Texas Instruments MSP430FR58671IRGZT
- Part No.:
- MSP430FR58671IRGZT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR58671IRGZT.pdf
- Description:
- IC MCU 16BIT 32KB FRAM 48VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:247
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Product details
Overview
MSP430FR58671IRGZT from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 32KB nonvolatile memory, 1KB RAM, 12-bit ADC (16-channel), RTC with calendar/alarm, and dual eUSCI modules supporting UART, SPI, and I²C - deployed in battery-powered sensor nodes and energy-harvesting data loggers.
For engineers reviewing the MSP430FR58671IRGZT datasheet, MSP430FR58671IRGZT pinout, MSP430FR58671IRGZT application, or MSP430FR58671IRGZT equivalent, key selection criteria include FRAM endurance (10¹⁵ writes), LPM3.5 current (0.25 µA typical), I²C bootloader support, 48-pin VQFN package, and RTC operation with 32-kHz crystal.
Technical Context
The MSP430FR58671IRGZT implements the CPUXV2 16-bit RISC core with up to 16-MHz DCO clock, integrated 32-bit hardware multiplier, and three-channel DMA. Its FRAM memory architecture enables simultaneous read/write without erase cycles and eliminates write latency penalties inherent in flash-based MCUs.
It features dual eUSCI peripherals: eUSCI_A0/A1 support UART (with auto-baud detection) and SPI, while eUSCI_B0 supports I²C (multi-address) and SPI - with dedicated BSL pins (P1.6/SDA, P1.7/SCL) for I²C-based firmware updates. The RTC_B module requires LFXT (32-kHz crystal) and operates in LPM3.5.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC, up to 16 MHz - enables deterministic real-time control with low cycle count per instruction. |
| FRAM Size | 32 KB unified nonvolatile memory - stores code, data, and logs without wear leveling or erase blocks. |
| RAM Size | 1 KB SRAM - sufficient for stack, buffers, and real-time variables during active/LPM modes. |
| ADC Resolution | 12-bit SAR with 16 external + 2 internal channels - supports precision sensor interfacing with programmable sample-and-hold. |
| LPM3.5 Current | 0.25 µA typical with RTC running - enables multi-year battery life in always-on timekeeping applications. |
| eUSCI Peripherals | eUSCI_A0/A1 (UART/SPI), eUSCI_B0 (I²C/SPI) - provides flexible serial connectivity; I²C BSL enables secure field firmware updates. |
| Package | VQFN-48 (7 mm × 7 mm) - surface-mount footprint compatible with automated PCB assembly and thermal pad grounding. |
Pinout & Package
VQFN-48 (RGZ) package with exposed thermal pad; TI recommends connecting the pad to DVSS for optimal thermal performance and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/RTCCLK | RTC calibration output | Provides 32-kHz reference signal to external crystal oscillator circuit for precise RTC timing. |
| P1.6/UCB0SDA | I²C data line | Primary SDA pin for eUSCI_B0 I²C interface and hardware BSL - enables in-system programming via I²C master. |
| P1.7/UCB0SCL | I²C clock line | Primary SCL pin for eUSCI_B0 I²C interface and hardware BSL - synchronizes BSL communication and peripheral access. |
| PJ.4/LFXIN | Low-frequency crystal input | Connects to 32-kHz crystal; required for RTC_B operation and LPM3.5 mode entry. |
| PJ.5/LFXOUT | Low-frequency crystal output | Completes crystal oscillator circuit; must be used with PJ.4 to enable RTC and ultra-low-power calendar functions. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 32 KB nonvolatile memory with 125 ns write speed and 10¹⁵ write-cycle endurance - eliminates flash wear-out concerns in frequent-data-logging systems. |
| Real-Time Clock (RTC_B) | Calendar mode with alarm interrupt and LPM3.5 operation - maintains accurate timekeeping at 0.25 µA, enabling wake-up scheduling without CPU intervention. |
| I²C Bootloader (BSL) | Dedicated P1.6 (SDA) and P1.7 (SCL) pins - allows firmware updates over I²C bus without JTAG debugger or UART interface. |
| Capacitive Touch I/O | All GPIO pins support capacitive touch sensing without external components - reduces BOM cost and board space in human-interface designs. |
| Ultra-Low-Power Modes | Seven defined LPMs including LPM4.5 (0.02 µA shutdown) - extends battery life in intermittent-sensing applications like environmental monitors. |
Applications
| Smart Utility Metering | Energy-Harvesting Sensor Node |
|---|---|
Use Scenario: Two-way communication and tariff logging in AMI electricity meters with tamper detection and long-term data retention. IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, managing secure I²C EEPROM writes, and maintaining accurate billing timestamps via RTC_B. Use Value: FRAM's 10¹⁵ write endurance ensures >20 years of daily meter register updates without memory degradation. | Use Scenario: Autonomous temperature/humidity node powered by solar cell + supercapacitor, transmitting data every 15 minutes. IC Role / Device Role / Timing Role: System orchestrator sampling sensors via ADC, storing readings in FRAM, and waking on RTC alarm to transmit via I²C-connected radio module. Use Value: LPM3.5 current (0.25 µA) minimizes quiescent drain, enabling reliable operation under low-light harvesting conditions. |
| Wearable Health Monitor | Industrial Data Logger |
Use Scenario: Compact wrist-worn device measuring heart rate variability and motion using analog front-end and accelerometer. IC Role / Device Role / Timing Role: Signal processor acquiring ADC samples, performing real-time filtering, and timestamping events using RTC calendar registers. Use Value: Unified FRAM memory simplifies firmware design by eliminating separate code/data/EEPROM memory management layers. | Use Scenario: Ruggedized enclosure logging vibration, temperature, and pressure in factory equipment with scheduled USB or SD-card offload. IC Role / Device Role / Timing Role: Standalone logger capturing high-frequency sensor bursts into FRAM, then compressing and transferring batches via UART or I²C host interface. Use Value: Fast 125 ns FRAM writes prevent data loss during burst acquisition, unlike flash-based MCUs requiring erase-before-write delays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5867IRGZT | Identical FRAM/RAM size, pinout, and peripherals but UART BSL (P2.0/P2.1) instead of I²C BSL. | Suitable where UART-based firmware update infrastructure already exists; lacks native I²C BSL capability. | Select when UART debug/programming channel is preferred and I²C BSL is not required. |
| MSP430FR58471IRHAT | 32KB FRAM/1KB RAM, 40-pin VQFN, LFXT-only (no HFXT), 14 ADC inputs, I²C BSL - same BSL interface but smaller package and reduced analog channel count. | Better suited for space-constrained, low-channel-count sensor nodes without high-frequency crystal needs. | Select for compact designs needing I²C BSL and lower pin count, accepting fewer ADC channels and no HFXT support. |
Compared with MSP430FR5867IRGZT, the MSP430FR58671IRGZT enables secure I²C-based field updates without UART routing; versus MSP430FR58471IRHAT, it offers 48-pin layout flexibility, full 16-channel ADC, and HFXT support for higher-speed system clocks.
Availability
MSP430FR58671IRGZT is available at Aetrix Electronics and suitable for smart metering, energy-harvesting sensor nodes, and wearable electronics requiring stable component supply across multi-year production cycles.
Supply support for MSP430FR58671IRGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The MSP430 ULP FRAM portfolio targets energy-constrained applications demanding nonvolatile memory endurance, ultra-low standby current, and integrated mixed-signal peripherals - designed specifically for battery-operated and energy-harvesting systems.
FAQ
What is the primary memory technology used in the MSP430FR58671IRGZT?
The MSP430FR58671IRGZT uses ferroelectric RAM (FRAM) for its 32KB main memory. This nonvolatile technology combines the speed and endurance of SRAM with the data retention of flash, enabling 125 ns writes and 10¹⁵ write cycles. Unlike flash, FRAM requires no erase cycles, allowing true simultaneous read/write operations - critical for reliable data logging in the MSP430FR58671IRGZT.
Does the MSP430FR58671IRGZT support real-time clock functionality with calendar and alarm features?
Yes, the MSP430FR58671IRGZT integrates the RTC_B module with full calendar and alarm capabilities. It operates in LPM3.5 mode at 0.25 µA typical current when driven by a 32-kHz crystal connected to PJ.4/LFXIN and PJ.5/LFXOUT. The MSP430FR58671IRGZT RTC supports time-of-day tracking, date, month, year, and programmable alarms - all retained during ultra-low-power sleep states.
Which serial interfaces does the MSP430FR58671IRGZT support, and how is the bootloader accessed?
The MSP430FR58671IRGZT supports UART, SPI, and I²C via two eUSCI_A modules (A0/A1) and one eUSCI_B module (B0). Its hardware bootloader (BSL) is I²C-only, using dedicated pins P1.6 (BSLSDA) and P1.7 (BSLSCL). This allows firmware updates over I²C without requiring UART lines or JTAG, making the MSP430FR58671IRGZT ideal for sealed or space-constrained deployments.
What package type and pin count does the MSP430FR58671IRGZT use?
The MSP430FR58671IRGZT is packaged in a 48-pin VQFN (RGZ) with 7 mm × 7 mm body size and an exposed thermal pad. Pin assignments match the MSP430FR586x family, including dedicated LFXIN/LFXOUT for RTC, HFXIN/HFXOUT for high-frequency crystal, and I²C BSL pins. TI specifies connection of the thermal pad to DVSS for thermal and electrical stability in the MSP430FR58671IRGZT.
How does the MSP430FR58671IRGZT achieve ultra-low power consumption in standby modes?
The MSP430FR58671IRGZT achieves ultra-low power via seven optimized low-power modes (LPMs), including LPM3.5 (0.25 µA with RTC) and LPM4.5 (0.02 µA shutdown). Its FRAM eliminates flash erase overhead, and intelligent peripherals like DMA allow autonomous sensor data movement without CPU wake-up. These features collectively extend battery life in applications such as environmental monitoring - a defining characteristic of the MSP430FR58671IRGZT.
MSP430FR58671IRGZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR58671IRGZT FAQ
1.How can I place an order for MSP430FR58671IRGZT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR58671IRGZT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR58671IRGZT reliable?
The price and inventory of MSP430FR58671IRGZT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR58671IRGZT is usually 5 days.
3.What payment methods are accepted for MSP430FR58671IRGZT?
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MSP430FR58671IRGZT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR58671IRGZT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR58671IRGZT?
For technical support, including MSP430FR58671IRGZT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR58671IRGZT requirements.
6.How does Aetrix verify that MSP430FR58671IRGZT is sourced from the original manufacturer or authorized distributors?
All MSP430FR58671IRGZT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR58671IRGZT meets industry standards.
7.What is the process for return or replacement of MSP430FR58671IRGZT?
All MSP430FR58671IRGZT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR58671IRGZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR58671IRGZT part is unused and in its original packaging.
Return procedure for MSP430FR58671IRGZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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