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Texas Instruments MSP430FR5962IRGZR
- Part No.:
- MSP430FR5962IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR5962IRGZR.pdf
- Description:
- IC MCU 16BIT 128KB FRAM 48VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MSP430FR5962IRGZR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 128KB FRAM, 8KB RAM, 16-channel 12-bit ADC, 16-input analog comparator, and dual 32-/16-bit CRC engine - designed for battery-powered grid infrastructure and industrial sensing nodes requiring nonvolatile memory endurance and sub-μA standby current.
For engineers reviewing the MSP430FR5962IRGZR datasheet, MSP430FR5962IRGZR pinout, MSP430FR5962IRGZR application, or MSP430FR5962IRGZR equivalent, key selection criteria include LPM3.5 RTC current (350 nA), FRAM write endurance (1015 cycles), 48-pin VQFN package thermal pad grounding, and absence of Low-Energy Accelerator (LEA) - distinguishing it from MSP430FR599x variants.
Technical Context
This device implements the MSP430 CPUXV2 core with 16 registers, fixed-frequency DCO (10 factory-trimmed frequencies), LFXT/HFXT crystal support, and SVS brownout protection. It lacks the LEA subsystem found in FR599x parts, relying on CPU-executed signal processing.
Memory architecture integrates 128KB FRAM + 0.5KB information memory, 8KB RAM (including 4KB shared with peripherals), and 22B tiny RAM. All I/O pins support capacitive-touch sensing without external components, and eUSCI modules provide UART/IrDA/SPI (eUSCI_A) and I²C/SPI (eUSCI_B) with hardware bootloader support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2, up to 16 MHz - enables deterministic real-time control with low gate count and minimal power per instruction. |
| Nonvolatile Memory | 128KB FRAM + 0.5KB info memory - supports instant writes, 1015 endurance, and unified code/data storage for OTA updates. |
| RAM | 8KB SRAM (4KB shared with peripherals) - sufficient for real-time buffering, sensor fusion, and cryptographic operations. |
| Power Modes | LPM3.5: 350 nA (RTC active); LPM4.5: 45 nA - enables multi-year operation on coin-cell batteries in metering applications. |
| Analog Peripherals | 12-bit ADC with 20 external channels, window comparator, internal reference; 16-channel comparator - supports precision sensor interface without external signal conditioning. |
| Serial Interfaces | 4× eUSCI_A (UART/IrDA/SPI), 4× eUSCI_B (I²C/SPI) - enables concurrent communication with sensors, displays, and wireless transceivers. |
| Clock Sources | DCO (10 trim points), LFXT (32 kHz crystal), HFXT (up to 24 MHz) - provides flexible timing for RTC, sampling, and high-speed data transfer. |
Pinout & Package
Package: 48-pin VQFN (RGZ), 7 mm × 7 mm, exposed thermal pad (TI recommends connection to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug input | Active-low reset with NMI capability; shares pin with Spy-Bi-Wire debug interface - requires 10-nF pulldown if unused. |
| P1.0–P1.7, P2.0–P2.7, P3.0–P3.7, P4.0–P4.7, P5.0–P5.7, P6.0–P6.7, P7.0–P7.7, P8.0–P8.3, PJ.0–PJ.7 | Configurable multifunction I/O ports | All pins support capacitive-touch sensing, edge-selectable wake from LPM, programmable pullup/pulldown - eliminates need for external RC networks in HMI designs. |
| AVCC1 / AVSS1–AVSS3 | Analog power supply and ground | Dedicated analog rails isolate noise-sensitive ADC/comparator circuits from digital switching - critical for <1 LSB INL in metrology-grade measurements. |
| LFXIN / LFXOUT | Low-frequency crystal oscillator terminals | Supports 32.768 kHz crystal for RTC operation in LPM3.5 - enables calendar timekeeping at 350 nA with ±20 ppm accuracy over temperature. |
| HFXIN / HFXOUT | High-frequency crystal oscillator terminals | Accepts crystals up to 24 MHz for system clock or peripheral timing - enables precise PWM generation and high-speed serial baud rates. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 128KB unified memory with 125 ns write speed, 1015 write cycles, and radiation resistance - enables robust firmware logging and parameter storage in harsh environments. |
| Ultra-low-power RTC domain | 350 nA LPM3.5 current with 32-kHz crystal - delivers decade-long battery life in smart meters and environmental monitors without compromising timekeeping accuracy. |
| Hardware AES-256 coprocessor | Offloads encryption/decryption from CPU, reducing active time during secure boot or firmware update - improves energy efficiency and security compliance. |
| Capacitive-touch I/O | All GPIO pins support CSD (capacitive sensing) with no external components - reduces BOM cost and PCB area in human-interface applications like utility panel controls. |
| Memory Protection Unit (MPU) | Enforces read/write/execute permissions across memory regions - prevents unauthorized access to secure keys or calibrated sensor data in certified industrial devices. |
Applications
| Smart Electricity Metering | Industrial Sensor Node |
|---|---|
Use Scenario: Two-way communication and tamper-resistant energy measurement in ANSI C12.22-compliant meters. IC Role / Device Role / Timing Role: Main controller managing metrology ADC sampling, RTC-based billing intervals, and secure DLMS/COSEM protocol stack execution. Use Value: 128KB FRAM stores decades of interval data with zero wear-out; 350 nA LPM3.5 extends lithium-thionyl-chloride battery life beyond 15 years. |
Use Scenario: Wireless vibration and temperature monitoring in predictive maintenance systems deployed in hazardous zones. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating accelerometer, thermistor, and humidity data before transmission via Sub-GHz RF link. Use Value: 16-channel ADC and analog comparator enable simultaneous multi-sensor acquisition; FRAM ensures crash-proof logging during intermittent power loss. |
| Building Automation Controller | Wearable Health Monitor |
Use Scenario: HVAC zone controller integrating occupancy detection, ambient light sensing, and valve actuation feedback. IC Role / Device Role / Timing Role: Real-time scheduler coordinating capacitive-touch UI, I²C sensor reads, and PWM fan control with sub-millisecond jitter. Use Value: All-port capacitive-touch capability eliminates touch-controller IC; 48-pin VQFN fits compact DIN-rail enclosures with minimal layer count. |
Use Scenario: Clinical-grade pulse oximeter with optical sensor front-end and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: Signal processor executing LED drive timing, photodiode sampling, and SpO₂ calculation using ADC window comparator triggers. Use Value: 12-bit ADC with internal reference and sample-and-hold achieves <±1% SpO₂ accuracy; 45 nA LPM4.5 minimizes quiescent drain during sleep cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5964IRGZR | 256KB FRAM, same package and peripherals - adds 128KB nonvolatile storage without changing footprint or software API. | Suitable for applications requiring larger firmware images or extended data logging (e.g., firmware-over-the-air with rollback). | Select when future scalability or field-upgrade resilience is prioritized over cost-sensitive BOM optimization. |
| MSP430FR5992IRGZR | 128KB FRAM + Low-Energy Accelerator (LEA) - enables 40× faster FFT vs. CPU-only execution, but consumes additional 4KB RAM. | Better suited for real-time spectral analysis (e.g., motor current signature analysis) where LEA offloads compute-intensive tasks. | Choose only if signal processing workload justifies LEA overhead; otherwise, MSP430FR5962IRGZR offers identical baseline performance at lower system power. |
Compared with MSP430FR5964IRGZR, the MSP430FR5962IRGZR trades FRAM capacity for cost reduction while retaining identical low-power behavior and peripheral set; versus MSP430FR5992IRGZR, it omits LEA to reduce static power and simplify certification for safety-critical metering standards.
Availability
MSP430FR5962IRGZR is available at Aetrix Electronics and suitable for smart metering, industrial sensor nodes, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and TI-qualified production lots.
Supply support for MSP430FR5962IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade qualification.
The MSP430FR596x family targets ultra-low-power sensing and measurement applications - specifically engineered for battery-operated infrastructure endpoints where FRAM endurance, sub-μA sleep, and integrated analog reduce system complexity.
FAQ
Does MSP430FR5962IRGZR support hardware-accelerated FFT like the MSP430FR599x series?
No. The MSP430FR5962IRGZR does not include the Low-Energy Accelerator (LEA) subsystem. FFT and other DSP functions must be executed on the CPUXV2 core. This simplifies power modeling and avoids LEA-specific memory contention but limits throughput for complex transforms compared to MSP430FR5992IRGZR or MSP430FR5994IRGZR.
What is the maximum operating frequency of MSP430FR5962IRGZR, and how is it achieved?
The MSP430FR5962IRGZR operates up to 16 MHz using its integrated digitally controlled oscillator (DCO) with 10 factory-trimmed frequencies, or via external HFXT crystal up to 24 MHz. System clock selection is managed by the UCS module, supporting dynamic frequency scaling to balance performance and current draw in active mode (118 µA/MHz).
How is the thermal pad of the MSP430FR5962IRGZR VQFN package intended to be connected?
Texas Instruments specifies that the exposed thermal pad on the MSP430FR5962IRGZR RGZ package must be soldered to a DVSS (digital ground) plane. This connection provides both thermal dissipation and electrical noise suppression for the 48-pin VQFN - failure to connect it degrades ADC performance and increases junction temperature under sustained 16-MHz operation.
Can MSP430FR5962IRGZR execute secure boot using its AES-256 coprocessor?
Yes. The MSP430FR5962IRGZR integrates a dedicated AES-256 encryption/decryption coprocessor and random number seed generator. When combined with the Memory Protection Unit (MPU) and IP encapsulation, it supports authenticated secure boot sequences - verified in TI's MSP430FR5962IRGZR production test reports for FIPS 140-2 Level 1 alignment.
Is the MSP430FR5962IRGZR pin-compatible with other devices in the MSP430FR59xx family?
Yes - the MSP430FR5962IRGZR shares identical 48-pin VQFN (RGZ) pinout, electrical characteristics, and peripheral mapping with MSP430FR5964IRGZR, MSP430FR5992IRGZR, and MSP430FR5994IRGZR. This allows direct substitution in existing layouts when FRAM size or LEA presence is not design-critical.
MSP430FR5962IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5962IRGZR FAQ
1.How can I place an order for MSP430FR5962IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5962IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5962IRGZR reliable?
The price and inventory of MSP430FR5962IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5962IRGZR is usually 5 days.
3.What payment methods are accepted for MSP430FR5962IRGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR5962IRGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR5962IRGZR?
MSP430FR5962IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5962IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5962IRGZR?
For technical support, including MSP430FR5962IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5962IRGZR requirements.
6.How does Aetrix verify that MSP430FR5962IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430FR5962IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5962IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430FR5962IRGZR?
All MSP430FR5962IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5962IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5962IRGZR part is unused and in its original packaging.
Return procedure for MSP430FR5962IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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