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Texas Instruments MSP430FR5867IRGZR
- Part No.:
- MSP430FR5867IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR5867IRGZR.pdf
- Description:
- IC MCU 16BIT 32KB FRAM 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,480
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Product details
Overview
MSP430FR5867IRGZR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 32KB nonvolatile memory, 1KB RAM, and integrated 12-bit ADC, RTC, and five 16-bit timers. It operates from 1.8 V to 3.6 V and supports HFXT/LFXT crystal oscillators. Used in battery-powered data loggers requiring long-term retention and low-active-current operation.
For engineers reviewing the MSP430FR5867IRGZR datasheet, MSP430FR5867IRGZR pinout, MSP430FR5867IRGZR application, or MSP430FR5867IRGZR equivalent, key selection criteria include FRAM endurance (10¹⁵ writes), LPM3.5 current (0.25 µA), RTC calendar support, 48-pin VQFN package, and UART/I²C eUSCI peripherals.
Technical Context
The MSP430FR5867IRGZR implements the CPUXV2 16-bit RISC core with hardware multiplier and 3-channel DMA. Its clock system includes DCO (10 factory-trimmed frequencies), VLO, LFXT (32 kHz), and HFXT (up to 16 MHz), enabling precise timing across power modes.
Peripherals include ADC12_B (16 external analog inputs, internal reference), Comp_E (16-channel comparator), RTC_B (calendar/alarm, requires LFXT), and dual eUSCI modules: eUSCI_A0/A1 (UART/IrDA/SPI) and eUSCI_B0 (I²C/SPI). The device lacks AES but includes MPU and IP encapsulation for code security.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC with 32-bit hardware multiplier - enables fast math-intensive sensor processing without external coprocessor |
| FRAM Size | 32 KB unified nonvolatile memory - eliminates write latency and wear leveling overhead; retains data without power |
| RAM Size | 1 KB SRAM - sufficient for real-time stack and buffer operations during active mode |
| Supply Voltage | 1.8 V to 3.6 V - supports direct connection to single Li-ion or two alkaline cells |
| LPM3.5 Current | 0.25 µA typical - enables >10-year battery life in RTC-only wake-up applications |
| ADC Resolution | 12-bit SAR with internal reference - delivers ±1 LSB INL for precision analog sensing without external voltage reference |
| Timer Count | Five 16-bit timers (TA0–TA3, TB0) - provides flexible PWM generation, capture/compare, and interval timing for multi-sensor synchronization |
Pinout & Package
VQFN-48 (RGZ) package, 7 mm × 7 mm body size, exposed thermal pad recommended to be connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF- | Multi-function I/O | Primary RTC calibration output and ADC channel A0 input - enables time-stamped analog acquisition |
| P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+ | Multi-function I/O | Positive reference output and comparator output - supports ratiometric sensor measurements |
| PJ.4/LFXIN & PJ.5/LFXOUT | Crystal oscillator terminals | Required for RTC_B calendar operation - must connect 32.768 kHz crystal with load capacitance matching |
| PJ.6/HFXIN & PJ.7/HFXOUT | Crystal oscillator terminals | Supports high-frequency timing up to 16 MHz - enables fast active-mode processing and USB-like communication rates |
| RST/NMI/SBWTDIO | Reset/debug interface | Combined reset and Spy-Bi-Wire debug I/O - allows in-system programming with minimal footprint |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 32 KB unified memory with 125 ns write speed and 10¹⁵ write endurance - enables frequent logging without flash wear-out |
| Ultra-Low-Power Modes | LPM3.5 at 0.25 µA with RTC running - supports calendar-triggered wake-up every second or hour with sub-microamp quiescent draw |
| Capacitive Touch I/O | All GPIO pins support CSD without external components - reduces BOM cost and PCB area for user interface integration |
| eUSCI Peripherals | eUSCI_A0/A1 (UART/IrDA/SPI) + eUSCI_B0 (I²C/SPI) - provides dual serial interfaces for sensor hub and host communication simultaneously |
| Hardware Security | Memory Protection Unit (MPU) with IP encapsulation - prevents unauthorized read-out of firmware and sensitive configuration data |
Applications
| Smart Utility Metering | Energy-Harvesting Sensor Node |
|---|---|
Use Scenario: Tamper-resistant electricity/water meter with hourly consumption logging and RF transmission. IC Role / Device Role / Timing Role: Main controller managing metrology ADC sampling, FRAM-based secure data storage, and RTC-driven transmission scheduling. Use Value: 32KB FRAM ensures 10+ years of daily logs without degradation; LPM3.5 current enables >15-year battery life on primary cell. | Use Scenario: Solar-powered environmental monitor measuring temperature, humidity, and light intensity every 5 minutes. IC Role / Device Role / Timing Role: System-on-chip handling energy harvesting management, sensor interfacing, and burst-mode wireless transmission. Use Value: Unified FRAM simplifies firmware updates and data buffering; RTC_B calendar enables precise duty-cycling aligned to solar availability. |
| Wearable Health Monitor | Industrial Data Logger |
Use Scenario: Chest-worn ECG patch recording raw analog waveforms and detecting arrhythmia events. IC Role / Device Role / Timing Role: Real-time signal processor with ADC oversampling, digital filtering, and event-triggered FRAM storage. Use Value: 12-bit ADC with internal reference ensures consistent measurement accuracy; capacitive touch I/O enables buttonless UI control. | Use Scenario: Ruggedized vibration/temperature logger deployed in factory machinery for predictive maintenance. IC Role / Device Role / Timing Role: Autonomous data acquisition unit with timestamped sensor reads, CRC-verified storage, and scheduled USB upload. Use Value: 16-bit CRC hardware module validates integrity of 32KB FRAM logs; wide supply range (1.8–3.6 V) accommodates aging industrial batteries. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5868IRGZR | 48 KB FRAM, 2 KB RAM - larger memory footprint for extended firmware or data buffers | Better suited for applications requiring local FFT processing or multi-day unattended logging | Select when firmware complexity or data retention depth exceeds 32 KB capacity |
| MSP430FR58671IRGZR | Same FRAM/RAM, but I²C-capable BSL (P1.6/P1.7) instead of UART BSL (P2.0/P2.1) | Preferred where I²C host interface is already present and UART lines are constrained | Choose when system-level BSL access must use existing I²C bus rather than dedicated UART pins |
Compared with MSP430FR5868IRGZR and MSP430FR58671IRGZR, the MSP430FR5867IRGZR offers optimal balance of memory size, peripheral set, and BSL interface for cost-sensitive, long-life sensor nodes where 32 KB FRAM suffices and UART-based field updates are acceptable.
Availability
MSP430FR5867IRGZR is available at Aetrix Electronics and suitable for smart utility metering, energy-harvesting sensor nodes, and wearable electronics requiring stable component supply over extended production lifecycles.
Supply support for MSP430FR5867IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The MSP430 ULP FRAM portfolio targets energy-constrained applications demanding nonvolatile memory endurance, ultra-low sleep current, and integrated analog peripherals - designed specifically for battery-powered sensing and data logging systems.
FAQ
What is the maximum operating frequency of the MSP430FR5867IRGZR?
The MSP430FR5867IRGZR supports up to 16 MHz via its high-frequency crystal oscillator (HFXT). Its digitally controlled oscillator (DCO) offers 10 factory-trimmed frequencies, with the highest at 16 MHz. This enables real-time processing of sensor data streams while maintaining compatibility with standard UART baud rates and SPI clocking requirements. The device achieves this performance within its 1.8–3.6 V supply range.
Does the MSP430FR5867IRGZR include a real-time clock (RTC) module?
Yes, the MSP430FR5867IRGZR includes the RTC_B module with calendar and alarm functions. It requires an external 32.768 kHz crystal connected to PJ.4/LFXIN and PJ.5/LFXOUT to operate. In LPM3.5 mode, the RTC_B consumes only 0.25 µA typical, enabling precise timekeeping and wake-up scheduling for long-duration battery applications. The RTC clock calibration output is available on P1.0.
What type of nonvolatile memory does the MSP430FR5867IRGZR use, and what are its key advantages?
The MSP430FR5867IRGZR uses ferroelectric RAM (FRAM) - 32 KB of unified, nonvolatile memory. Unlike flash, FRAM supports 125 ns per-word writes, zero write latency, and 10¹⁵ write cycles. It eliminates the need for wear leveling or erase-before-write routines, making it ideal for frequent data logging, firmware updates, and parameter storage in mission-critical embedded systems.
Which communication interfaces are supported by the MSP430FR5867IRGZR?
The MSP430FR5867IRGZR integrates two eUSCI modules: eUSCI_A0 and eUSCI_A1 support UART, IrDA, and SPI; eUSCI_B0 supports I²C and SPI. This allows concurrent use of UART for host debugging and I²C for sensor communication. The BSL (bootloader) uses UART on P2.0/P2.1, and all eUSCI modules support automatic baud-rate detection and hardware flow control.
What is the package type and pin count of the MSP430FR5867IRGZR?
The MSP430FR5867IRGZR is housed in a 48-pin VQFN package (RGZ), measuring 7 mm × 7 mm with an exposed thermal pad. Pinout matches other RGZ-packaged MSP430FR586x devices, ensuring layout compatibility across family variants. TI recommends connecting the thermal pad to DVSS for optimal thermal performance and electrical stability.
MSP430FR5867IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5867IRGZR FAQ
1.How can I place an order for MSP430FR5867IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5867IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5867IRGZR reliable?
The price and inventory of MSP430FR5867IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5867IRGZR is usually 5 days.
3.What payment methods are accepted for MSP430FR5867IRGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR5867IRGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR5867IRGZR?
MSP430FR5867IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5867IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5867IRGZR?
For technical support, including MSP430FR5867IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5867IRGZR requirements.
6.How does Aetrix verify that MSP430FR5867IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430FR5867IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5867IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430FR5867IRGZR?
All MSP430FR5867IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5867IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5867IRGZR part is unused and in its original packaging.
Return procedure for MSP430FR5867IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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