Texas Instruments MSP430FR2355TPT
- Part No.:
- MSP430FR2355TPT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MSP430FR2355TPT.pdf
- Description:
- IC MCU 16BIT 32KB FRAM 48LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:226
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430FR2355TPT from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 32KB FRAM, 4KB RAM, four Smart Analog Combo (SAC-L3) modules, a 12-bit 200-ksps ADC, and dual eUSCI_A/eUSCI_B peripherals. It operates from 1.8 V to 3.6 V across –40°C to 105°C and targets sensor signal conditioning, smoke/heat detection, and battery-powered industrial transmitters.
For engineers reviewing the MSP430FR2355TPT datasheet, MSP430FR2355TPT pinout, MSP430FR2355TPT application, or MSP430FR2355TPT equivalent, key selection criteria include FRAM endurance (1015 writes), LPM3.5 current (620 nA), SAC configurability (PGA ×1–×33), and 44 I/O count in 48-pin LQFP - all critical for energy-constrained sensing systems.
Technical Context
The MSP430FR2355TPT integrates a 24-MHz DCO with FLL, on-chip REFO/VLO/MODOSC, and external HFXT/LFXT support for flexible clock tree configuration. Its power management module enables sub-µA low-power modes including LPM3.5 (620 nA) with RTC and backup memory active while peripherals are disabled.
Four SAC-L3 modules provide hardware-configurable analog functions: each supports rail-to-rail OA, PGA (noninverting ×1–×33, inverting ×1–×32), or 12-bit DAC mode with internal reference. Combined with two enhanced comparators (eCOMP) and 12-channel ADC, this enables integrated signal-chain processing without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 registers and constant generator; enables high code efficiency for real-time sensor firmware. |
| Memory | 32KB program FRAM + 512B data FRAM + 4KB RAM; unified nonvolatile memory eliminates flash erase delays and supports 1015 write cycles. |
| ADC | 12-bit SAR ADC with up to 12 single-ended channels, 200 ksps sample rate, and internal 1.5/2.0/2.5-V references. |
| Smart Analog | Four SAC-L3 modules: each configurable as OA, PGA (gain ×1–×33), or 12-bit DAC; reduces BOM by replacing discrete op-amps and DACs. |
| Low-Power Modes | LPM3.5 draws 620 nA (with SVS enabled, 32-kHz crystal); LPM4.5 draws 42 nA (SVS disabled); enables multi-year battery life in wake-on-event designs. |
| Peripherals | Two eUSCI_A (UART/IrDA/SPI), two eUSCI_B (SPI/I²C), Timer_B3 ×3, Timer_B7 ×1, RTC, CRC16, MPY32, and Manchester codec (MFM). |
| Package & I/O | 48-pin LQFP (7 mm × 7 mm); 44 general-purpose I/O pins with interrupt capability on P1–P4 for wake-from-LPM event detection. |
Pinout & Package
Package: 48-pin LQFP (PT), 7 mm × 7 mm body size, exposed thermal pad not present (LQFP variant). Pinout validated per TI SLASEC4D Figure 4-1 and Section 4.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC / DVSS | Main digital/analog power pair | Single 1.8–3.6 V supply domain; requires 4.7–10 µF bulk + 0.1 µF ceramic decoupling per TI layout guidelines. |
| RST/NMI/SBWTDIO TEST/SBWTCK |
Reset, NMI, and Spy-Bi-Wire debug interface | Enables in-circuit programming and debugging via 2-wire SBW; no external JTAG required. |
| P1.0–P1.7, P2.0–P2.7, P3.0–P3.7, P4.0–P4.7, P5.0–P5.4, P6.0–P6.6 | Configurable GPIO with peripheral multiplexing | 44 total I/Os; P1–P4 support pin-interrupt wake from all LPMs including LPM4.5; supports SAC, ADC, eCOMP, timers, and serial interfaces. |
| XIN / XOUT | LFXT crystal oscillator terminals | Supports 32.768-kHz crystal for RTC and low-power timing; requires external load capacitors per crystal spec. |
| MCLK / SMCLK / ACLK | System clock outputs | Programmable clock sources derived from DCO, REFO, VLO, or external crystals; used for CPU, peripherals, and ADC timing. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 32KB program + 512B data FRAM with built-in ECC, 1015 write endurance, and zero write latency - ideal for frequent data logging in harsh environments. |
| Smart Analog Combo (SAC-L3) | Four independent modules each configurable as programmable-gain amplifier (×1–×33), rail-to-rail op-amp, or 12-bit DAC - replaces up to 8 discrete analog components per module. |
| Ultra-low-power operation | 142 µA/MHz active current; 620 nA LPM3.5 (32-kHz crystal active); 42 nA LPM4.5 - enables >10-year coin-cell operation in intermittent-sensing applications. |
| Integrated signal chain | 12-bit ADC (200 ksps), two eCOMP with 6-bit DAC reference, and SAC modules enable full analog front-end integration - reduces PCB area and component count. |
| Robust clock system | On-chip 24-MHz DCO with FLL, REFO, VLO, MODOSC, plus external HFXT (≤24 MHz) and LFXT support - ensures reliable timing across voltage/temperature variations. |
Applications
| Smoke & Heat Detection | Sensor Signal Conditioning |
|---|---|
|
Use Scenario: Battery-powered residential/commercial smoke detector requiring decade-long operation and self-test capability. IC Role / Device Role / Timing Role: Central MCU managing optical/thermal sensors, driving audible/visual alarms, and executing periodic self-diagnostics using FRAM-stored calibration data. Use Value: FRAM endurance enables daily nonvolatile event logging; LPM3.5 current (620 nA) extends 9-V battery life beyond 10 years; SAC modules condition thermistor and photodiode signals without external op-amps. |
Use Scenario: Industrial pressure/temperature transmitter with analog sensor inputs and 4–20 mA or digital (I²C/UART) output. IC Role / Device Role / Timing Role: Sensor interface MCU performing analog signal amplification, filtering, digitization, linearization, and communication protocol handling. Use Value: Four SAC-L3 modules configure as PGAs for sensor gain scaling and 12-bit DACs for offset trimming; 12-bit ADC provides 0.025% FS resolution; eUSCI_B supports robust I²C sensor readout. |
| Circuit Breaker Monitoring | Optical Module Control |
|
Use Scenario: DIN-rail mounted circuit breaker with real-time current/voltage monitoring, trip logic, and fault logging. IC Role / Device Role / Timing Role: Embedded controller acquiring AC waveform samples via ADC, computing RMS/THD, detecting overcurrent events, and storing fault records in FRAM. Use Value: 200-ksps ADC captures high-frequency transients; 32KB FRAM stores thousands of timestamped fault waveforms; extended –40°C to 105°C rating ensures reliability in panel-mounted enclosures. |
Use Scenario: SFP+ or GPON optical transceiver module requiring precise bias control for laser diodes and monitoring of TEC and photodiode currents. IC Role / Device Role / Timing Role: Analog-intensive controller managing laser bias DACs, TEC driver feedback, and photodiode current measurement with temperature compensation. Use Value: SAC modules operate as precision current-source drivers and transimpedance amplifiers; internal 12-bit DACs set laser bias points; 12-bit ADC measures photodiode output with 2.5-V reference for high SNR. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2353TPT | 16KB FRAM, 2KB RAM, same 48-pin LQFP package and peripheral set; lacks SAC-L3 modules. | Targeted at cost-sensitive sensor nodes where analog integration is minimal or handled externally. | Select when FRAM size and SAC functionality are not required - reduces BOM cost while retaining identical footprint and software compatibility. |
| MSP430FR2155TPT | Same 32KB FRAM/4KB RAM, but only two eCOMP and no SAC-L3 modules; otherwise identical clock/peripheral architecture. | Suitable for simpler analog systems relying on basic comparators and external op-amps rather than integrated signal chains. | Choose when advanced analog integration (SAC) is unnecessary but full FRAM capacity and temperature range are retained. |
Compared with MSP430FR2353TPT and MSP430FR2155TPT, the MSP430FR2355TPT uniquely delivers four SAC-L3 modules for on-chip programmable gain, op-amp, and DAC functionality - enabling higher integration, smaller PCB area, and reduced analog BOM in sensor front-end designs.
Availability
MSP430FR2355TPT is available at Aetrix Electronics and suitable for smoke detectors, industrial sensor transmitters, and circuit breaker monitoring systems requiring stable component supply, extended temperature operation (–40°C to 105°C), and long-term FRAM data retention.
Supply support for MSP430FR2355TPT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with deep expertise in low-power design and industrial-grade reliability.
The MSP430FR2355TPT belongs to TI's ultra-low-power FRAM MCU value line, engineered specifically for sensing and measurement applications demanding extended temperature operation, nonvolatile data logging, and integrated analog signal conditioning.
FAQ
What is the maximum operating frequency and core architecture of the MSP430FR2355TPT?
The MSP430FR2355TPT features a 16-bit RISC CPU with constant generator and operates at up to 24 MHz using its digitally controlled oscillator (DCO) with frequency-locked loop (FLL). This architecture delivers high code efficiency and fast wake-up from low-power modes in under 10 µs, making it ideal for responsive sensor applications where deterministic timing is critical. The MSP430FR2355TPT supports both integer and fractional MCLK prescaling for precise peripheral clocking.
How does the FRAM memory in the MSP430FR2355TPT differ from traditional flash in terms of endurance and write speed?
The MSP430FR2355TPT uses 32KB of ferroelectric RAM (FRAM) with 1015 write cycle endurance and zero write latency - unlike flash, which requires erase-before-write and suffers from limited endurance (typically 104–105 cycles). This enables frequent data logging (e.g., sensor readings every second) for decades without wear-out. The MSP430FR2355TPT also includes built-in error correction code (ECC) and configurable write protection for mission-critical storage.
What analog peripherals are integrated into the MSP430FR2355TPT, and how are they configured?
The MSP430FR2355TPT integrates four Smart Analog Combo (SAC-L3) modules, each configurable as a rail-to-rail operational amplifier, programmable-gain amplifier (noninverting ×1–×33, inverting ×1–×32), or 12-bit DAC with internal reference. It also includes a 12-bit 200-ksps ADC with 12 single-ended channels and two enhanced comparators (eCOMP) with integrated 6-bit DAC references. These are configured via dedicated register sets in the device's memory map, accessible through standard MSP430Ware drivers.
What low-power modes does the MSP430FR2355TPT support, and what is the lowest achievable current draw?
The MSP430FR2355TPT supports six low-power modes (LPM0–LPM4.5). The lowest active-retention mode is LPM3.5, drawing 620 nA at 3 V with 32.768-kHz crystal and SVS enabled - retaining RTC and 32-byte backup memory. The absolute minimum is LPM4.5 (shutdown), consuming 42 nA with SVS disabled. All modes allow wake-up via pin interrupts (P1–P4), RTC alarm, or peripheral events, enabling energy-efficient event-driven operation.
Is the MSP430FR2355TPT pin-compatible with other devices in the MSP430FR235x family, and what development tools are supported?
Yes, the MSP430FR2355TPT in 48-pin LQFP (PT) is pin-compatible with MSP430FR2353TPT, MSP430FR2155TPT, and MSP430FR2153TPT in the same package - sharing identical pin functions and electrical characteristics. Supported tools include the MSP-EXP430FR2355 LaunchPad™ development kit, MSP-TS43048PT target board, Code Composer Studio™ IDE, and free MSP430Ware™ software libraries for rapid firmware development targeting the MSP430FR2355TPT.
MSP430FR2355TPT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-LQFP
- Series:
- MSP430™ FRAM
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 44
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x12b; D/A 4x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR2355TPT FAQ
1.How can I place an order for MSP430FR2355TPT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR2355TPT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR2355TPT reliable?
The price and inventory of MSP430FR2355TPT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR2355TPT is usually 5 days.
3.What payment methods are accepted for MSP430FR2355TPT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR2355TPT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR2355TPT?
MSP430FR2355TPT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR2355TPT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR2355TPT?
For technical support, including MSP430FR2355TPT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR2355TPT requirements.
6.How does Aetrix verify that MSP430FR2355TPT is sourced from the original manufacturer or authorized distributors?
All MSP430FR2355TPT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR2355TPT meets industry standards.
7.What is the process for return or replacement of MSP430FR2355TPT?
All MSP430FR2355TPT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR2355TPT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR2355TPT part is unused and in its original packaging.
Return procedure for MSP430FR2355TPT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430FR2355TPT Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

