR2153TRHA, the TSSOP package offers easier prototyping and rework; compared with MSP430FR2155TDBTR, the 16KB FRAM variant reduces cost and flash-equivalent density where firmware size is fixed and predictable.
Availability
MSP430FR2153TDBTR is available at Aetrix Electronics and suitable for smoke detectors, sensor transmitters, and circuit breakers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MSP430FR2153TDBTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430FR215x product line delivers ultra-low-power, FRAM-based microcontrollers optimized for sensing, measurement, and battery-operated endpoint devices in harsh environments.
FAQ
What is the maximum operating frequency of the MSP430FR2153TDBTR?
The MSP430FR2153TDBTR features a 24-MHz digitally controlled oscillator (DCO) with frequency-locked loop (FLL), enabling a maximum CPU clock of 24 MHz. This frequency is achievable across the full operating voltage range (1.8 V to 3.6 V) and temperature range (–40°C to 105°C), with ±1% accuracy at room temperature when referenced to the internal REFO oscillator. The MSP430FR2153TDBTR maintains deterministic timing for real-time sensor sampling and control loops without external crystal dependency.
Does the MSP430FR2153TDBTR support hardware debugging?
Yes, the MSP430FR2153TDBTR supports hardware debugging via the Spy-Bi-Wire (SBW) interface using the SBWTDIO and SBWTCK pins. This 2-wire interface enables full-speed emulation, breakpoint setting, register inspection, and flash programming through TI's MSP-FET and compatible debug probes. No JTAG header is required, reducing PCB footprint. The MSP430FR2153TDBTR also supports ROM-based bootloader (BSL) for field firmware updates over UART or I²C, eliminating need for physical debugger access after deployment.
How many analog input channels does the MSP430FR2153TDBTR ADC support?
The MSP430FR2153TDBTR integrates a 12-bit successive approximation register (SAR) ADC with up to 12 single-ended input channels (A0–A11), mapped across multiple GPIO ports. All channels share programmable sample-and-hold and selectable internal references (1.5 V, 2.0 V, or 2.5 V). The ADC achieves 200 ksps throughput and supports configurable conversion triggers (timer, software, or comparator output), making it suitable for multi-sensor polling in smoke detectors or battery monitors. Differential mode is not supported - only single-ended acquisition is implemented.
Is the MSP430FR2153TDBTR pin-compatible with other devices in the MSP430FR215x family?
Yes, the MSP430FR2153TDBTR is pin-compatible with other TSSOP-38 variants in the MSP430FR215x family, including MSP430FR2155TDBTR. Both share identical pin count, pinout assignment, electrical characteristics, and package dimensions (9.7 mm × 4.4 mm). This allows direct substitution for increased FRAM/RAM capacity without PCB changes. However, it is not pin-compatible with LQFP-48, VQFN-40, or VQFN-32 variants due to differing pin counts and layouts - those require board redesign.
What is the endurance rating of the FRAM in the MSP430FR2153TDBTR?
The FRAM in the MSP430FR2153TDBTR is rated for 10¹⁵ write cycles - orders of magnitude higher than EEPROM or flash memory. This endurance applies to both program and data FRAM segments (16KB + 512B) and is guaranteed across the full operating temperature range (–40°C to 105°C). Unlike flash, FRAM writes occur at bus speed with no erase latency, enabling real-time logging of transient events (e.g., fault timestamps in circuit breakers) without wear leveling or block management overhead. The MSP430FR2153TDBTR FRAM also includes built-in error correction code (ECC) for single-bit error correction and detection.
MSP430FR2153TDBTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR2153TDBTR FAQ
1.How can I place an order for MSP430FR2153TDBTR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR2153TDBTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR2153TDBTR reliable?
The price and inventory of MSP430FR2153TDBTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2153TDBTR is usually 5 days.
3.What payment methods are accepted for MSP430FR2153TDBTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR2153TDBTR transactions.
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4.How is shipping managed for MSP430FR2153TDBTR?
MSP430FR2153TDBTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR2153TDBTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR2153TDBTR?
For technical support, including MSP430FR2153TDBTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2153TDBTR requirements.
6.How does Aetrix verify that MSP430FR2153TDBTR is sourced from the original manufacturer or authorized distributors?
All MSP430FR2153TDBTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2153TDBTR meets industry standards.
7.What is the process for return or replacement of MSP430FR2153TDBTR?
All MSP430FR2153TDBTR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2153TDBTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR2153TDBTR part is unused and in its original packaging.
Return procedure for MSP430FR2153TDBTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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