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Texas Instruments MSP430FR2355TDBTR
- Part No.:
- MSP430FR2355TDBTR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
MSP430FR2355TDBTR.pdf
- Description:
- IC MCU 16BIT 32KB FRAM 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,663
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Product details
Overview
MSP430FR2355TDBTR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 32KB program FRAM, 4KB RAM, and four Smart Analog Combo (SAC-L3) modules supporting configurable op-amps and 12-bit DACs. It operates from 1.8 V to 3.6 V across –40°C to 105°C and integrates a 12-bit 200 ksps SAR ADC, two enhanced comparators, dual eUSCI_A (UART/IrDA/SPI) and dual eUSCI_B (SPI/I²C), and Timer_B3/TB7 peripherals - deployed in battery-powered smoke detectors and industrial sensor transmitters.
For engineers reviewing the MSP430FR2355TDBTR datasheet, MSP430FR2355TDBTR pinout, MSP430FR2355TDBTR application, or MSP430FR2355TDBTR equivalent, key selection criteria include its 34-I/O TSSOP-38 package, SAC-L3 analog configurability, FRAM endurance (10¹⁵ writes), LPM3.5 current (620 nA), and extended temperature support for harsh-environment sensing.
Technical Context
The MSP430FR2355TDBTR implements a 16-bit RISC CPU with 24-MHz DCO+FLL clock system, including REFO, VLO, MODOSC, and external HFXT/LFXT support. Its memory architecture unifies 32KB FRAM (with ECC and write protection) and 4KB SRAM, enabling fast nonvolatile data logging without wear leveling.
Four SAC-L3 modules provide per-channel rail-to-rail OA/PGA/DAC functionality with programmable gain (×1–×33), 12-bit reference DAC offset control, and dual power modes - directly replacing discrete signal-chain components in sensor front-ends while maintaining <1.43 µA LPM3 operation with 32.768-kHz crystal.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generator; enables high code efficiency and sub-10 µs wake-from-LPM active transition. |
| Memory | 32KB FRAM + 512B data FRAM + 4KB SRAM; unified nonvolatile storage eliminates flash erase delays and supports 10¹⁵ write cycles. |
| ADC | 12-bit SAR, 12-channel, 200 ksps; includes internal 1.5/2.0/2.5-V references and sample-and-hold for precision sensor digitization. |
| SAC Modules | Four SAC-L3 units; each configurable as PGA (gain ×1–×33), OA, or 12-bit DAC - reduces BOM by integrating analog signal conditioning. |
| Low-Power Modes | LPM3.5: 620 nA (32.768-kHz crystal active); LPM4.5: 42 nA (SVS disabled); enables multi-year battery life in remote sensors. |
| Peripherals | Two eUSCI_A (UART/IrDA/SPI), two eUSCI_B (SPI/I²C), Timer_B3 (3 CCR), Timer_B7 (7 CCR), RTC, CRC16, MPY32 - supports wired industrial comms and time-stamped logging. |
| Operating Range | –40°C to 105°C at 1.8–3.6 V; qualified for smoke detectors, circuit breakers, and battery pack management in demanding thermal environments. |
Pinout & Package
TSSOP-38 package (9.7 mm × 4.4 mm) with 34 general-purpose I/O pins, including 32 interrupt-capable pins (P1–P4) for wake-from-LPM event detection. Thermal pad not present in TSSOP variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC / DVSS | Main digital/analog power pair | Single-supply domain requiring 4.7 µF + 0.1 µF decoupling; powers all digital logic and integrated analog blocks (ADC, SAC, eCOMP). |
| RST/NMI/SBWTDIO | Reset, NMI, and Spy-Bi-Wire debug I/O | Multi-function pin enabling device reset, non-maskable interrupt, and 2-wire JTAG-like programming/debug without dedicated debug header. |
| P1.0–P1.7, P2.0–P2.7, P3.0–P3.7, P4.0–P4.7, P5.0–P5.4, P6.0–P6.6 | Configurable GPIO with peripheral multiplexing | 34 total I/Os support UART (UCA0/UCA1), I²C (UCB0/UCB1), SPI, timer capture/compare, SAC inputs/outputs, and ADC channels - enabling full system integration in compact layout. |
| XIN / XOUT | LFXT crystal oscillator terminals | Supports 32.768-kHz crystal for RTC and LPM3.5 operation; critical for ultra-low-power timekeeping in battery-backed applications. |
| TEST/SBWTCK | Spy-Bi-Wire clock input | Enables in-system programming and real-time debugging using TI's MSP-FET or LaunchPad; no external debugger required for firmware updates. |
Key Features
| Feature | Design Value |
|---|---|
| FRAM Memory | 32KB program + 512B data FRAM with built-in ECC and configurable write protection - enables reliable firmware updates and data logging without flash wear-out concerns. |
| Smart Analog Combo (SAC) | Four independent SAC-L3 modules, each supporting PGA (×1–×33), OA, or 12-bit DAC mode - replaces up to eight discrete analog ICs in sensor signal chains. |
| Ultra-Low-Power Operation | 142 µA/MHz active current; 620 nA LPM3.5 with RTC running - extends battery life to >10 years in intermittent-sampling sensor nodes. |
| Integrated Clock System | On-chip 24-MHz DCO+FLL, REFO, VLO, MODOSC, and external XT support - eliminates need for external crystals in most configurations, reducing BOM and board space. |
| Peripheral Integration | Dual UART/IrDA/SPI (eUSCI_A), dual SPI/I²C (eUSCI_B), Timer_B3/B7, RTC, CRC16, MPY32 - supports complex communication protocols and deterministic real-time control without external co-processors. |
Applications
| Smoke Detectors | Sensor Transmitters |
|---|---|
Use Scenario: Standalone optical or ionization smoke alarm with self-test, battery monitoring, and wireless alert transmission. IC Role / Device Role / Timing Role: Main controller executing smoke algorithm, managing CO/temperature ADC sampling, driving piezo alarm, and handling UART-based RF module interface. Use Value: Extended –40°C to 105°C operation ensures reliability in attic/crawl-space installations; FRAM enables secure event logging without flash degradation over 10+ year lifespan. | Use Scenario: Industrial 4–20 mA or HART-enabled pressure/temperature transmitter with local display and diagnostics. IC Role / Device Role / Timing Role: Sensor signal conditioner (via SAC-L3 PGA/DAC), ADC manager, HART modem controller (using UART + MFM), and loop-power supervisor. Use Value: SAC-L3 eliminates external op-amps and DACs; LPM3.5 current (620 nA) allows continuous sensor biasing while preserving loop power budget. |
| Circuit Breakers | Battery Pack Management |
Use Scenario: DIN-rail mounted AC circuit breaker with overcurrent/short-circuit detection, trip actuation, and energy metering. IC Role / Device Role / Timing Role: Real-time fault analyzer using ADC oversampling, RMS calculation (ROM FFT library), and precise timing via RTC and Timer_B7 for cycle-accurate tripping. Use Value: 24-MHz CPU + MPY32 + ROM FFT library enables on-chip RMS and harmonic analysis; FRAM stores trip logs with timestamp integrity across power loss. | Use Scenario: Multi-cell Li-ion battery pack with cell voltage/temperature monitoring, balancing control, and SMBus/UART host communication. IC Role / Device Role / Timing Role: Analog front-end (ADC + SAC-L3 for precision voltage reference and current sense amplification), state-of-charge estimator, and SMBus slave controller. Use Value: Integrated 12-bit ADC with internal references and SAC-L3 programmable gain enable ±0.5% cell voltage accuracy; FRAM retains calibration data and fault history without backup capacitor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2355TPT | Same core, FRAM, RAM, and peripherals; differs only in 48-pin LQFP (7×7 mm) vs. 38-pin TSSOP (9.7×4.4 mm) package. | Requires PCB redesign due to larger footprint and different pinout; better thermal dissipation for sustained active-mode operation. | Select when board space permits larger package and higher I/O count (44 vs. 34) is needed. |
| MSP430FR2155TDBT | Omits four SAC-L3 modules; retains 32KB FRAM, 4KB RAM, ADC, comparators, and same TSSOP-38 package. | Cannot perform on-chip PGA/DAC signal conditioning; requires external analog components for sensor front-end design. | Select when analog integration is unnecessary and cost reduction is prioritized over signal-chain consolidation. |
Compared with MSP430FR2355TDBTR, the TPT variant offers more I/O and thermal margin but increases board area, while the FR2155TDBT removes SAC-L3 to lower cost - making MSP430FR2355TDBTR the optimal choice for space-constrained, analog-intensive sensing where BOM reduction and extended temperature resilience are critical.
Availability
MSP430FR2355TDBTR is available at Aetrix Electronics and suitable for smoke detectors, industrial sensor transmitters, and battery pack management systems requiring stable component supply, long-term lifecycle assurance, and extended temperature qualification.
Supply support for MSP430FR2355TDBTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer applications.
The MSP430FR2355TDBTR belongs to TI's ultra-low-power FRAM MCU value line, designed specifically for cost-sensitive, battery-operated sensing and measurement systems requiring robust nonvolatile memory, integrated analog, and extended temperature operation.
FAQ
What is the maximum operating frequency of the MSP430FR2355TDBTR?
The MSP430FR2355TDBTR features a digitally controlled oscillator (DCO) with frequency-locked loop (FLL) that delivers a maximum system clock of 24 MHz. This frequency is fully supported across the entire operating voltage range (1.8 V to 3.6 V) and temperature range (–40°C to 105°C), enabling deterministic real-time execution in time-critical sensor and control applications using the MSP430FR2355TDBTR.
How many I/O pins does the MSP430FR2355TDBTR provide in its TSSOP-38 package?
The MSP430FR2355TDBTR in the TSSOP-38 package provides 34 general-purpose I/O pins, distributed across ports P1–P6. Of these, 32 pins (all on P1, P2, P3, and P4) support interrupt generation and can wake the device from all low-power modes including LPM3.5 and LPM4.5 - a key capability for event-driven sensor node designs using the MSP430FR2355TDBTR.
Does the MSP430FR2355TDBTR include hardware support for CRC computation?
Yes, the MSP430FR2355TDBTR integrates a dedicated 16-bit cyclic redundancy checker (CRC) peripheral. It supports both CRC-16-CCITT and CRC-16-IBM polynomials and can compute checksums over memory ranges or data streams in hardware - offloading the CPU and ensuring deterministic, glitch-free error detection for firmware updates and sensor data integrity in the MSP430FR2355TDBTR.
What analog peripherals are integrated into the MSP430FR2355TDBTR beyond the ADC and comparators?
Beyond its 12-bit 12-channel SAR ADC and two enhanced comparators (eCOMP), the MSP430FR2355TDBTR integrates four Smart Analog Combo (SAC-L3) modules. Each SAC-L3 supports programmable-gain amplifier (PGA) mode (gains ×1–×33), operational amplifier (OA) mode, and 12-bit DAC mode - providing on-chip analog signal conditioning previously requiring multiple discrete components in designs based on the MSP430FR2355TDBTR.
Is the MSP430FR2355TDBTR qualified for operation at 105°C?
Yes, the MSP430FR2355TDBTR is fully specified and qualified for continuous operation from –40°C to 105°C across its entire recommended voltage range (1.8 V to 3.6 V). This extended temperature rating is explicitly validated in TI's production test flow and enables reliable deployment in high-ambient environments such as electrical panels, rooftop HVAC units, and automotive under-hood applications using the MSP430FR2355TDBTR.
MSP430FR2355TDBTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x12b; D/A 4x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR2355TDBTR FAQ
1.How can I place an order for MSP430FR2355TDBTR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR2355TDBTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR2355TDBTR reliable?
The price and inventory of MSP430FR2355TDBTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2355TDBTR is usually 5 days.
3.What payment methods are accepted for MSP430FR2355TDBTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR2355TDBTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR2355TDBTR?
MSP430FR2355TDBTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR2355TDBTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR2355TDBTR?
For technical support, including MSP430FR2355TDBTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2355TDBTR requirements.
6.How does Aetrix verify that MSP430FR2355TDBTR is sourced from the original manufacturer or authorized distributors?
All MSP430FR2355TDBTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2355TDBTR meets industry standards.
7.What is the process for return or replacement of MSP430FR2355TDBTR?
All MSP430FR2355TDBTR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2355TDBTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR2355TDBTR part is unused and in its original packaging.
Return procedure for MSP430FR2355TDBTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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