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Texas Instruments MSP430FR5969IRGZR

Part No.:
MSP430FR5969IRGZR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixMSP430FR5969IRGZR.pdf
Description:
IC MCU 16BIT 64KB FRAM 48VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:13,112

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Product details

Overview

MSP430FR5969IRGZR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller in a 48-pin VQFN package, featuring 64KB nonvolatile FRAM, 2KB RAM, 12-bit ADC with 16 external channels, RTC with calendar/alarm, and dual eUSCI modules supporting UART/IrDA/SPI/I²C. It targets battery-constrained sensor nodes and metering systems requiring sub-µA standby current.

For engineers reviewing the MSP430FR5969IRGZR datasheet, MSP430FR5969IRGZR pinout, MSP430FR5969IRGZR application, or MSP430FR5969IRGZR equivalent, key selection criteria include LPM3.5 current (0.25 µA), FRAM endurance (10¹⁵ writes), RTC clock source compatibility (LFXT), AES-256 encryption coprocessor, and 48-pin RGZ package thermal performance.

Technical Context

The MSP430FR5969IRGZR implements the CPUXV2 16-bit RISC core with hardware multiplier and 3-channel DMA, operating across seven low-power modes. Its clock system integrates DCO (10 factory-trimmed frequencies), LFXT (32-kHz crystal), and HFXT (high-frequency crystal) oscillators - with RTC_B enabled only when LFXT is active.

Analog subsystem includes ADC12_B with internal reference and sample-and-hold, 16-channel comparator (Comp_E), and voltage reference generator (REF_A). Digital peripherals include five 16-bit timers (TA0–TA3, TB0), CRC16, and capacitive touch I/O on all pins without external components.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureCPUXV2 16-bit RISC, up to 16 MHz clock - enables deterministic real-time control with low code footprint
FRAM Capacity64 KB unified nonvolatile memory - supports simultaneous read/write, eliminates erase cycles, ideal for frequent data logging
RAM Size2 KB SRAM - sufficient for stack, buffers, and real-time variables in ultra-low-power operation
ADC Resolution12-bit ADC12_B with 16 external + 2 internal inputs - delivers precision sensing for metering and environmental monitoring
Low-Power ModesLPM3.5 (RTC active): 0.25 µA typical - enables years of operation on coin-cell batteries with calendar-aware wakeups
Crypto EngineAES-256 coprocessor - accelerates secure firmware updates and encrypted sensor data transmission
PackageVQFN-48 (7 mm × 7 mm) - compact footprint with exposed thermal pad for efficient heat dissipation in space-constrained designs

Pinout & Package

VQFN-48 (RGZ) package with 7 mm × 7 mm body size and exposed thermal pad recommended to be connected to DVSS. Pin count and signal mapping are validated per TI SLAS704G datasheet Section 4.1.

Pin/TerminalCircuit RoleDesign Meaning
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-Multi-function I/ORTC calibration output, ADC channel A0 input, comparator C0 input, and negative reference source - critical for time-stamped sensor acquisition
PJ.4/LFXIN & PJ.5/LFXOUTCrystal oscillator interfaceDedicated 32-kHz crystal connection enabling RTC_B operation - required for calendar mode and LPM3.5 ultra-low-power timing
PJ.6/HFXIN & PJ.7/HFXOUTCrystal oscillator interfaceSupports high-frequency crystal up to 24 MHz for system clock - enables full-speed CPU operation and high-bandwidth communication
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLKMulti-function I/OPrimary UART TX line (UCA0), Timer_B clock source, and ACLK output - central to bootloader, debug, and low-power timing distribution
RST/NMI/SBWTDIOReset/debug interfaceCombined reset, non-maskable interrupt, and Spy-Bi-Wire debug I/O - enables in-system programming and low-pin-count debugging

Key Features

FeatureDesign Value
Ferroelectric RAM (FRAM)64KB unified memory with 125 ns write speed and 10¹⁵ endurance - eliminates flash wear-out and write latency in data-logging applications
Real-Time Clock (RTC_B)Calendar mode with alarm and calibration registers - enables precise time-of-day stamping and scheduled wakeups without external RTC IC
Capacitive Touch I/OAll GPIO pins support touch sensing without external RC networks - reduces BOM cost and PCB area in wearable and HMI designs
eUSCI PeripheralseUSCI_A0/A1 (UART/IrDA/SPI) and eUSCI_B0 (I²C/SPI) - provides dual independent serial interfaces for sensor fusion and host communication
Ultra-Low-Power Operation0.02 µA shutdown (LPM4.5) and 0.25 µA RTC-active (LPM3.5) - extends battery life to multi-year deployments in energy-harvested nodes

Applications

Smart MeteringEnergy-Harvested Sensor Node

Use Scenario: Electricity, gas, or water meter with tamper detection, pulse counting, and wireless reporting.

IC Role / Device Role / Timing Role: Main controller managing metrology ADC sampling, RTC-based billing intervals, and secure data transmission via UART/I²C.

Use Value: 64KB FRAM stores decades of consumption logs; LPM3.5 current (0.25 µA) enables >10-year battery life with periodic RF wakeups.

Use Scenario: Wireless temperature/humidity node powered by solar cell or piezoelectric harvester.

IC Role / Device Role / Timing Role: System-on-chip managing analog sensor reads, energy buffer management, and low-duty-cycle BLE/Wi-SUN transmission.

Use Value: FRAM's instant write capability captures transient sensor events during intermittent power; AES-256 secures telemetry against replay attacks.

Wearable Health MonitorData Logger for Industrial Equipment

Use Scenario: ECG/PPG patch with motion compensation, onboard analytics, and Bluetooth LE connectivity.

IC Role / Device Role / Timing Role: Signal acquisition hub using ADC12_B and Comp_E for analog front-end conditioning, plus capacitive touch for user interface.

Use Value: All-GPIO capacitive touch eliminates dedicated touch controller; 2KB RAM supports real-time filtering algorithms without external memory.

Use Scenario: Vibration, temperature, and pressure monitoring on motors, pumps, or HVAC systems with SD card or USB export.

IC Role / Device Role / Timing Role: Standalone logger capturing timestamped sensor data at configurable intervals using RTC_B calendar and FRAM circular buffer.

Use Value: 10¹⁵ FRAM write cycles ensure >20 years of daily 10,000-sample logging; CRC16 validates integrity of stored datasets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430FR59691IRGZRI²C-capable BSL (P1.6/P1.7); identical FRAM/RAM/peripherals; same RGZ-48 packagePreferred where I²C-based bootloader access is required over UART; no change to power or timing behaviorSelect when field firmware updates must use I²C instead of UART, especially in systems with shared I²C bus infrastructure
MSP430FR5968IRGZR48KB FRAM (vs. 64KB); otherwise identical architecture, peripherals, and packageSuitable for cost-sensitive designs with smaller firmware/data footprint; retains all low-power and security featuresChoose when application firmware and logged data fit within 48KB FRAM, reducing unit cost without sacrificing ultra-low-power performance

Compared with MSP430FR59691IRGZR and MSP430FR5968IRGZR, the MSP430FR5969IRGZR offers maximum FRAM capacity and UART-based BSL - making it optimal for complex, long-duration data logging with serial update flexibility.

Availability

MSP430FR5969IRGZR is available at Aetrix Electronics and suitable for smart metering, energy-harvested sensor nodes, and wearable electronics requiring stable component supply and long-term industrial availability.

Supply support for MSP430FR5969IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The MSP430 ULP FRAM portfolio targets energy-constrained applications such as metering and sensor nodes, combining ferroelectric memory with ultra-low-power architecture to extend battery life while enabling robust data retention.

FAQ

What is the maximum operating frequency of the MSP430FR5969IRGZR?

The MSP430FR5969IRGZR supports a maximum system clock frequency of 16 MHz via its digitally controlled oscillator (DCO) or external HFXT crystal. This allows real-time execution of complex algorithms while maintaining ultra-low-power efficiency across all active and low-power modes. The CPUXV2 core delivers deterministic timing at this rate, and peripheral clocks (e.g., ADC, timers) scale accordingly without requiring additional configuration overhead.

Does the MSP430FR5969IRGZR support hardware-accelerated cryptography?

Yes, the MSP430FR5969IRGZR integrates a dedicated AES-256 security coprocessor that performs encryption and decryption independently of the CPU. This offloads cryptographic operations from the main core, preserving low-power operation during secure firmware updates or encrypted sensor data transmission. The coprocessor supports both 128-bit and 256-bit keys and operates without exposing key material to software-accessible memory.

How many analog input channels does the ADC12_B module support on the MSP430FR5969IRGZR?

The ADC12_B module on the MSP430FR5969IRGZR supports up to 16 external analog input channels (A0–A15) plus 2 internal sources (temperature sensor and reference voltage). Channel selection is fully programmable, and conversions can be triggered by timer, software, or external signals. The module includes integrated sample-and-hold and internal voltage reference, eliminating need for external components in most precision sensing applications.

What crystal oscillator configurations are supported by the MSP430FR5969IRGZR?

The MSP430FR5969IRGZR supports three clock sources: internal DCO (10 factory-trimmed frequencies), low-frequency 32-kHz crystal (LFXT) on PJ.4/PJ.5, and high-frequency crystal (HFXT) on PJ.6/PJ.7. LFXT is mandatory for RTC_B operation and LPM3.5 mode; HFXT enables full-speed CPU operation up to 24 MHz. Both crystals require external load capacitors per TI design guidelines.

Is the MSP430FR5969IRGZR pin-compatible with other devices in the MSP430FR59xx family?

Yes, the MSP430FR5969IRGZR in the RGZ-48 package shares identical pinout with MSP430FR59691IRGZR, MSP430FR5968IRGZR, and MSP430FR5967IRGZR. This enables direct substitution in existing PCB layouts when migrating between variants - for example, upgrading from 48KB to 64KB FRAM or selecting UART vs. I²C BSL functionality without hardware changes.

MSP430FR5969IRGZR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
48-VFQFN Exposed Pad
Series:
MSP430™ FRAM
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FRAM
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430FR5969IRGZR FAQ

1.How can I place an order for MSP430FR5969IRGZR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430FR5969IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430FR5969IRGZR reliable?

The price and inventory of MSP430FR5969IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5969IRGZR is usually 5 days.

3.What payment methods are accepted for MSP430FR5969IRGZR?

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4.How is shipping managed for MSP430FR5969IRGZR?

MSP430FR5969IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430FR5969IRGZR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430FR5969IRGZR?

For technical support, including MSP430FR5969IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5969IRGZR requirements.

6.How does Aetrix verify that MSP430FR5969IRGZR is sourced from the original manufacturer or authorized distributors?

All MSP430FR5969IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5969IRGZR meets industry standards.

7.What is the process for return or replacement of MSP430FR5969IRGZR?

All MSP430FR5969IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5969IRGZR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430FR5969IRGZR part is unused and in its original packaging.

Return procedure for MSP430FR5969IRGZR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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