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Texas Instruments MSP430FR59691IRGZR
- Part No.:
- MSP430FR59691IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR59691IRGZR.pdf
- Description:
- IC MCU 16BIT 64KB FRAM 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,957
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Product details
Overview
MSP430FR59691IRGZR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 64KB nonvolatile memory, 2KB RAM, integrated 12-bit ADC (16 external channels), RTC with calendar/alarm, and dual eUSCI modules supporting UART, SPI, and I²C. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes requiring long-term data retention without flash wear-out.
For engineers reviewing the MSP430FR59691IRGZR datasheet, MSP430FR59691IRGZR pinout, MSP430FR59691IRGZR application, or MSP430FR59691IRGZR equivalent, key selection criteria include FRAM endurance (10¹⁵ writes), LPM3.5 current (0.25 µA typical), 48-pin VQFN package (7 mm × 7 mm), I²C-capable BSL, and capacitive touch I/O support across all pins.
Technical Context
The MSP430FR59691IRGZR implements the CPUXV2 16-bit RISC core with 16 general-purpose registers and executes instructions at up to 16 MHz. Its clock system integrates DCO (factory-trimmed), LFXT (32-kHz crystal), and HFXT (high-frequency crystal) sources, enabling precise real-time operation and flexible low-power mode transitions.
Peripherals include five 16-bit timers (TA0–TA3, TB0), 3-channel DMA, 32-bit hardware multiplier, AES-256 coprocessor, and eUSCI_A0/A1 (UART/IrDA/SPI) plus eUSCI_B0 (I²C/SPI). The RTC_B module requires LFXT and supports calendar, alarm, and calibration functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC with 16 registers, up to 16-MHz operation |
| FRAM Capacity | 64 KB unified nonvolatile memory for code, data, and logging - enables instant write, no erase, 10¹⁵ endurance |
| RAM Size | 2 KB SRAM for active data processing and stack operations |
| ADC Resolution | 12-bit SAR ADC with internal reference, sample-and-hold, and up to 16 external analog inputs |
| Low-Power Mode LPM3.5 | 0.25 µA typical current draw with RTC running on 32-kHz crystal - enables years of battery life in metering |
| Package Type | VQFN-48 (RGZ), 7 mm × 7 mm body, 0.5-mm pitch - suitable for space-constrained PCB layouts |
| BSL Interface | Hardware I²C bootloader (BSL) accessible via P1.6/BSLSDA and P1.7/BSLSCL - enables field firmware updates without JTAG |
Pinout & Package
VQFN-48 (RGZ) package with exposed thermal pad recommended to be connected to DVSS. Pin count: 48. Body size: 7 mm × 7 mm. Pitch: 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF- | Multi-function I/O | RTC clock output, ADC channel A0 input, comparator C0 input, negative reference source/sink - critical for timekeeping and analog sensing |
| P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0 | I²C SDA / Timer / SPI | Primary I²C data line for BSL and peripheral communication; also serves as TA0 capture/compare - enables firmware update and sensor interfacing |
| P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0 | I²C SCL / Timer / SPI | Primary I²C clock line for BSL; also TA1 capture/compare - required for secure I²C-based programming and timing control |
| PJ.4/LFXIN | LF Crystal Input | Connects to 32-kHz crystal for RTC_B operation - mandatory for calendar-mode real-time functionality |
| PJ.5/LFXOUT | LF Crystal Output | Completes 32-kHz oscillator circuit - enables ultra-low-power RTC operation in LPM3.5 |
| RST/NMI/SBWTDIO | Reset / Debug I/O | Active-low reset, non-maskable interrupt, and Spy-Bi-Wire debug interface - essential for initialization and development |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 64 KB unified memory with 125 ns write speed and 10¹⁵ write-cycle endurance - eliminates flash erase delays and wear leveling overhead |
| Capacitive Touch I/O | All GPIO pins support capacitive touch sensing without external components - reduces BOM cost and board area in wearable interfaces |
| Real-Time Clock (RTC_B) | Calendar, alarm, and calibration functions synchronized to 32-kHz crystal - enables accurate timestamping and wake-up scheduling |
| AES-256 Security Coprocessor | Hardware-accelerated encryption/decryption with 128- or 256-bit keys - secures firmware updates and sensor data in edge devices |
| EnergyTrace++™ Support | Real-time current profiling and low-power mode analysis in IDE - accelerates ultra-low-power firmware optimization |
Applications
| Smart Utility Metering | Energy-Harvested Sensor Node |
|---|---|
Use Scenario: Gas/water/electricity meter with tamper detection, pulse counting, and hourly consumption logging. IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, managing FRAM-based log storage, and maintaining RTC-driven billing intervals. Use Value: 64 KB FRAM retains 10+ years of hourly logs without degradation; LPM3.5 (0.25 µA) extends battery life beyond 15 years. | Use Scenario: Wireless environmental sensor node powered by solar cell or thermoelectric generator. IC Role / Device Role / Timing Role: System-on-chip managing analog sensor acquisition, data compression, I²C sensor interfacing, and scheduled BLE transmission. Use Value: Unified FRAM simplifies firmware updates and data buffering; capacitive touch I/O enables self-test buttons without extra components. |
| Wearable Health Monitor | Data Logger for Industrial Assets |
Use Scenario: Compact wrist-worn device measuring heart rate, motion, and skin temperature with Bluetooth connectivity. IC Role / Device Role / Timing Role: Central MCU handling analog front-end sampling, motion algorithm execution, and I²C-based sensor fusion. Use Value: All-GPIO capacitive touch enables intuitive UI; AES-256 secures health data before BLE transmission. | Use Scenario: Ruggedized vibration/temperature logger mounted on motors, pumps, or HVAC systems. IC Role / Device Role / Timing Role: Autonomous data collector acquiring sensor readings at fixed intervals and storing them in FRAM until retrieval. Use Value: FRAM's radiation resistance ensures data integrity in industrial EMI environments; RTC_B enables precise timestamping without external IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5969IRGZR | UART-capable BSL (P2.0/P2.1); identical FRAM/RAM/peripherals; same RGZ package | Preferred where UART-based firmware updates or host communication dominate over I²C | Select when legacy UART toolchains or existing UART infrastructure are in place |
| MSP430FR5949IRHA | 40-pin VQFN (RHA), 64 KB FRAM/2 KB RAM, LFXT-only (no HFXT), 33 I/O pins | Suitable for cost-sensitive, lower-pin-count designs without high-frequency crystal requirements | Choose for simplified clock design and smaller footprint where HFXT and full 48-pin I/O are unnecessary |
Compared with MSP430FR5969IRGZR and MSP430FR5949IRHA, the MSP430FR59691IRGZR uniquely combines I²C BSL, 48-pin RGZ packaging, and full HFXT+LFXT support - making it optimal for compact, field-upgradable sensor nodes needing both precision timing and secure firmware delivery.
Availability
MSP430FR59691IRGZR is available at Aetrix Electronics and suitable for smart utility metering, energy-harvested sensor nodes, and wearable electronics requiring stable component supply, long-term FRAM reliability, and I²C-based field programmability.
Supply support for MSP430FR59691IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets.
The MSP430 ULP FRAM portfolio targets energy-constrained applications such as metering and sensor networks, combining ferroelectric memory with ultra-low-power architecture to eliminate flash limitations while extending battery life.
FAQ
What distinguishes MSP430FR59691IRGZR from MSP430FR5969IRGZR?
The MSP430FR59691IRGZR features an I²C-capable hardware bootloader (BSL) using P1.6/BSLSDA and P1.7/BSLSCL, whereas MSP430FR5969IRGZR uses UART-based BSL on P2.0/BSLTX and P2.1/BSLRX. Both share identical FRAM (64 KB), RAM (2 KB), peripherals, and RGZ-48 packaging. The BSL interface difference dictates firmware update methodology and pin allocation in the target system.
Does MSP430FR59691IRGZR support high-frequency crystal oscillation (HFXT)?
Yes, MSP430FR59691IRGZR supports HFXT via PJ.6/HFXIN and PJ.7/HFXOUT pins. This enables precise high-speed clocking for USB-free communication, fast ADC sampling, or high-resolution PWM generation - complementing the 32-kHz LFXT used for RTC_B operation.
How does the FRAM in MSP430FR59691IRGZR improve data logging reliability?
The MSP430FR59691IRGZR's 64 KB FRAM provides 10¹⁵ write-cycle endurance, zero write latency, and no erase-before-write requirement. Unlike flash, this allows uninterrupted logging during power loss, eliminates wear leveling complexity, and guarantees data integrity over decades - critical for utility meters and industrial loggers.
Can MSP430FR59691IRGZR operate from a 1.8-V supply?
Yes, MSP430FR59691IRGZR operates across 1.8 V to 3.6 V. At 1.8 V, it maintains full functionality including 16-MHz DCO operation, FRAM read/write, ADC conversion, and RTC_B with LFXT - enabling compatibility with single-cell Li-ion or multi-cell alkaline battery systems.
Is capacitive touch supported on all GPIO pins of MSP430FR59691IRGZR?
Yes, MSP430FR59691IRGZR supports capacitive touch sensing on every GPIO pin without external components. This is implemented via integrated charge-transfer measurement circuitry and software libraries - reducing bill-of-materials cost and PCB area in human-interface applications like wearables and smart meters.
MSP430FR59691IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR59691IRGZR FAQ
1.How can I place an order for MSP430FR59691IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR59691IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR59691IRGZR reliable?
The price and inventory of MSP430FR59691IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR59691IRGZR is usually 5 days.
3.What payment methods are accepted for MSP430FR59691IRGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR59691IRGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR59691IRGZR?
MSP430FR59691IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR59691IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR59691IRGZR?
For technical support, including MSP430FR59691IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR59691IRGZR requirements.
6.How does Aetrix verify that MSP430FR59691IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430FR59691IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR59691IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430FR59691IRGZR?
All MSP430FR59691IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR59691IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR59691IRGZR part is unused and in its original packaging.
Return procedure for MSP430FR59691IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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