My Inquiry
My Account
Texas Instruments MSP430FR2353TRSMR
- Part No.:
- MSP430FR2353TRSMR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR2353TRSMR.pdf
- Description:
- IC MCU 16BIT 16KB FRAM 32VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,647
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430FR2353TRSMR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 16KB program FRAM, 512B data FRAM, and 2KB RAM, operating from 1.8 V to 3.6 V across –40°C to 105°C. It integrates four Smart Analog Combo (SAC-L3) modules, a 12-bit 200 ksps ADC, two enhanced comparators, dual eUSCI_A (UART/IrDA/SPI) and dual eUSCI_B (SPI/I²C), and supports smoke detector and sensor transmitter applications.
For engineers reviewing the MSP430FR2353TRSMR datasheet, MSP430FR2353TRSMR pinout, MSP430FR2353TRSMR application, or MSP430FR2353TRSMR equivalent, key selection criteria include its 32-pin VQFN (RSM) package, 28 I/O count, SAC-based analog signal conditioning capability, LPM3.5 current of 620 nA, and FRAM endurance of 10¹⁵ write cycles - all critical for battery-powered industrial sensing designs.
Technical Context
The MSP430FR2353TRSMR implements a 16-bit RISC CPU with 24-MHz DCO+FLL clock system, ±1% accuracy at room temperature, and on-chip REFO, VLO, MODOSC, LFXT, and HFXT support. Its memory subsystem uses ferroelectric RAM with built-in ECC, configurable write protection, and unified program/data/storage addressing.
Peripherals include Timer_B3 (3 CCR), Timer_B7 (7 CCR), RTC counter, 16-bit CRC, MPY32 hardware multiplier, Manchester codec, and interrupt compare controller (ICC) enabling nested hardware interrupts. All four SAC-L3 modules support OA/PGA/DAC modes with rail-to-rail I/O and programmable gain up to ×33.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 24-MHz DCO+FLL; enables sub-10 µs wake from LPM to active mode. |
| Memory | 16KB FRAM program + 512B FRAM data + 2KB RAM; unified memory simplifies firmware updates and data logging. |
| ADC | 12-bit SAR, 12-channel, 200 ksps sample rate with internal 1.5/2.0/2.5 V reference; supports sensor signal digitization without external references. |
| SAC Modules | Four SAC-L3 units; each configurable as rail-to-rail OA, PGA (×1–×33), or 12-bit DAC; reduces BOM by replacing discrete op-amps and DACs. |
| Low-Power Modes | LPM3.5: 620 nA (32-kHz crystal + SVS enabled); LPM4.5: 42 nA (SVS disabled); enables multi-year battery life in wireless sensors. |
| Package & I/O | 32-pin VQFN (RSM), 4 mm × 4 mm; 28 GPIO with interrupt capability on P1–P4; thermal pad must be connected to DVSS. |
| Operating Range | –40°C to 105°C ambient; qualified for industrial smoke detectors, circuit breakers, and battery pack management systems. |
Pinout & Package
Package: 32-pin VQFN (RSM), 4 mm × 4 mm, exposed thermal pad (must be connected to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (P1.0) | UCB0STE / SMCLK / COMP0.0 / A0 / Veref+ | Configurable digital I/O; supports SPI slave select, system clock output, comparator input, analog channel 0, and reference voltage source. |
| 2 (P1.3) | UCB0SOMI / UCB0SCL / OA0+ / A3 | I²C data line or SPI MISO; also serves as non-inverting input for SAC0 operational amplifier and analog input channel 3. |
| 3 (P1.2) | UCB0SIMO / UCB0SDA / TB0TRG / OA0- / A2 / Veref- | I²C data line or SPI MOSI; triggers Timer_B0; inverting input for SAC0; analog channel 2; negative reference voltage terminal. |
| 4 (P1.1) | UCB0CLK / ACLK / OA0O / COMP0.1 / A1 | I²C clock or auxiliary clock source; output of SAC0; comparator output; analog channel 1. |
| 5 (DVCC) | Digital supply voltage | Main power supply (1.8–3.6 V); requires 4.7–10 µF bulk + 0.1 µF ceramic decoupling per TI layout guidelines. |
| 6 (TEST/SBWTCK) | Spy-Bi-Wire clock | JTAG/SBW debug interface clock; used for programming and real-time debugging without full JTAG pins. |
| 7 (RST/NMI/SBWTDIO) | Reset / NMI / SBW data I/O | Active-low reset, non-maskable interrupt, and bidirectional SBW data line for low-pin-count debug access. |
| 8 (DVSS) | Digital ground | Reference ground for DVCC; thermal pad must be soldered to this net for thermal and electrical integrity. |
| 9 (P2.7) | TB0CLK / XIN | Timer_B0 clock source or low-frequency crystal input (LFXT); connects to 32.768 kHz crystal for RTC operation. |
| 10 (P2.6) | MCLK / XOUT | Main system clock output or LFXT crystal output; drives internal 24-MHz DCO when paired with P2.7. |
| 11 (P2.5) | COMP1.0 | Inverting input for enhanced comparator eCOMP1; supports programmable hysteresis and low-power (1.5 µA) or high-speed (100 ns) modes. |
| 12 (P2.4) | COMP1.1 | Non-inverting input for eCOMP1; used with P2.5 for window comparator or threshold detection in smoke sensors. |
| 13 (P4.7) | UCB1SOMI / UCB1SCL | I²C data line (SOMI) or serial clock (SCL); second I²C interface for sensor hub or EEPROM communication. |
| 14 (P4.6) | UCB1SIMO / UCB1SDA | I²C data line (SDA) or SPI MISO; supports dual I²C buses for isolated peripheral domains. |
| 15 (P4.5) | UCB1CLK | I²C clock for UCB1; independent timing control enables concurrent I²C transactions on two buses. |
| 16 (P4.4) | UCB1STE | I²C slave enable; allows selective activation of UCB1 for power-gated sensor interfaces. |
| 17 (P4.3) | UCA1TXD / UCA1SIMO / UCA1TXD | UART transmit or SPI MISO; primary serial interface for host MCU or modem communication. |
| 18 (P4.2) | UCA1RXD / UCA1SOMI / UCA1RXD | UART receive or SPI MISO; complements P4.3 for full-duplex UART or SPI master/slave operation. |
| 19 (P4.1) | UCA1CLK | UART clock or SPI clock; enables synchronous serial communication with external transceivers or sensors. |
| 20 (P4.0) | UCA1STE / ISOTXD / ISORXD | UART slave enable or ISO 7816 smart card interface; supports secure element integration in toll tags. |
| 21 (P2.3) | TB1TRG | Timer_B1 trigger input; synchronizes capture events with external signals like zero-crossing detectors. |
| 22 (P2.2) | TB1CLK | Timer_B1 clock source; configurable for external event counting or gated timing in energy metering. |
| 23 (P2.1) | TB1.2 / COMP1.O | Timer_B1 capture/compare output or eCOMP1 output; drives LED indicators or relay drivers directly. |
| 24 (P2.0) | TB1.1 / COMP0.O | Timer_B1 capture/compare output or eCOMP0 output; supports PWM generation or comparator latch functions. |
| 25 (P1.7) | UCA0TXD / UCA0SIMO / TB0.2 / TDO / OA1+ / A7 / VREF+ | UART transmit, SPI MISO, Timer_B0 output, JTAG test data out, SAC1 non-inverting input, analog channel 7, and reference voltage source. |
| 26 (P1.6) | UCA0RXD / UCA0SOMI / TB0.1 / TDI / TCLK / OA1- / A6 | UART receive, SPI MISO, Timer_B0 capture, JTAG test data in/clock, SAC1 inverting input, analog channel 6. |
| 27 (P1.5) | UCA0CLK / TMS / OA1O / A5 | UART clock, JTAG test mode select, SAC1 output, analog channel 5; enables mixed-signal debug and control. |
| 28 (P1.4) | UCA0STE / TCK / A4 | UART slave enable or JTAG test clock; analog channel 4; supports daisy-chained UART peripherals. |
| 29 (P3.7) | OA3+ | Non-inverting input for SAC3; used in differential sensor amplification (e.g., thermopile or strain gauge). |
| 30 (P3.6) | OA3- | Inverting input for SAC3; pairs with P3.7 for precision instrumentation amplifier configurations. |
| 31 (P3.5) | OA3O | Output of SAC3; drives ADC input or external buffer; supports unity-gain stable operation. |
| 32 (P3.4) | SMCLK | Sub-main clock output; feeds peripherals requiring lower-frequency timing than MCLK (e.g., ADC sampling clock). |
Key Features
| Feature | Design Value |
|---|---|
| Smart Analog Combo (SAC-L3) | Four independent modules, each configurable as OA, PGA (×1–×33), or 12-bit DAC - replaces up to 8 discrete analog components per SAC. |
| Ferroelectric RAM (FRAM) | 16KB program + 512B data FRAM with ECC, 10¹⁵ write endurance, and 125 ns write time - enables real-time data logging without wear leveling. |
| Ultra-Low-Power Operation | LPM3.5 current of 620 nA with 32-kHz crystal and SVS enabled - extends battery life to >10 years in intermittent-sensing applications. |
| Integrated Signal Chain | 12-bit 200 ksps ADC + dual eCOMP + four SACs + 6-bit DAC reference - supports complete analog front-end in single chip for smoke/heat detectors. |
| Industrial Temperature Range | –40°C to 105°C operation - qualified for circuit breaker monitoring, optical module control, and battery pack thermal management. |
| Hardware Acceleration | 32-bit MPY32 multiplier and 16-bit CRC engine - accelerates FFT-based sensor analytics and firmware integrity checks. |
Applications
| Smoke Detector Interface | Sensor Transmitter Node |
|---|---|
Use Scenario: Standalone optical or ionization smoke sensor with local alarm and wired/wireless reporting. IC Role / Device Role / Timing Role: Main controller executing smoke algorithm, driving piezo buzzer, managing RS-485/I²C sensor bus, and maintaining RTC timestamp for event logs. Use Value: SAC-L3 modules condition photodiode signals; FRAM stores decades of event timestamps without degradation; LPM3.5 enables 10+ year battery life. |
Use Scenario: Battery-powered environmental sensor node transmitting temperature, humidity, and CO₂ via LoRaWAN or NB-IoT gateway. IC Role / Device Role / Timing Role: Sensor aggregator, ADC manager, low-power scheduler, and UART-to-modem bridge with Manchester encoding for RF link robustness. Use Value: Dual eUSCI_A/B support simultaneous UART (to modem) and I²C (to sensors); 28 GPIO enable multi-sensor routing; 10¹⁵ FRAM writes ensure reliable field calibration storage. |
| Circuit Breaker Monitoring | Battery Pack Management |
Use Scenario: DIN-rail mounted breaker with current/voltage sensing, thermal monitoring, and trip-event logging. IC Role / Device Role / Timing Role: Real-time analog acquisition frontend, fault logic executor, nonvolatile trip-history logger, and RS-485 communications controller. Use Value: Four SACs configure as current-sense amplifiers and voltage dividers; 12-bit ADC samples at 200 ksps for transient detection; extended temp range ensures reliability at 105°C ambient. |
Use Scenario: Secondary-side BMS in EV or ESS packs performing cell voltage balancing, temperature monitoring, and SOC estimation. IC Role / Device Role / Timing Role: Precision analog monitor for up to 12 cells, FRAM-based state history recorder, SMBus/I²C host for fuel gauge ICs, and thermal shutdown coordinator. Use Value: SAC-L3 modules implement rail-to-rail PGA for mV-level cell voltage measurement; FRAM retains 10+ years of cycle-count and fault logs; LPM4.5 draws only 42 nA during standby. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2355TRSMR | 32KB FRAM + 4KB RAM vs. 16KB + 2KB; identical SAC count, ADC, and package. | Supports larger firmware (e.g., OTA stack + encryption) and deeper data buffers for extended logging. | Select when firmware complexity or data retention depth exceeds MSP430FR2353TRSMR capacity. |
| MSP430FR2153TRSMR | No SAC modules; same FRAM/RAM size, ADC channels reduced to 8, no OA/PGA/DAC signal chain. | Limited to basic sensing without analog front-end integration; requires external op-amps and DACs. | Select only if analog signal conditioning is handled externally and cost reduction outweighs SAC value. |
Compared with MSP430FR2355TRSMR and MSP430FR2153TRSMR, the MSP430FR2353TRSMR delivers optimal balance of integrated analog capability (four SACs), 16KB FRAM for firmware+logs, and 32-pin VQFN footprint - making it the preferred choice for space-constrained, battery-operated industrial sensors requiring self-contained signal conditioning.
Availability
MSP430FR2353TRSMR is available at Aetrix Electronics and suitable for smoke detector interface, sensor transmitter node, and circuit breaker monitoring applications requiring stable component supply, long-term lifecycle assurance, and industrial-temperature-grade performance.
Supply support for MSP430FR2353TRSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430FR235x product line targets ultra-low-power sensing and measurement applications, integrating FRAM, smart analog combos, and industrial-temperature operation to reduce BOM cost and PCB area in battery-powered systems.
FAQ
What is the maximum operating frequency of the MSP430FR2353TRSMR?
The MSP430FR2353TRSMR features a digitally controlled oscillator (DCO) with frequency-locked loop (FLL) capable of running the CPU at up to 24 MHz. This maximum frequency is achievable across the full operating voltage range (1.8 V to 3.6 V) and temperature range (–40°C to 105°C), with ±1% accuracy at room temperature using the on-chip reference.
Does the MSP430FR2353TRSMR support hardware debugging?
Yes, the MSP430FR2353TRSMR supports Spy-Bi-Wire (SBW) debugging via pins TEST/SBWTCK (Pin 6) and RST/NMI/SBWTDIO (Pin 7). This two-wire interface enables full flash programming, real-time breakpointing, and register inspection without requiring a full 4-pin JTAG connector, reducing PCB footprint and debug header cost.
How many analog input channels does the MSP430FR2353TRSMR ADC support?
The MSP430FR2353TRSMR integrates a 12-bit SAR ADC with up to 12 single-ended input channels (A0–A11), as confirmed in the device comparison table for the RSM package variant. Channel mapping is flexible via software configuration, and inputs can be sourced from dedicated pins or internal references including VREF+, Veref+, and Veref−.
What is the purpose of the Smart Analog Combo (SAC) modules in the MSP430FR2353TRSMR?
The MSP430FR2353TRSMR includes four SAC-L3 modules, each configurable as a rail-to-rail operational amplifier, programmable-gain amplifier (gain ×1 to ×33), or 12-bit DAC. These replace discrete analog components in sensor signal chains - for example, amplifying thermistor outputs or generating bias voltages - reducing BOM count, PCB area, and design validation effort.
Is the thermal pad on the MSP430FR2353TRSMR package required to be connected?
Yes, the exposed thermal pad on the 32-pin VQFN (RSM) package of the MSP430FR2353TRSMR must be electrically and thermally connected to DVSS. TI explicitly states this requirement in the pin diagrams and mechanical notes; failure to connect the pad risks thermal overstress, degraded electrical performance, and potential device failure under sustained load.
MSP430FR2353TRSMR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 32-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR2353TRSMR FAQ
1.How can I place an order for MSP430FR2353TRSMR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR2353TRSMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR2353TRSMR reliable?
The price and inventory of MSP430FR2353TRSMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2353TRSMR is usually 5 days.
3.What payment methods are accepted for MSP430FR2353TRSMR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR2353TRSMR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR2353TRSMR?
MSP430FR2353TRSMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR2353TRSMR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR2353TRSMR?
For technical support, including MSP430FR2353TRSMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2353TRSMR requirements.
6.How does Aetrix verify that MSP430FR2353TRSMR is sourced from the original manufacturer or authorized distributors?
All MSP430FR2353TRSMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2353TRSMR meets industry standards.
7.What is the process for return or replacement of MSP430FR2353TRSMR?
All MSP430FR2353TRSMR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2353TRSMR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR2353TRSMR part is unused and in its original packaging.
Return procedure for MSP430FR2353TRSMR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430FR2353TRSMR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
