My Inquiry
My Account
Texas Instruments MSP430FR2355TDBT
- Part No.:
- MSP430FR2355TDBT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
MSP430FR2355TDBT.pdf
- Description:
- IC MCU 16BIT 32KB FRAM 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:350
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430FR2355TDBT from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 32KB program FRAM, 4KB RAM, and four Smart Analog Combo (SAC-L3) modules supporting configurable op-amps and 12-bit DACs. It operates from 1.8 V to 3.6 V across –40°C to 105°C and integrates dual eUSCI_A (UART/IrDA/SPI) and dual eUSCI_B (SPI/I²C) peripherals. It targets sensor signal conditioning and battery-powered industrial sensing nodes requiring nonvolatile memory endurance and analog flexibility.
For engineers reviewing the MSP430FR2355TDBT datasheet, MSP430FR2355TDBT pinout, MSP430FR2355TDBT application, or MSP430FR2355TDBT equivalent, key selection criteria include FRAM write endurance (10¹⁵ cycles), LPM3.5 current (620 nA), SAC-L3 configurability, 12-bit ADC with 200 ksps sampling, and TSSOP-38 package compatibility for space-constrained PCB layouts.
Technical Context
The MSP430FR2355TDBT implements a 16-bit RISC CPU with 24-MHz DCO+FLL clock system, ±1% accuracy at room temperature, and hardware multiplier (MPY32). Its power management includes five low-power modes with sub-µA standby (LPM3: 1.43 µA) and nanoscale shutdown (LPM4.5: 42 nA).
Analog subsystem integration includes one 12-channel 12-bit SAR ADC, two enhanced comparators with integrated 6-bit DAC references, and four SAC-L3 modules-each configurable as rail-to-rail OA, PGA (×1–×33), or 12-bit DAC-enabling mixed-signal signal chain consolidation without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 24-MHz DCO+FLL, ±1% accuracy at 25°C |
| Memory | 32KB FRAM (program + data), 512B data FRAM, 4KB SRAM - unified nonvolatile memory with 10¹⁵ write cycles |
| ADC | 12-bit SAR, 12-channel single-ended, 200 ksps sample rate with internal 1.5/2.0/2.5-V reference |
| Smart Analog | Four SAC-L3 modules: each supports OA, PGA (×1–×33), or 12-bit DAC - eliminates need for discrete op-amps or DACs |
| Low-Power Modes | LPM3: 1.43 µA (32-kHz crystal, SVS enabled); LPM3.5: 620 nA; LPM4.5: 42 nA (SVS disabled) |
| Peripherals | Two eUSCI_A (UART/IrDA/SPI), two eUSCI_B (SPI/I²C), Timer_B3 ×3, Timer_B7 ×1, RTC, CRC16, ICC, MFM codec |
| Package & I/O | TSSOP-38 (9.7 mm × 4.4 mm), 34 GPIOs with interrupt capability on P1–P4 |
Pinout & Package
TSSOP-38 package (9.7 mm × 4.4 mm) with exposed thermal pad connected to DVSS; 34 general-purpose I/O pins distributed across Ports P1–P6, supporting peripheral multiplexing including UART, SPI, I²C, ADC inputs, SAC analog terminals, and timer capture/compare signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (TEST/SBWTCK) | Spy-Bi-Wire Clock | JTAG/SBW debug interface clock input for programming and emulation |
| 2 (RST/NMI/SBWTDIO) | Reset / NMI / Data I/O | Active-low reset, non-maskable interrupt, and bidirectional SBW data line |
| 3 (DVCC) | Digital Supply | Main digital/analog core supply (1.8–3.6 V); requires 4.7–10 µF bulk + 0.1 µF ceramic decoupling |
| 4 (DVSS) | Digital Ground | Reference ground for DVCC; must connect to thermal pad for thermal performance |
| 5 (P1.0/UCB0STE/SMCLK/COMP0.0/A0/Veref+) | Multi-function I/O | Configurable as SPI slave select, system clock output, comparator input, ADC channel 0, or reference voltage source |
| 29 (P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+) | Analog/Digital I/O | UART transmit, SPI master-out, timer capture, JTAG TDO, SAC-L3 OA1 positive input, ADC channel 7, or reference output |
| 33 (P3.7/OA3+) | SAC Analog Input | Positive input terminal for Smart Analog Combo 3 - directly connects to internal programmable-gain amplifier or DAC output |
| 38 (P5.0/TB2.1/MFM.RX/A8) | Peripheral I/O | Timer_B2 capture/compare, Manchester decoder input, or ADC channel 8 - enables time-critical sensor pulse decoding |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 32KB unified program/data memory with 10¹⁵ write endurance, zero write latency, and radiation resistance - enables robust data logging in harsh environments |
| Smart Analog Combo (SAC-L3) | Four independent modules, each configurable as rail-to-rail op-amp, programmable-gain amplifier (×1–×33), or 12-bit DAC - reduces BOM count and PCB area for analog front-ends |
| Ultra-Low-Power Operation | LPM3.5 draws only 620 nA while retaining RTC and backup memory functionality - extends battery life in always-on sensor transmitters |
| Integrated Peripherals | Dual UART/IrDA/SPI (eUSCI_A) and dual SPI/I²C (eUSCI_B) with hardware CRC16 and interrupt compare controller (ICC) - simplifies wired industrial communication stack implementation |
| Extended Temperature Range | Rated for –40°C to 105°C operation - validated for smoke detectors, circuit breakers, and optical modules operating in high-ambient-temperature enclosures |
Applications
| Smoke and Heat Detectors | Sensor Transmitters |
|---|---|
Use Scenario: Standalone battery-powered smoke alarm with CO sensing, temperature monitoring, and wireless alert transmission. IC Role / Device Role / Timing Role: Central MCU managing analog sensor conditioning (via SAC-L3), ADC sampling, FRAM-based event logging, and UART-based RF module control. Use Value: LPM3.5 current of 620 nA enables >5-year battery life; FRAM endurance ensures reliable fire-event timestamp storage over product lifetime. |
Use Scenario: Industrial 4–20 mA loop-powered pressure/temperature transmitter with local diagnostics. IC Role / Device Role / Timing Role: Signal-chain processor performing sensor excitation, ratiometric ADC conversion, SAC-based offset calibration, and HART protocol modulation via UART. Use Value: Integrated SAC-L3 eliminates external op-amps and DACs; 12-bit ADC with internal reference enables <0.1% measurement accuracy without trimming. |
| Circuit Breakers | Battery Pack Management |
Use Scenario: DIN-rail mounted AC circuit breaker with real-time current monitoring, thermal derating, and fault logging. IC Role / Device Role / Timing Role: High-reliability controller executing RMS current calculation (using ROM FFT library), thermal modeling, and nonvolatile trip-event storage in FRAM. Use Value: 20KB ROM library includes optimized FFT and math functions - reduces firmware development time and flash wear from algorithm updates. |
Use Scenario: Multi-cell Li-ion battery pack with cell voltage balancing, temperature monitoring, and SMBus communication. IC Role / Device Role / Timing Role: Safety-critical supervisor handling ADC-based cell voltage sampling, SAC-configured precision reference generation, and eUSCI_B-based SMBus host interface. Use Value: Extended –40°C to 105°C rating supports operation inside battery enclosures; FRAM enables secure, tamper-resistant cycle-count logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2353TDBT | 16KB program FRAM, 2KB RAM, identical SAC-L3, ADC, and peripheral set; same TSSOP-38 package | Lower memory footprint suitable for cost-sensitive sensor nodes with simpler firmware | Select when application firmware fits within 16KB FRAM and no future expansion is anticipated |
| MSP430FR2155TDBT | 32KB FRAM and 4KB RAM like MSP430FR2355TDBT, but lacks SAC-L3 modules; retains 12-bit ADC and comparators | Targeted at pure sensing + communication roles without analog signal chain processing | Choose when SAC-L3 functionality is unnecessary and lower BOM cost is prioritized over analog integration |
Compared with MSP430FR2355TDBT, MSP430FR2353TDBT offers identical analog/peripheral capability at reduced memory cost, while MSP430FR2155TDBT removes SAC-L3 to lower unit price - making the MSP430FR2355TDBT optimal for designs requiring on-chip analog signal conditioning without external components.
Availability
MSP430FR2355TDBT is available at Aetrix Electronics and suitable for smoke detectors, sensor transmitters, and circuit breakers requiring stable component supply, extended temperature operation, and long-term FRAM data integrity.
Supply support for MSP430FR2355TDBT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency, reliability, and system-level innovation.
The MSP430FR2355TDBT belongs to TI's ultra-low-power FRAM MCU value line, designed specifically for cost-sensitive industrial sensing and measurement applications requiring nonvolatile memory endurance, analog integration, and extended temperature operation.
FAQ
What is the maximum operating frequency of the MSP430FR2355TDBT?
The MSP430FR2355TDBT features a digitally controlled oscillator (DCO) with frequency-locked loop (FLL) that delivers up to 24 MHz system clock. This frequency is fully supported across the full operating voltage range (1.8 V to 3.6 V) and temperature range (–40°C to 105°C), enabling deterministic real-time response in time-critical sensor processing tasks. The MSP430FR2355TDBT maintains timing compliance per its datasheet specifications at this speed.
How many Smart Analog Combo (SAC-L3) modules does the MSP430FR2355TDBT include?
The MSP430FR2355TDBT integrates four Smart Analog Combo (SAC-L3) modules - a feature exclusive to the FR235x family. Each SAC-L3 can be independently configured as a rail-to-rail operational amplifier, programmable-gain amplifier (with gains from ×1 to ×33), or 12-bit DAC. This capability allows the MSP430FR2355TDBT to replace multiple discrete analog components in sensor front-end designs.
What is the standby current consumption of the MSP430FR2355TDBT in LPM3 mode?
In LPM3 mode with 32-kHz crystal oscillator active and SVS enabled, the MSP430FR2355TDBT consumes 1.43 µA at 3 V and 25°C. This ultra-low quiescent current enables multi-year battery operation in maintenance-free sensor nodes. The MSP430FR2355TDBT achieves this while retaining full RAM retention, real-time clock operation, and wake-up capability via any of its 32 interrupt-capable I/O pins.
Does the MSP430FR2355TDBT support I²C communication?
Yes, the MSP430FR2355TDBT supports I²C communication through two enhanced USCI_B modules (eUSCI_B0 and eUSCI_B1), both capable of I²C master/slave operation. Pin assignments include P4.7/UCB1SOMI/UCB1SCL and P4.6/UCB1SIMO/UCB1SDA for eUSCI_B1, and P1.3/UCB0SOMI/UCB0SCL and P1.2/UCB0SIMO/UCB0SDA for eUSCI_B0. The MSP430FR2355TDBT also supports SPI and UART on shared pins.
What package type and pin count does the MSP430FR2355TDBT use?
The MSP430FR2355TDBT uses a 38-pin Thin Shrink Small Outline Package (TSSOP-DBT) measuring 9.7 mm × 4.4 mm. It provides 34 general-purpose I/O pins with peripheral multiplexing, including dedicated SAC analog terminals, ADC inputs, UART/SPI/I²C signals, and timer capture/compare functions. The exposed thermal pad must be soldered to DVSS for thermal and electrical integrity.
MSP430FR2355TDBT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- MSP430™ FRAM
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x12b; D/A 4x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR2355TDBT FAQ
1.How can I place an order for MSP430FR2355TDBT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR2355TDBT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR2355TDBT reliable?
The price and inventory of MSP430FR2355TDBT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2355TDBT is usually 5 days.
3.What payment methods are accepted for MSP430FR2355TDBT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR2355TDBT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR2355TDBT?
MSP430FR2355TDBT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR2355TDBT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR2355TDBT?
For technical support, including MSP430FR2355TDBT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2355TDBT requirements.
6.How does Aetrix verify that MSP430FR2355TDBT is sourced from the original manufacturer or authorized distributors?
All MSP430FR2355TDBT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2355TDBT meets industry standards.
7.What is the process for return or replacement of MSP430FR2355TDBT?
All MSP430FR2355TDBT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2355TDBT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR2355TDBT part is unused and in its original packaging.
Return procedure for MSP430FR2355TDBT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430FR2355TDBT Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
