Texas Instruments MSP430FR2353TDBT
- Part No.:
- MSP430FR2353TDBT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
MSP430FR2353TDBT.pdf
- Description:
- IC MCU 16BIT 16KB FRAM 38TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430FR2353TDBT from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller in 38-pin TSSOP package, featuring 16KB program FRAM, 512B data FRAM, 2KB RAM, 12-bit SAR ADC (10 channels), four Smart Analog Combo (SAC-L3) modules, two enhanced comparators, and dual eUSCI_A/eUSCI_B serial interfaces. It operates from 1.8 V to 3.6 V across –40°C to 105°C and targets battery-powered sensor signal conditioning and industrial monitoring.
For engineers reviewing the MSP430FR2353TDBT datasheet, MSP430FR2353TDBT pinout, MSP430FR2353TDBT application, or MSP430FR2353TDBT equivalent, key selection criteria include FRAM endurance (1015 write cycles), LPM3.5 current (620 nA), SAC configurability (PGA ×1–×33), and 34 I/O count in compact TSSOP-38 - critical for space-constrained, low-maintenance embedded systems.
Technical Context
The MSP430FR2353TDBT implements a 16-bit RISC CPU with 24-MHz DCO+FLL clock system, supporting sub-10 µs wake-up from LPM3.5. Its analog subsystem integrates four SAC-L3 modules-each configurable as rail-to-rail op-amp, programmable-gain amplifier, or 12-bit DAC-with built-in 12-bit reference DAC for offset/bias control.
Digital peripherals include Timer_B3 (3 capture/compare registers), Timer_B7 (7 capture/compare registers), RTC counter, 16-bit CRC, MPY32 hardware multiplier, and Manchester codec. Power management uses SVS with selectable thresholds and supports shutdown mode at 42 nA (SVS disabled).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generator; enables high code efficiency and deterministic real-time response. |
| Memory | 16KB + 512B FRAM (nonvolatile, 1015 write cycles), 2KB RAM; unified memory simplifies firmware updates and data logging. |
| ADC | 12-bit SAR, 10-channel single-ended, 200 ksps sample rate with internal 1.5/2.0/2.5 V references; supports fast sensor digitization without external refs. |
| Smart Analog Combo | 4 × SAC-L3 modules; each supports OA, PGA (×1–×33), or 12-bit DAC modes with rail-to-rail I/O and programmable hysteresis. |
| Low-Power Modes | LPM3.5: 620 nA (32-kHz crystal active, SVS enabled); LPM4.5: 42 nA (SVS disabled); enables multi-year battery life in intermittent-sensing applications. |
| Serial Interfaces | 2 × eUSCI_A (UART/IrDA/SPI), 2 × eUSCI_B (SPI/I²C); dual protocol support simplifies wired industrial communication and sensor hub integration. |
| Operating Range | –40°C to 105°C, 1.8 V–3.6 V supply; qualified for harsh environments like circuit breakers and smoke detectors. |
Pinout & Package
Package: 38-pin TSSOP (DBT), 9.7 mm × 4.4 mm body size, surface-mount, leaded package with standard JEDEC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC / DVSS | Main power pair | Digital/analog supply and ground; requires 4.7–10 µF bulk + 0.1 µF ceramic decoupling per TI layout guidelines. |
| RST/NMI/SBWTDIO TEST/SBWTCK | Reset & debug interface | 2-wire Spy-Bi-Wire (SBW) programming/debug; NMI supports edge-triggered wake-up from all LPMs. |
| P1.x–P4.x (34 pins) | General-purpose I/O | 32 interrupt-capable pins (P1–P4) enable wake-up from LPM3.5/LPM4.5; GPIOs support peripheral multiplexing (eUSCI, timers, SAC, ADC). |
| XIN / XOUT | LFXT oscillator terminals | Supports external 32.768 kHz crystal for RTC and low-power timing; requires load capacitors per crystal spec. |
| MCLK / SMCLK / ACLK | System clock outputs | Configurable clock distribution; MCLK drives CPU, SMCLK drives peripherals, ACLK derived from REFO/VLO/LFXT for RTC. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 16KB program + 512B data FRAM with ECC, 1015 write endurance, radiation-resistant, nonmagnetic - ideal for frequent data logging in safety-critical systems. |
| Smart Analog Combo (SAC-L3) | Four independent SAC modules each configurable as op-amp, PGA (gain ×1–×33), or 12-bit DAC; eliminates need for discrete signal-chain components. |
| Ultra-Low-Power Operation | 620 nA in LPM3.5 (32-kHz crystal active), 42 nA in LPM4.5 (SVS off); enables >10-year operation on coin-cell batteries in sensor transmitters. |
| Integrated Reference DAC | 6-bit DAC embedded in eCOMP; provides programmable hysteresis and reference voltage for comparators without external parts. |
| Hardware Acceleration | 32-bit hardware multiplier (MPY32) and 16-bit CRC engine accelerate math-intensive tasks (FFT, checksum) and reduce CPU load in real-time firmware. |
Applications
| Smoke and Heat Detectors | Sensor Transmitters |
|---|---|
Use Scenario: Standalone battery-powered smoke alarm with temperature compensation and self-test capability. IC Role / Device Role / Timing Role: Main controller executing smoke algorithm, ADC sampling optical chamber and thermistor, SAC performing analog signal conditioning, RTC managing periodic self-tests. Use Value: FRAM enables reliable event logging across 10+ years; LPM3.5 current (620 nA) extends battery life beyond UL 217 requirements. | Use Scenario: Wireless pressure/temperature transmitter in industrial process control with wired backup interface. IC Role / Device Role / Timing Role: Sensor fusion MCU acquiring analog inputs via ADC and SAC, formatting data via eUSCI_B (I²C to local sensor), and transmitting via eUSCI_A (UART to radio module). Use Value: Four SAC modules replace external op-amps and PGAs, reducing BOM cost and PCB area by >30% versus discrete solutions. |
| Circuit Breakers | Battery Pack Management |
Use Scenario: DIN-rail mounted breaker with overcurrent detection, thermal derating, and fault logging. IC Role / Device Role / Timing Role: Real-time protection controller using ADC for current shunt sensing, SAC for precision gain/offset correction, and FRAM for tamper-proof trip-event storage. Use Value: Extended temperature range (–40°C to 105°C) ensures stable operation inside enclosures; 1015 FRAM writes support lifetime event logging without wear-out. | Use Scenario: Secondary protection IC in Li-ion battery pack monitoring voltage, temperature, and cell balancing status. IC Role / Device Role / Timing Role: Safety monitor acquiring cell voltages via ADC, comparing thresholds with eCOMP, triggering alerts via GPIO, and storing fault history in FRAM. Use Value: Dual comparator architecture (100 ns + 1 µs) enables fast overvoltage detection and low-power periodic monitoring simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2355TDBT | 32KB + 512B FRAM, 4KB RAM, 10-channel ADC, same SAC/eCOMP/peripheral set | Higher memory capacity supports larger firmware (e.g., OTA update stack, extended diagnostics) | Select when firmware complexity or data logging depth exceeds MSP430FR2353TDBT's 16KB FRAM/2KB RAM limits. |
| MSP430FR2153TDBT | No SAC modules; retains 12-bit ADC (10 ch), eCOMP, eUSCI, but lacks programmable-gain op-amps and DAC modes | Suitable for simpler analog front-ends where discrete op-amps or external DACs are acceptable | Choose for cost-sensitive designs without integrated signal-chain flexibility - saves ~$0.30/unit but increases BOM and layout effort. |
Compared with MSP430FR2355TDBT, the MSP430FR2353TDBT offers identical peripheral functionality and SAC capability at half the FRAM/RAM - optimal for constrained-code applications. Versus MSP430FR2153TDBT, it adds four SAC-L3 modules enabling full analog signal chain integration, eliminating up to six passive components per channel.
Availability
MSP430FR2353TDBT is available at Aetrix Electronics and suitable for smoke detectors, sensor transmitters, and circuit breakers requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for MSP430FR2353TDBT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.
The MSP430FR235x product line delivers ultra-low-power mixed-signal MCUs with integrated FRAM and Smart Analog Combo modules, designed specifically for battery-operated sensing, measurement, and industrial monitoring applications demanding reliability across extended temperature ranges.
FAQ
What is the maximum operating frequency of the MSP430FR2353TDBT?
The MSP430FR2353TDBT features a digitally controlled oscillator (DCO) with frequency-locked loop (FLL) that supports up to 24 MHz operation. This maximum frequency is achievable across the full –40°C to 105°C temperature range and 1.8 V–3.6 V supply, with ±1% accuracy at room temperature using the on-chip reference. The MSP430FR2353TDBT maintains timing integrity in real-time control loops without external crystals for core processing.
How many Smart Analog Combo (SAC) modules does the MSP430FR2353TDBT include?
The MSP430FR2353TDBT includes four Smart Analog Combo (SAC-L3) modules. Each SAC can be independently configured as a general-purpose operational amplifier, a programmable-gain amplifier (with noninverting gains ×1, ×2, ×3, ×5, ×9, ×17, ×26, ×33 or inverting gains ×1–×32), or a 12-bit DAC. This capability is exclusive to the MSP430FR235x family and is confirmed for the MSP430FR2353TDBT in the device comparison table and functional block diagram.
What is the standby current consumption of the MSP430FR2353TDBT in LPM3.5 mode?
The MSP430FR2353TDBT consumes 620 nA in LPM3.5 mode with the 32-kHz crystal oscillator active and SVS enabled. This ultra-low quiescent current allows multi-year operation on primary lithium batteries in applications such as wireless sensor nodes and smoke alarms. The value is measured at 3 V and 25°C and is specified in the "Low-Power Mode LPMx.5 Supply Currents" section of the datasheet.
Does the MSP430FR2353TDBT support hardware CRC calculation?
Yes, the MSP430FR2353TDBT includes a dedicated 16-bit cyclic redundancy checker (CRC) peripheral. It computes CRC-16 (IBM polynomial x16 + x15 + x2 + 1) over configurable memory ranges, accelerating firmware integrity checks and communication frame validation without CPU intervention. This hardware CRC engine is documented in the "Intelligent digital peripherals" feature list and Section 6.10 of the user's guide.
What package type and pin count does the MSP430FR2353TDBT use?
The MSP430FR2353TDBT uses a 38-pin Thin Shrink Small Outline Package (TSSOP), designated DBT in TI's ordering nomenclature. Its body dimensions are 9.7 mm × 4.4 mm, and it provides 34 general-purpose I/O pins. This package is explicitly listed in the Device Information table and pin diagrams for the MSP430FR235x family, confirming mechanical and thermal compatibility with standard TSSOP-38 footprints.
MSP430FR2353TDBT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- MSP430™ FRAM
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR2353TDBT FAQ
1.How can I place an order for MSP430FR2353TDBT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR2353TDBT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR2353TDBT reliable?
The price and inventory of MSP430FR2353TDBT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2353TDBT is usually 5 days.
3.What payment methods are accepted for MSP430FR2353TDBT?
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MSP430FR2353TDBT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR2353TDBT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR2353TDBT?
For technical support, including MSP430FR2353TDBT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2353TDBT requirements.
6.How does Aetrix verify that MSP430FR2353TDBT is sourced from the original manufacturer or authorized distributors?
All MSP430FR2353TDBT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2353TDBT meets industry standards.
7.What is the process for return or replacement of MSP430FR2353TDBT?
All MSP430FR2353TDBT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2353TDBT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR2353TDBT part is unused and in its original packaging.
Return procedure for MSP430FR2353TDBT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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