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Texas Instruments MSP430FR5869IRGZR

Part No.:
MSP430FR5869IRGZR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixMSP430FR5869IRGZR.pdf
Description:
IC MCU 16BIT 64KB FRAM 48VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,079

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Product details

Overview

MSP430FR5869IRGZR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 64KB ferroelectric RAM (FRAM), 2KB SRAM, 16-channel 12-bit ADC, real-time clock with calendar, and dual eUSCI modules supporting UART, SPI, and I²C. It operates from 1.8 V to 3.6 V and targets battery-powered metering and sensor node applications.

For engineers reviewing the MSP430FR5869IRGZR datasheet, MSP430FR5869IRGZR pinout, MSP430FR5869IRGZR application, or MSP430FR5869IRGZR equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LPM3.5 RTC current (0.25 µA typical), 48-pin VQFN package (7 mm × 7 mm), and integrated capacitive touch I/O without external components.

Technical Context

The MSP430FR5869IRGZR implements the CPUXV2 16-bit RISC core with hardware multiplier and three-channel DMA, enabling deterministic real-time processing. Its clock system integrates DCO (10 factory-trimmed frequencies), LFXT (32-kHz crystal), and HFXT (high-frequency crystal) for flexible timing across active and low-power modes.

Peripherals include five 16-bit timers (TA0–TA3, TB0), RTC_B with alarm/calendar, 16-channel analog comparator (Comp_E), and eUSCI_A0/A1 (UART/IrDA/SPI) plus eUSCI_B0 (I²C/SPI), all accessible via multiplexed I/O pins in the 48-pin RGZ package.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureCPUXV2 16-bit RISC with 16 registers and 32-bit hardware multiplier
Nonvolatile Memory64KB FRAM: unified program/data/storage space with 125 ns/word write speed
RAM2KB SRAM for high-speed variable storage and stack operations
ADC12-bit SAR ADC with 16 external + 2 internal input channels and integrated reference
Low-Power ModesLPM3.5 (RTC active): 0.25 µA typical; LPM4.5 (shutdown): 0.02 µA typical
PackageVQFN-48 (RGZ), 7 mm × 7 mm, thermal pad recommended to DVSS
Supply Voltage1.8 V to 3.6 V - supports direct Li-ion/Li-poly battery operation without regulator

Pinout & Package

The MSP430FR5869IRGZR is housed in a 48-pin VQFN (RGZ) package with exposed thermal pad. Pin assignment follows TI's standard multiplexing scheme for I/O, peripherals, and debug interfaces.

Pin/TerminalCircuit RoleDesign Meaning
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0Multi-function I/ORTC calibration output, ADC channel A0, comparator C0, TA0 capture/compare, DMA trigger
P2.0/TB0.6/UCA0TXD/UCA0SIMOSerial interface I/OPrimary UART TX for eUSCI_A0; also TB0 clock source and PWM output
P1.6/TB0.3/UCB0SIMO/UCB0SDAI²C slave data lineConfigurable as SPI MISO or I²C SDA - enables dual-protocol peripheral interfacing
PJ.4/LFXIN & PJ.5/LFXOUTCrystal oscillator terminalsSupports 32-kHz crystal for RTC_B operation and low-power timing
PJ.6/HFXIN & PJ.7/HFXOUTHigh-frequency crystal terminalsEnables up to 16-MHz system clock via HFXT oscillator
RST/NMI/SBWTDIOReset/debug I/OThree-in-one pin: reset assertion, non-maskable interrupt, and Spy-Bi-Wire debug I/O

Key Features

FeatureDesign Value
Ferroelectric RAM (FRAM)64KB unified memory with 10¹⁵ write endurance and 125 ns write latency - eliminates flash wear-out concerns in frequent logging
Ultra-low-power RTC0.25 µA typical in LPM3.5 mode with calendar/alarm - enables decade-scale battery life in time-stamped sensor nodes
Capacitive touch I/OAll GPIO pins support CTSI-based touch sensing without external RC networks - reduces BOM cost and PCB area
eUSCI peripheralsDual eUSCI_A (UART/IrDA/SPI) + eUSCI_B (I²C/SPI) - supports simultaneous wired communication protocols
Power managementSeven low-power modes including LPM4.5 (0.02 µA shutdown) - extends runtime in energy-harvested systems

Applications

Smart Electricity MeteringEnergy-Harvested Sensor Node

Use Scenario: Bidirectional kWh measurement with tamper detection and time-of-use billing.

IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, managing secure firmware updates, and maintaining accurate time via RTC_B.

Use Value: FRAM enables reliable, high-cycle energy data logging; LPM3.5 RTC ensures precise billing intervals without draining coin-cell backup.

Use Scenario: Wireless environmental monitor powered by solar cell or thermoelectric generator.

IC Role / Device Role / Timing Role: System-on-chip managing sensor sampling, data compression, and low-duty-cycle RF transmission.

Use Value: 0.02 µA LPM4.5 shutdown minimizes quiescent drain; FRAM allows instant write-on-interrupt for transient event capture.

Wearable Health MonitorIndustrial Data Logger

Use Scenario: Compact wrist-worn device measuring heart rate, motion, and skin temperature.

IC Role / Device Role / Timing Role: Sensor hub aggregating analog/digital inputs, performing local signal conditioning, and managing BLE connectivity.

Use Value: Integrated 16-channel ADC and comparator reduce external signal chain components; capacitive touch I/O enables buttonless UI.

Use Scenario: Ruggedized field logger recording temperature, pressure, and vibration at configurable intervals.

IC Role / Device Role / Timing Role: Autonomous data acquisition unit with timestamped storage and watchdog-secured operation.

Use Value: 64KB FRAM stores >100,000 timestamped samples; CRC16 module validates integrity of stored datasets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430FR5868IRGZR48KB FRAM, same package and peripheral set; lacks 16KB FRAM capacity of MSP430FR5869IRGZRSuitable where firmware size and data logging depth are reduced - e.g., simpler sensor nodes with shorter retentionSelect when application code + data footprint fits within 48KB FRAM and cost optimization is prioritized
MSP430FR5969IPZ64KB FRAM, 2KB RAM, but 100-pin TQFP (PZ) package; adds USB and enhanced LCD supportBetter suited for human-interface devices requiring display drivers or host connectivity - not drop-in compatibleChoose only if board redesign accommodates larger footprint and USB/LCD features justify migration

Compared with MSP430FR5868IRGZR, the MSP430FR5869IRGZR provides 16KB additional FRAM for extended data buffering; versus MSP430FR5969IPZ, it offers identical memory and core specs in a smaller, lower-cost 48-pin VQFN - ideal for space-constrained, battery-operated designs.

Availability

MSP430FR5869IRGZR is available at Aetrix Electronics and suitable for smart metering, energy-harvested sensor nodes, and wearable electronics requiring stable component supply and long-term industrial availability.

Supply support for MSP430FR5869IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The MSP430FR5869IRGZR belongs to TI's ULP FRAM microcontroller product line, engineered specifically for energy-constrained applications demanding nonvolatile memory endurance, sub-µA real-time operation, and integrated analog peripherals.

FAQ

What is the maximum operating frequency of the MSP430FR5869IRGZR?

The MSP430FR5869IRGZR supports a maximum system clock frequency of 16 MHz using the high-frequency crystal oscillator (HFXT). The internal DCO provides 10 factory-trimmed frequencies up to 16 MHz, and the CPUXV2 core executes instructions at this rate with single-cycle access to FRAM and SRAM - enabling real-time control loops and fast ADC sampling without wait states.

Does the MSP430FR5869IRGZR support hardware encryption?

No, the MSP430FR5869IRGZR does not include dedicated AES or cryptographic acceleration hardware. It provides a random number seed register for software-based RNG algorithms but lacks on-die encryption engines. For secure boot or data-at-rest protection, external ICs or software libraries must be implemented - unlike later MSP430FR59xx or MSP430FR6xx devices that integrate AES-128 modules.

Can the MSP430FR5869IRGZR operate without an external crystal?

Yes, the MSP430FR5869IRGZR can operate using its internal digitally controlled oscillator (DCO) with 10 factory-trimmed frequencies ranging from ~100 kHz to 16 MHz. External crystals (LFXT for RTC, HFXT for high-speed clocks) are optional - the device achieves full functionality, including LPM3.5 RTC operation, only when LFXT is connected to PJ.4/PJ.5.

What debug interface does the MSP430FR5869IRGZR use?

The MSP430FR5869IRGZR uses the two-wire Spy-Bi-Wire (SBW) interface via RST/NMI/SBWTDIO and TEST/SBWTCK pins. This interface supports full JTAG-like debugging - including breakpoints, register inspection, and flash programming - using TI's MSP-FET or compatible tools. No external debug header is required, simplifying board layout and reducing cost.

Is the MSP430FR5869IRGZR pin-compatible with other devices in the FR58xx family?

Yes, the MSP430FR5869IRGZR shares identical pinout and package (48-pin VQFN, RGZ) with MSP430FR5868IRGZR, MSP430FR5867IRGZR, and MSP430FR58671IRGZR. All share the same peripheral mapping and electrical characteristics, enabling hardware reuse across variants - for example, upgrading FRAM capacity from 32KB to 64KB without PCB changes.

MSP430FR5869IRGZR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
48-VFQFN Exposed Pad
Series:
MSP430™ FRAM
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FRAM
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430FR5869IRGZR FAQ

1.How can I place an order for MSP430FR5869IRGZR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430FR5869IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430FR5869IRGZR reliable?

The price and inventory of MSP430FR5869IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5869IRGZR is usually 5 days.

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4.How is shipping managed for MSP430FR5869IRGZR?

MSP430FR5869IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430FR5869IRGZR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430FR5869IRGZR?

For technical support, including MSP430FR5869IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5869IRGZR requirements.

6.How does Aetrix verify that MSP430FR5869IRGZR is sourced from the original manufacturer or authorized distributors?

All MSP430FR5869IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5869IRGZR meets industry standards.

7.What is the process for return or replacement of MSP430FR5869IRGZR?

All MSP430FR5869IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5869IRGZR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430FR5869IRGZR part is unused and in its original packaging.

Return procedure for MSP430FR5869IRGZR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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