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Texas Instruments MSP430FR5964IRGZR
- Part No.:
- MSP430FR5964IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR5964IRGZR.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,308
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Product details
Overview
MSP430FR5964IRGZR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 256KB FRAM, 8KB RAM, 16-channel 12-bit ADC, and dual 16-bit timers (TA0/TA1 with 3 capture/compare registers each). It operates from 1.8 V to 3.6 V and supports LPM3.5 standby at 350 nA with RTC-ideal for battery-powered grid infrastructure and wearable fitness monitors.
For engineers reviewing the MSP430FR5964IRGZR datasheet, MSP430FR5964IRGZR pinout, MSP430FR5964IRGZR application, or MSP430FR5964IRGZR equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), capacitive-touch I/O support on all pins, UART/I²C serial interfaces, and absence of LEA accelerator-distinguishing it from MSP430FR599x variants.
Technical Context
The MSP430FR5964IRGZR implements the MSP430 CPUXV2 core with 16 registers and a fixed-frequency DCO trimmed across 10 frequencies. Its clock system integrates LFXT (32 kHz crystal), HFXT (high-frequency crystal), and VLO for flexible low-power timing.
It features six 16-bit timers (TA0–TA4, TB0), 32-bit hardware multiplier, 6-channel DMA, and eUSCI modules supporting up to four UART and four I²C interfaces. Unlike MSP430FR599x, it lacks the Low-Energy Accelerator (LEA) subsystem and shares identical peripheral count and memory map with MSP430FR5962 but doubles FRAM capacity to 256KB.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit CPUXV2 RISC core, up to 16 MHz operation-enables deterministic real-time control without cache or pipeline stalls. |
| Nonvolatile Memory | 256 KB FRAM + 0.5 KB information memory-supports instant writes, firmware updates without erase, and 10¹⁵ write endurance. |
| RAM | 8 KB SRAM-used for stack, variables, and DMA buffers; no shared LEA RAM (LEA absent in this variant). |
| ADC | 12-bit SAR ADC with 20 external input channels, window comparator, internal reference, and sample-and-hold-suited for sensor signal acquisition in energy meters. |
| Low-Power Modes | LPM3.5 draws 350 nA with RTC active (3.7-pF crystal); LPM4.5 draws 45 nA shutdown-extends coin-cell life beyond 10 years in periodic wake-up applications. |
| Serial Interfaces | Up to 4 × eUSCI_A (UART/IrDA/SPI) and 4 × eUSCI_B (I²C/SPI)-enables concurrent communication with sensors, displays, and wireless modules. |
| I/O Capability | All 40 GPIO pins support capacitive-touch sensing without external components-reduces BOM cost and PCB area in human-interface designs. |
Pinout & Package
VQFN-48 (RGZ) package, 7 mm × 7 mm, 0.5 mm pitch, thermal pad connected to DVSS. Pin count: 40 usable I/Os (excluding power/ground/crystal pins).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug I/O | Active-low reset with NMI capability; enables Spy-Bi-Wire programming and debugging using single-wire interface. |
| P1.0–P1.7 | General-purpose I/O with analog function multiplexing | Supports TA0/TA1 capture/compare, RTCCLK, VREF±, and capacitive touch-enables timer-gated sensor sampling and precision voltage monitoring. |
| P2.0–P2.7 | Multi-function digital I/O with UART/I²C/Timer_B | P2.0/P2.1 default as UART BSL TX/RX; P2.2–P2.4 support UCB0/UCB1 clocks-allows bootloader activation and multi-sensor I²C bus management. |
| P3.0–P3.7 | Analog input / Timer_B / SMCLK routing | Provides A12–A15 inputs for ADC, TB0 capture/compare, and system clock distribution-critical for synchronized analog acquisition and PWM generation. |
| P4.0–P4.7 | Dedicated analog inputs / Timer_B / GPIO | P4.0–P4.3 serve as A8–A11 ADC channels; P4.4–P4.6 are TB0.5/TB0.6 outputs-supports 16-channel analog front-end with independent timer-triggered sampling. |
| PJ.0–PJ.5 | Clock I/O and JTAG test signals | PJ.4/PJ.5 = LFXIN/LFXOUT for 32-kHz RTC crystal; PJ.6/PJ.7 = HFXIN/HFXOUT for high-frequency system clock-enables dual-crystal timing architecture. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 256 KB unified memory enabling zero-latency writes, 125 ns/word speed, and elimination of flash erase delays-accelerates over-the-air firmware updates. |
| Capacitive Touch I/O | All 40 GPIO pins support CSD (capacitive sensing) without external RC networks-reduces component count and simplifies mechanical design for wearables. |
| Ultra-Low-Power RTC | 350 nA LPM3.5 mode with calendar and alarm functions powered by 3.7-pF crystal-delivers precise timekeeping for metering and scheduling with minimal battery drain. |
| Hardware Security | 128-/256-bit AES coprocessor and IP encapsulation-protects firmware and sensitive data in smart grid endpoints against unauthorized access. |
| Flexible Clock System | DCO with 10 factory-trimmed frequencies, plus LFXT/HFXT/VLO sources-enables dynamic clock scaling and fail-safe timing in industrial environments. |
Applications
| Smart Electricity Meter | Industrial Sensor Node |
|---|---|
Use Scenario: Bidirectional energy measurement with tamper detection and time-of-use billing in ANSI C12.22-compliant meters. IC Role / Device Role / Timing Role: Main controller managing metrology ADC, RTC calendar, secure firmware updates, and DLMS/COSEM protocol stack via UART/I²C. Use Value: 256KB FRAM stores decades of interval data and cryptographic keys; 350 nA RTC preserves time during main power loss without supercapacitor. |
Use Scenario: Wireless vibration/temperature node in predictive maintenance systems deployed in hazardous factory zones. IC Role / Device Role / Timing Role: Sensor fusion hub acquiring analog signals, executing FFT preprocessing (via software), and transmitting alerts via UART to LoRaWAN gateway. Use Value: All-GPIO capacitive touch enables sealed membrane HMI; 45 nA LPM4.5 extends 2-year battery life in intermittent wake-up mode. |
| Wearable Fitness Tracker | Building Automation Controller |
Use Scenario: Wrist-worn activity monitor with heart-rate optical sensing, motion tracking, and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: Central MCU handling photodiode ADC sampling, accelerometer SPI interface, real-time step counting, and BLE UART bridge. Use Value: FRAM's 10¹⁵ write endurance supports continuous sensor logging; 1.8 V minimum supply enables direct coin-cell (CR2032) operation. |
Use Scenario: Occupancy-aware HVAC zone controller integrating PIR, ambient light, and temperature sensors in commercial buildings. IC Role / Device Role / Timing Role: Local decision engine running occupancy algorithms, driving relay outputs, and communicating with BACnet MS/TP via UART. Use Value: 6-channel DMA offloads ADC and UART transfers from CPU; AES encryption secures firmware updates over building network. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5962IRGZR | 128 KB FRAM, identical 8 KB RAM, same peripherals and pinout-no LEA, same LPM currents. | Suitable where firmware size < 128 KB and cost sensitivity outweighs memory headroom. | Select when BOM cost reduction is critical and application code footprint fits within 128 KB FRAM. |
| MSP430FR5994IRGZR | 256 KB FRAM + 4 KB LEA-shared RAM + LEA accelerator-adds 40× FFT acceleration vs. CPU-only execution. | Required for real-time FFT-based vibration analysis or audio feature extraction at edge. | Choose only if signal processing workload justifies LEA overhead and higher unit cost. |
Compared with MSP430FR5962IRGZR, MSP430FR5964IRGZR offers double FRAM for larger firmware or data logging; compared with MSP430FR5994IRGZR, it omits LEA-reducing power and cost while retaining full peripheral compatibility for non-DSP applications.
Availability
MSP430FR5964IRGZR is available at Aetrix Electronics and suitable for grid infrastructure metering, industrial sensor nodes, and wearable electronics requiring stable component supply across multi-year production cycles.
Supply support for MSP430FR5964IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade performance.
The MSP430FR596x family targets ultra-low-power sensing and measurement applications-designed for battery-operated endpoints in smart grid, building automation, and portable medical devices where FRAM endurance and nanowatt sleep modes are critical.
FAQ
Does MSP430FR5964IRGZR include a Low-Energy Accelerator (LEA)?
No, MSP430FR5964IRGZR does not include the LEA subsystem. The LEA is exclusive to the MSP430FR599x series (e.g., MSP430FR5994). MSP430FR5964IRGZR retains full peripheral compatibility-including 256KB FRAM, 12-bit ADC, and eUSCI serial interfaces-but executes DSP workloads in software on the CPUXV2 core. This reduces power and cost while maintaining suitability for non-accelerated signal processing tasks.
What is the maximum operating frequency of MSP430FR5964IRGZR?
The MSP430FR5964IRGZR operates at up to 16 MHz using its digitally controlled oscillator (DCO), which is factory-trimmed to 10 selectable frequencies. When driven by an external HFXT crystal, it supports the same 16 MHz maximum. This frequency enables real-time response in metrology and sensor acquisition while maintaining ultra-low active-mode current of 118 µA/MHz.
How many ADC input channels does MSP430FR5964IRGZR support?
MSP430FR5964IRGZR supports up to 20 external analog input channels and 2 internal channels (VREF±) via its 12-bit ADC12_B module. Channel mapping includes P1.0–P1.7, P3.0–P3.7, P4.0–P4.7, and P5.0–P5.5-providing full coverage across 40 GPIO pins. The ADC includes window comparator, sample-and-hold, and programmable reference for precision sensor interfacing.
Is MSP430FR5964IRGZR pin-compatible with other RGZ-package MSP430FR59xx devices?
Yes, MSP430FR5964IRGZR is pin-compatible with MSP430FR5962IRGZR, MSP430FR5994IRGZR, and MSP430FR5992IRGZR in the 48-pin VQFN (RGZ) package. All share identical pin functions, electrical characteristics, and mechanical footprint-enabling drop-in replacement where FRAM size or LEA presence is not required. Software porting requires only configuration register adjustments for differing memory maps.
What bootloading options are supported by MSP430FR5964IRGZR?
MSP430FR5964IRGZR supports hardware UART-based bootloader (BSL) activated via P2.0 (BSLTX) and P2.1 (BSLRX) pins. It does not support I²C BSL-unlike MSP430FR59941, which uses P1.6/P1.7 for I²C BSL. The UART BSL allows field firmware updates using standard serial protocols without JTAG hardware, simplifying manufacturing and service workflows.
MSP430FR5964IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5964IRGZR FAQ
1.How can I place an order for MSP430FR5964IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5964IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5964IRGZR reliable?
The price and inventory of MSP430FR5964IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5964IRGZR is usually 5 days.
3.What payment methods are accepted for MSP430FR5964IRGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR5964IRGZR transactions.
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4.How is shipping managed for MSP430FR5964IRGZR?
MSP430FR5964IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5964IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5964IRGZR?
For technical support, including MSP430FR5964IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5964IRGZR requirements.
6.How does Aetrix verify that MSP430FR5964IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430FR5964IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5964IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430FR5964IRGZR?
All MSP430FR5964IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5964IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5964IRGZR part is unused and in its original packaging.
Return procedure for MSP430FR5964IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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