Texas Instruments MSP430FR5870IRGCR
- Part No.:
- MSP430FR5870IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR5870IRGCR.pdf
- Description:
- IC MCU 16BIT 32KB FRAM 64VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430FR5870IRGCR from Texas Instruments is an ultra-low-power 16-bit FRAM microcontroller featuring 32KB nonvolatile memory, 2KB RAM, 16-MHz DCO clock, 8-channel 12-bit ADC, and dual eUSCI modules (UART/IrDA/SPI + I²C/SPI). It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes requiring RTC calendar, capacitive touch I/O, and deterministic low-power mode transitions.
For engineers reviewing the MSP430FR5870IRGCR datasheet, MSP430FR5870IRGCR pinout, MSP430FR5870IRGCR application, or MSP430FR5870IRGCR equivalent, key selection criteria include LPM3.5 current (0.35 µA), FRAM endurance (10¹⁵ writes), absence of AES256, and VQFN-64 package compatibility with energy-harvesting and wearable designs.
Technical Context
The MSP430FR5870IRGCR implements a CPUXV2 core with unified FRAM memory space, enabling atomic read-modify-write operations without erase cycles. Its clock system integrates DCO with factory-trimmed frequencies, LFXT for 32-kHz RTC operation, and HFXT support - all managed via software-controlled low-power modes including LPM4.5 (0.04 µA).
Peripherals include three 16-bit timers (TA0–TA3, TB0) with capture/compare, 32-bit hardware multiplier, CRC16/CRC32 engines, and eUSCI_A0/A1 (UART/IrDA/SPI) plus eUSCI_B0/B1 (I²C/SPI). The device lacks AES256 encryption per documentation note and supports capacitive touch on all I/O pins without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit CPUXV2 RISC core with 16 general-purpose registers; enables deterministic real-time execution and low-cycle-count interrupt latency. |
| FRAM Capacity | 32 KB nonvolatile memory with 125 ns write time per word; eliminates flash wear-out and enables true EEPROM-like usage patterns. |
| Supply Voltage Range | 1.8 V to 3.6 V; minimum voltage constrained by SVS thresholds - critical for brownout resilience in energy-harvested systems. |
| LPM3.5 Current | 0.35 µA typical with RTC active; enables multi-year battery life in calendar-aware data loggers and metering applications. |
| ADC Resolution | 12-bit SAR ADC with internal reference and sample-and-hold; supports up to 8 external analog inputs for sensor signal acquisition. |
| eUSCI Interfaces | Dual eUSCI_A (UART/IrDA/SPI) and dual eUSCI_B (I²C/SPI); provides flexible serial connectivity without external level shifters or protocol converters. |
| Timer Resources | Five 16-bit timers (TA0–TA3, TB0) with up to seven capture/compare registers; supports PWM generation, input capture, and time-stamped event logging. |
Pinout & Package
VQFN-64 package (9 mm × 9 mm) with exposed thermal pad; TI recommends connecting thermal pad to DVSS for optimal thermal performance and electrical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0 / P1.1 / P1.2 / P1.3 | Analog Input / VREF+/− / RTCCLK / DMAE0 | Supports ADC reference sourcing, real-time clock input, and DMA trigger - enables synchronized low-power sampling. |
| P2.0–P2.3 | UCA0TXD/RXD/CLK/STE | Primary UART interface with automatic baud-rate detection; used for BSL programming and host communication. |
| P3.4–P3.7 | UCA1TXD/RXD/CLK/STE | Secondary UART channel supporting full-duplex asynchronous communication at up to 10 Mbps. |
| PJ.4 / PJ.5 | LFXIN / LFXOUT | Connects to 32.768-kHz crystal for RTC calendar accuracy; requires external 12.5 pF load capacitance per TI design guidelines. |
| DVCC1 / DVCC2 / DVCC3 | Digital Power Supply (3×) | Independent power domains reduce noise coupling between peripheral groups; must be decoupled with 100 nF ceramic capacitors. |
| AVCC1 / AVSS1 / AVSS2 | Analog Power / Ground | Isolated analog supply domain ensures ADC SNR > 70 dB; requires separate PCB plane and ferrite-bead filtering from digital rails. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 32 KB unified memory with 10¹⁵ write endurance and zero write latency - eliminates erase blocks and enables logging at microsecond intervals. |
| Capacitive Touch I/O | All GPIO pins support CSD (Capacitive Sigma-Delta) sensing without external RC networks - reduces BOM cost and PCB area in wearables. |
| Real-Time Clock (RTC) | Calendar mode with alarm and 32-kHz crystal support; consumes only 0.35 µA in LPM3.5 - enables decade-scale timestamping on coin-cell batteries. |
| Low-Power Modes | Seven defined modes including LPM4.5 (0.04 µA shutdown); allows rapid wake-up (<;1 µs) from any mode using port interrupts or timer events. |
| Hardware CRC Engine | Dedicated CRC16 and CRC32 accelerators offload checksum computation from CPU - improves firmware update integrity and sensor data validation efficiency. |
Applications
| Smart Utility Metering | Energy-Harvested Sensor Node |
|---|---|
|
Use Scenario: Gas/water/electricity meter with hourly consumption logging and tamper detection. IC Role / Device Role / Timing Role: Primary controller managing metrology ADC, RTC calendar, FRAM-based secure log storage, and optical/RF communication stack. Use Value: 0.35 µA LPM3.5 current extends 10-year battery life; FRAM enables tamper-proof, high-frequency logging without wear-out risk. |
Use Scenario: Wireless temperature/humidity node powered by solar cell or piezoelectric harvester. IC Role / Device Role / Timing Role: System-on-chip managing energy harvesting PMIC interface, sensor acquisition, duty-cycled RF transmission, and sleep-state management. Use Value: 1.8 V minimum operating voltage matches harvester output; FRAM retains state across intermittent power loss without backup capacitor. |
| Wearable Health Monitor | Industrial Sensor Management |
|
Use Scenario: ECG/PPG patch with capacitive touch UI, motion sensing, and Bluetooth LE co-processor interface. IC Role / Device Role / Timing Role: Front-end signal conditioner and sensor hub aggregating analog biosignals, performing local feature extraction, and buffering data for wireless upload. Use Value: All-I/O capacitive touch eliminates mechanical buttons; 32 KB FRAM stores raw waveform buffers for post-processing without flash wear. |
Use Scenario: DIN-rail mounted industrial sensor gateway collecting analog/digital inputs from field transmitters. IC Role / Device Role / Timing Role: Edge intelligence unit executing calibration algorithms, SPI/I²C sensor polling, and deterministic timestamping via RTC_A module. Use Value: Five 16-bit timers enable precise synchronization of multi-channel sampling; eUSCI_B0/B1 support multiple I²C slave addresses for daisy-chained sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5872IRGCR | 64 KB FRAM (vs. 32 KB), identical peripherals and package; no AES256. | Same use cases but higher data logging depth or larger firmware footprint required. | Select when extended nonvolatile storage is needed without changing PCB layout or firmware architecture. |
| MSP430FR5970IPMR | 32 KB FRAM, LQFP-64 package, includes AES256 coprocessor (MSP430FR59xx family). | Required where encrypted firmware updates or secure sensor data transmission is mandated. | Choose only if cryptographic acceleration is essential; otherwise, MSP430FR5870IRGCR offers lower cost and same power/performance profile. |
Compared with MSP430FR5872IRGCR, the MSP430FR5870IRGCR trades half the FRAM capacity for identical low-power behavior and pin compatibility - ideal for cost-sensitive, memory-constrained deployments. Against MSP430FR5970IPMR, it omits AES256 but retains identical analog and timing capabilities in a smaller VQFN footprint.
Availability
MSP430FR5870IRGCR is available at Aetrix Electronics and suitable for smart metering, energy-harvested sensor nodes, and wearable electronics requiring stable component supply and long-term lifecycle support.
Supply support for MSP430FR5870IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 90 years of innovation in low-power microcontrollers and precision analog ICs.
The MSP430FRxx FRAM microcontroller product line targets ultra-low-power sensing and measurement applications, combining ferroelectric memory with optimized power modes to extend battery life in portable and wireless systems.
FAQ
Does the MSP430FR5870IRGCR support AES encryption?
No, the MSP430FR5870IRGCR does not include an AES256 coprocessor. This capability is exclusive to the MSP430FR59xx family (e.g., MSP430FR5970). The MSP430FR5870IRGCR retains all other peripherals - including FRAM, RTC, ADC, and eUSCI modules - making it suitable for applications where security acceleration is not required.
What is the maximum operating frequency of the MSP430FR5870IRGCR?
The MSP430FR5870IRGCR supports up to 16 MHz via its digitally controlled oscillator (DCO), which offers 10 factory-trimmed frequencies. External high-frequency crystals (HFXT) can also be used for precise timing, though the DCO alone meets most ultra-low-power application requirements without added BOM cost.
How many I/O pins does the MSP430FR5870IRGCR have, and what interfaces do they support?
The MSP430FR5870IRGCR provides 51 programmable I/O pins in its VQFN-64 package. All pins support capacitive touch sensing, edge-selectable wakeup from low-power modes, and configurable pullup/pulldown. They are multiplexed across UART, I²C, SPI, timer capture/compare, ADC inputs, and RTC functions as defined in the pin attributes table.
What package type and thermal considerations apply to the MSP430FR5870IRGCR?
The MSP430FR5870IRGCR uses a 64-pin VQFN package (9 mm × 9 mm) with an exposed thermal pad. Texas Instruments specifies that the thermal pad must be soldered to a DVSS-connected copper plane to ensure reliable thermal dissipation and stable operation under continuous 16-MHz operation or sustained analog conversion loads.
Can the MSP430FR5870IRGCR operate from a single 1.8-V supply?
Yes, the MSP430FR5870IRGCR is fully specified to operate from 1.8 V to 3.6 V. At 1.8 V, it supports all peripherals including the 12-bit ADC (with reduced reference voltage headroom), RTC, and FRAM - making it compatible with energy-harvesting sources and single-cell Li-ion/Li-SOCl₂ battery systems without external regulation.
MSP430FR5870IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5870IRGCR FAQ
1.How can I place an order for MSP430FR5870IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5870IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5870IRGCR reliable?
The price and inventory of MSP430FR5870IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5870IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430FR5870IRGCR?
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MSP430FR5870IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5870IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5870IRGCR?
For technical support, including MSP430FR5870IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5870IRGCR requirements.
6.How does Aetrix verify that MSP430FR5870IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430FR5870IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5870IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430FR5870IRGCR?
All MSP430FR5870IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5870IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5870IRGCR part is unused and in its original packaging.
Return procedure for MSP430FR5870IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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