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Texas Instruments MSP430FR5872IRGCR
- Part No.:
- MSP430FR5872IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR5872IRGCR.pdf
- Description:
- IC MCU 16BIT 64KB FRAM 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,278
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Product details
Overview
MSP430FR5872IRGCR from Texas Instruments is an ultra-low-power 16-bit FRAM microcontroller featuring 64KB nonvolatile FRAM, 2KB RAM, 16-MHz CPU, integrated 12-bit ADC with 8 external channels, RTC with calendar/alarm, and dual eUSCI modules supporting UART, SPI, and I²C. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and metering systems.
For engineers reviewing the MSP430FR5872IRGCR datasheet, MSP430FR5872IRGCR pinout, MSP430FR5872IRGCR application, or MSP430FR5872IRGCR equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LPM3.5 current (0.35 µA typical), RTC accuracy with 3.7-pF crystal, and absence of AES256 encryption-distinguishing it from MSP430FR597x variants.
Technical Context
The MSP430FR5872IRGCR implements a 16-bit RISC CPUXV2 core with seven low-power modes, including LPM4.5 (0.04 µA shutdown) and RTC-enabled LPM3.5. Its memory subsystem unifies 64KB FRAM for code, data, and storage-enabling instant writes without erase cycles and eliminating flash wear-out concerns in frequent logging applications.
Peripherals include three 16-bit timers (TA0–TA3, TB0), 32-bit hardware multiplier, three-channel DMA, CRC16/CRC32 engines, and capacitive touch I/O on all pins. Clock system supports DCO (10 factory-trimmed frequencies), LFXT (32-kHz crystal), and HFXT-though HFXIN/HFXOUT are not implemented per device-specific note.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit CPUXV2 RISC core, up to 16-MHz operation-enables deterministic real-time control with low gate count and power efficiency. |
| Nonvolatile Memory | 64KB FRAM with 10¹⁵ write endurance and 125-ns word write-supports high-frequency data logging without flash wear management overhead. |
| Supply Voltage Range | 1.8 V to 3.6 V-compatible with single-cell Li-ion, coin-cell, and energy-harvesting sources; minimum voltage constrained by SVS thresholds. |
| Low-Power Mode Current | LPM3.5 (RTC active): 0.35 µA typical; LPM4.5 (shutdown): 0.04 µA typical-extends multi-year battery life in always-on sensing applications. |
| Analog Peripherals | 12-bit ADC12_B with internal reference, sample-and-hold, and up to 8 external inputs-enables precision sensor signal acquisition without external reference components. |
| Communication Interfaces | eUSCI_A0/A1 (UART/IrDA/SPI up to 10 Mbps); eUSCI_B0/B1 (I²C/multi-slave addressing/SPI)-provides flexible wired connectivity for sensor fusion and host interfacing. |
| Real-Time Clock | RTC_A with calendar, alarm, and 32-kHz crystal support (3.7-pF load)-delivers accurate timekeeping for scheduled wake-up and timestamped data capture. |
Pinout & Package
VQFN-64 (RGC) package, 9 mm × 9 mm body, thermal pad recommended to be connected to DVSS. Pin count: 64. Compatible with standard QFN reflow profiles and automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0 / P1.1 / P1.2 / P1.3 | ADC input / VREF+/− / TA/RTC clock / CAPT IO | Support analog sensing, reference voltage routing, timer clocking, and capacitive touch-all without external components. |
| P2.0–P2.3 | eUSCI_A0 TX/RX/CLK/STE | Dedicated UART/SPI interface for bootloader (BSL) or primary serial communication; P2.0/P2.1 serve as BSL_TX/BSL_RX on UART-BSL devices. |
| P3.4–P3.7 | eUSCI_A1 TX/RX/CLK/STE | Secondary full-duplex UART or SPI channel-enables concurrent host communication and peripheral bridging (e.g., sensor hub to gateway). |
| PJ.4 / PJ.5 | LFXIN / LFXOUT | Connects to 32-kHz crystal for RTC and low-frequency timing; requires external 3.7-pF crystal per datasheet specification. |
| DVCC1–DVCC3 / DVSS1–DVSS3 | Digital supply / ground | Three independent digital power domains enable localized decoupling and noise isolation for high-speed peripherals and CPU sections. |
| AVCC1 / AVSS1 / AVSS2 | Analog supply / ground | Dedicated analog power rails reduce coupling noise into ADC and comparator circuits-critical for <12-bit effective resolution. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 64KB unified memory with SRAM-like write speed (125 ns/word), flash-like nonvolatility, and 10¹⁵ write endurance-eliminates erase latency and wear leveling in firmware-over-the-air updates. |
| Ultra-Low-Power Operation | 0.35 µA RTC-active mode (LPM3.5) and 0.04 µA shutdown (LPM4.5)-enables decade-scale operation on CR2032 coin cells in periodic-sensing applications. |
| Capacitive Touch I/O | All GPIO pins support capacitive touch sensing without external RC networks-reduces BOM cost and PCB area for human-interface designs like wearable controls. |
| Hardware Acceleration | 32-bit hardware multiplier and CRC16/CRC32 engines-offloads math-intensive tasks (e.g., sensor fusion, checksum validation) from CPU, reducing active time and power. |
| Flexible Clock System | Factory-trimmed DCO (10 frequencies), LFXT (32-kHz crystal), and HFXT support-allows precise timing across operating modes without external oscillators in most use cases. |
Applications
| Smart Utility Metering | Energy-Harvesting Sensor Node |
|---|---|
Use Scenario: Gas/water/electricity meters requiring long-term data logging, tamper detection, and secure firmware updates under battery or capacitor power. IC Role / Device Role / Timing Role: Primary controller managing metrology ADC sampling, FRAM-based event logging, RTC-timestamped alarms, and secure UART communication with concentrators. Use Value: 64KB FRAM enables years of hourly consumption records; LPM3.5 current ensures >10-year battery life; no AES256 simplifies certification for utility-grade security requirements. |
Use Scenario: Wireless environmental sensors powered by solar cells or thermoelectric generators, transmitting temperature/humidity/pressure via LoRaWAN or NB-IoT. IC Role / Device Role / Timing Role: System-on-chip managing energy harvesting PMIC control, sensor polling, data compression, and low-duty-cycle radio wake-up using RTC interrupts. Use Value: FRAM's instant write capability captures transient sensor events during power brownouts; 0.35 µA RTC mode minimizes quiescent drain between harvest cycles. |
| Wearable Health Monitor | Industrial Data Logger |
Use Scenario: Compact wearable devices measuring heart rate, motion, and skin temperature-requiring small form factor, low EMI, and reliable data retention during charging interruptions. IC Role / Device Role / Timing Role: Central MCU handling capacitive touch UI, analog front-end conditioning, motion sensor fusion, and Bluetooth LE packet assembly. Use Value: All-GPIO capacitive touch eliminates dedicated touch controller IC; unified FRAM stores calibration data and health logs without file-system complexity. |
Use Scenario: Ruggedized industrial loggers deployed in remote locations (e.g., pipeline monitoring), recording vibration, temperature, and pressure at fixed intervals for predictive maintenance. IC Role / Device Role / Timing Role: Standalone data acquisition engine performing scheduled ADC conversions, CRC-verified storage, and watchdog-managed recovery after brownouts. Use Value: 10¹⁵ FRAM write cycles ensure >20 years of daily logging; RTC calendar function enables precise time-stamping without external RTC IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5972IRGCR | Includes AES256 encryption coprocessor and HFXIN/HFXOUT pins; otherwise identical FRAM, RAM, peripherals, and power specs. | Required for applications needing hardware-accelerated secure boot, encrypted firmware updates, or high-frequency crystal oscillator support. | Select when cryptographic security or HFXT-based timing is mandatory; avoid if AES adds unnecessary cost/complexity. |
| MSP430FR5870IRGCR | 32KB FRAM (vs. 64KB), identical package, peripherals, and power profile; no functional differences beyond memory size. | Suitable for simpler sensor nodes with lower data volume or shorter logging intervals where 32KB suffices. | Choose for cost-sensitive designs with modest memory needs; verify FRAM usage fits within 32KB before committing. |
Compared with MSP430FR5872IRGCR, MSP430FR5972IRGCR adds hardware security and HFXT capability at higher cost and complexity, while MSP430FR5870IRGCR reduces memory capacity by 50% with no other trade-offs-making both viable alternatives depending on security and storage requirements.
Availability
MSP430FR5872IRGCR is available at Aetrix Electronics and suitable for smart metering, energy-harvested sensor nodes, and wearable electronics requiring stable component supply and long-term production continuity.
Supply support for MSP430FR5872IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.
The MSP430FRxx family was engineered specifically for battery-constrained sensing and measurement applications, combining FRAM persistence, sub-µA sleep currents, and integrated analog front-ends to eliminate external components.
FAQ
Does MSP430FR5872IRGCR support hardware AES encryption?
No, MSP430FR5872IRGCR does not implement the AES256 security coprocessor. This feature is present only in MSP430FR597x and MSP430FR592x variants. The MSP430FR5872IRGCR datasheet explicitly states "AES256 is not implemented" in the functional block diagram notes. For secure firmware updates or encrypted communications, external crypto ICs or software-based solutions must be used with MSP430FR5872IRGCR.
What crystal specifications are required for the RTC in MSP430FR5872IRGCR?
The MSP430FR5872IRGCR RTC requires a 32.768-kHz tuning-fork crystal with a 3.7-pF load capacitance, as specified in the device overview section of the SLASE66C datasheet. Using crystals with different load capacitance values may degrade RTC accuracy or prevent oscillation. The PJ.4 (LFXIN) and PJ.5 (LFXOUT) pins are dedicated to this crystal connection.
How many I/O pins does MSP430FR5872IRGCR provide, and are they all capacitive-touch capable?
MSP430FR5872IRGCR provides 51 general-purpose I/O pins across ports P1–P9 and PJ, all of which support capacitive touch sensing without external components. This capability is confirmed in the "Features" section of the datasheet and applies uniformly across the MSP430FR587x family. No additional RC networks or dedicated touch controller ICs are needed.
What is the maximum operating frequency of the CPU in MSP430FR5872IRGCR?
The MSP430FR5872IRGCR CPU operates at up to 16 MHz, enabled by its factory-trimmed DCO (Digitally Controlled Oscillator) with 10 selectable frequencies. This maximum frequency is achievable across the full 1.8 V–3.6 V supply range and is validated in the "Recommended Operating Conditions" table of the datasheet.
Is MSP430FR5872IRGCR pin-compatible with MSP430FR5972IRGCR?
Yes, MSP430FR5872IRGCR and MSP430FR5972IRGCR share identical 64-pin VQFN (RGC) packaging, pinout, and electrical characteristics for all shared peripherals. They differ only in internal features (AES256, HFXIN/HFXOUT presence), not pin function or layout-enabling drop-in replacement where those features are unused. TI confirms this compatibility in the device comparison tables.
MSP430FR5872IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5872IRGCR FAQ
1.How can I place an order for MSP430FR5872IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5872IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5872IRGCR reliable?
The price and inventory of MSP430FR5872IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5872IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430FR5872IRGCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR5872IRGCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR5872IRGCR?
MSP430FR5872IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5872IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5872IRGCR?
For technical support, including MSP430FR5872IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5872IRGCR requirements.
6.How does Aetrix verify that MSP430FR5872IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430FR5872IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5872IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430FR5872IRGCR?
All MSP430FR5872IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5872IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5872IRGCR part is unused and in its original packaging.
Return procedure for MSP430FR5872IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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