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Texas Instruments MSP430FR5992IZVWR

Part No.:
MSP430FR5992IZVWR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
87-VFBGA
Datasheet:
AetrixMSP430FR5992IZVWR.pdf
Description:
IC MCU 16BIT 128KB FRAM 87NFBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,564

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Product details

Overview

MSP430FR5992IZVWR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller featuring 128KB + 0.5KB FRAM, 8KB RAM, integrated LEA accelerator, 12-bit ADC with 20 external channels, and dual crystal support (LFXT/HFXT). It operates from 1.8 V to 3.6 V and delivers 350 nA RTC-enabled standby (LPM3.5), targeting battery-powered sensing nodes in grid infrastructure and wearable electronics.

For engineers reviewing the MSP430FR5992IZVWR datasheet, MSP430FR5992IZVWR pinout, MSP430FR5992IZVWR application, or MSP430FR5992IZVWR equivalent, key selection criteria include FRAM endurance (10¹⁵ writes), LEA-accelerated FFT performance, capacitive-touch I/O capability, and NFBGA-87 package compatibility with high-density PCB layouts.

Technical Context

The MSP430FR5992IZVWR implements a CPUXV2 core with 16 registers and integrates a dedicated Low-Energy Accelerator (LEA) subsystem sharing 4KB of RAM - enabling offload of 256-point complex FFTs without CPU intervention. Its clock system combines factory-trimmed DCO, LFXT (32 kHz), and HFXT (up to 24 MHz) for precise timing across active and low-power modes.

Peripherals include six 16-bit timers (TA0–TA4, TB0), four eUSCI_A (UART/IrDA/SPI) and four eUSCI_B (I²C/SPI) modules, AES-256 encryption coprocessor, and 16-channel analog comparator. All I/O pins support capacitive-touch sensing with no external components required.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPUXV2, up to 16 MHz operation - enables deterministic real-time control with minimal power overhead.
Nonvolatile Memory128KB + 0.5KB FRAM - provides fast, low-energy writes (125 ns/word), 10¹⁵ write-cycle endurance, and unified code/data storage.
RAM8KB SRAM, including 4KB shared with LEA - supports concurrent signal processing and firmware execution.
ADC12-bit ADC12_B with 20 external input channels - enables high-resolution sensor acquisition with window comparator and internal reference.
Low-Power ModesLPM3.5 (RTC active): 350 nA; LPM4.5 (shutdown): 45 nA - extends multi-year battery life in always-on monitoring applications.
SecurityAES-256 coprocessor + IP encapsulation - protects firmware and sensitive data against physical and logical attacks.
PackageNFBGA-87 (6 mm × 6 mm) - supports compact, high-I/O-density designs with thermal pad grounding via DVSS3/DGND balls.

Pinout & Package

NFBGA-87 package (6 mm × 6 mm) with 0.5-mm pitch, thermal pad connected to DVSS3/DGND. Ball L5 assigned to COUT signal per TI SLASE54D Rev D.

Pin/TerminalCircuit RoleDesign Meaning
RST/NMI/SBWTDIOReset / Non-maskable interrupt / JTAG debug I/OActive-low reset with programmable NMI trigger; enables Spy-Bi-Wire debugging without dedicated JTAG pins.
P1.x–P8.x, PJ.xConfigurable multifunction I/O portsAll pins support capacitive-touch sensing, edge-selectable wake-from-LPM, and programmable pullup/pulldown - eliminates external RC networks.
LFXT/LFIN/LFOUTLow-frequency crystal interfaceSupports 32.768-kHz crystal for RTC calendar functions with ±20 ppm stability at 25°C.
HFXT/HFIN/HFOUTHigh-frequency crystal interfaceSupports crystals up to 24 MHz for precise system clocking and high-speed peripheral operation.
eUSCI_A0–A3Enhanced UART/IrDA/SPI interfaceFour independent serial ports with automatic baud-rate detection - simplifies interoperability with legacy and proprietary protocols.

Key Features

FeatureDesign Value
FRAM memory technologyEnables over-the-air firmware updates with zero wear-out risk and sub-millisecond write latency - critical for field-deployed IoT endpoints.
Low-Energy Accelerator (LEA)Executes 256-point complex FFT 40× faster than Cortex-M0+, freeing CPU for application logic while reducing total system energy per computation.
Capacitive-touch I/OHardware-accelerated touch sensing on all GPIO pins - eliminates external ICs and calibration routines for buttons, sliders, and proximity detection.
Integrated AES-256 engineOffloads cryptographic operations from CPU, enabling secure boot, encrypted OTA updates, and authenticated sensor data transmission.
Ultra-low-power RTC domainReal-time clock with calendar and alarm functions operating at 350 nA - maintains timekeeping during deep sleep without external RTC IC.

Applications

Smart Grid Sensor NodeIndustrial Predictive Maintenance

Use Scenario: Battery-powered current/voltage monitor installed on distribution transformers for harmonic analysis and fault detection.

IC Role / Device Role / Timing Role: Main controller executing LEA-accelerated FFT on ADC samples, managing RF communication, and maintaining time-stamped event logs in FRAM.

Use Value: 350 nA LPM3.5 operation enables >10-year battery life; FRAM endurance supports daily firmware updates and decades of sensor data logging.

Use Scenario: Vibration and temperature sensor node mounted on motor bearings in factory automation systems.

IC Role / Device Role / Timing Role: Real-time signal processor capturing accelerometer waveforms, performing spectral analysis via LEA, and triggering alerts via UART/I²C.

Use Value: On-chip 12-bit ADC with 20-channel multiplexing reduces external component count; capacitive-touch I/O enables local HMI without added BOM cost.

Wearable Fitness TrackerBuilding Automation Controller

Use Scenario: Compact wrist-worn device measuring heart rate, motion, and ambient light with multi-day battery runtime.

IC Role / Device Role / Timing Role: Central MCU handling optical sensor interfacing, motion algorithm execution (via LEA), BLE co-processor communication, and secure data storage.

Use Value: 45 nA LPM4.5 shutdown minimizes leakage during inactive periods; AES-256 ensures HIPAA-compliant health data encryption.

Use Scenario: Wireless thermostat or occupancy sensor node controlling HVAC and lighting in commercial buildings.

IC Role / Device Role / Timing Role: System-on-chip managing environmental sensors (temp/humidity/light), capacitive-touch UI, and Zigbee/Thread radio interface.

Use Value: Unified FRAM simplifies firmware version management across fleet deployments; RTC calendar enables precise scheduling of energy-saving HVAC cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430FR5994IZVWR256KB + 0.5KB FRAM (vs. 128KB), identical LEA, same NFBGA-87 packageHigher memory headroom for larger firmware or extended data buffering in long-interval telemetrySelect when future firmware growth or local data caching requirements exceed 128KB FRAM capacity.
MSP430FR5962IZVWRNo LEA accelerator; same FRAM/RAM size and peripheral set otherwiseSuitable for applications requiring only basic signal conditioning and control - no FFT/matrix math acceleration neededChoose for cost-sensitive designs where DSP offload is unnecessary and BOM reduction is prioritized.

Compared with MSP430FR5994IZVWR, the MSP430FR5992IZVWR trades half the FRAM for identical LEA performance and power efficiency - ideal for memory-constrained, compute-intensive edge nodes. Against MSP430FR5962IZVWR, it adds LEA at no penalty to power or footprint, enabling real-time analytics without external DSP.

Availability

MSP430FR5992IZVWR is available at Aetrix Electronics and suitable for grid infrastructure monitoring, industrial predictive maintenance, and wearable fitness tracking requiring stable component supply and long-term manufacturability.

Supply support for MSP430FR5992IZVWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions with emphasis on energy efficiency, reliability, and system-level integration.

The MSP430FR599x product line targets ultra-low-power sensing and measurement applications - combining FRAM nonvolatility, LEA-accelerated signal processing, and comprehensive analog peripherals for battery-operated edge intelligence.

FAQ

What is the maximum operating frequency of the MSP430FR5992IZVWR?

The MSP430FR5992IZVWR supports a maximum system clock frequency of 16 MHz using its factory-trimmed DCO or external HFXT crystal. This frequency is fully supported across all active and low-power modes, enabling deterministic real-time response for time-critical sensor fusion and control tasks within the MSP430FR5992IZVWR's ultra-low-power envelope.

Does the MSP430FR5992IZVWR support hardware-accelerated cryptography?

Yes, the MSP430FR5992IZVWR integrates a dedicated AES-256 security coprocessor that performs encryption and decryption independently of the CPU. This enables secure boot, authenticated firmware updates, and end-to-end encrypted sensor data transmission - all while preserving the MSP430FR5992IZVWR's ultra-low-power operation and deterministic latency.

How many capacitive-touch channels does the MSP430FR5992IZVWR support?

The MSP430FR5992IZVWR supports capacitive-touch sensing on all general-purpose I/O pins - totaling 68 pins across ports P1–P8 and PJ. No external components or dedicated touch controller ICs are required, and touch functionality is enabled via firmware configuration of the built-in charge-transfer circuitry within each port module of the MSP430FR5992IZVWR.

What crystal frequencies are compatible with the MSP430FR5992IZVWR's LFXT and HFXT inputs?

The MSP430FR5992IZVWR's LFXT input supports standard 32.768-kHz tuning-fork crystals for RTC operation, while the HFXT input accepts fundamental-mode crystals from 4 MHz to 24 MHz. Both interfaces include programmable drive strength and fault-detection circuitry, ensuring robust oscillation startup and stability across temperature and voltage ranges specified for the MSP430FR5992IZVWR.

Is the MSP430FR5992IZVWR pin-compatible with other devices in the MSP430FR599x family?

Yes - the MSP430FR5992IZVWR in the NFBGA-87 (ZVW) package shares identical pinout, ball mapping, and electrical characteristics with MSP430FR5994IZVWR, MSP430FR5962IZVWR, and MSP430FR5964IZVWR in the same ZVW package. This allows direct substitution in existing PCB layouts when memory or LEA requirements change, without redesign or requalification.

MSP430FR5992IZVWR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
87-VFBGA
Series:
MSP430™ FRAM
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FRAM
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430FR5992IZVWR FAQ

1.How can I place an order for MSP430FR5992IZVWR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430FR5992IZVWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430FR5992IZVWR reliable?

The price and inventory of MSP430FR5992IZVWR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5992IZVWR is usually 5 days.

3.What payment methods are accepted for MSP430FR5992IZVWR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR5992IZVWR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MSP430FR5992IZVWR?

MSP430FR5992IZVWR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430FR5992IZVWR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430FR5992IZVWR?

For technical support, including MSP430FR5992IZVWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5992IZVWR requirements.

6.How does Aetrix verify that MSP430FR5992IZVWR is sourced from the original manufacturer or authorized distributors?

All MSP430FR5992IZVWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5992IZVWR meets industry standards.

7.What is the process for return or replacement of MSP430FR5992IZVWR?

All MSP430FR5992IZVWR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5992IZVWR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430FR5992IZVWR part is unused and in its original packaging.

Return procedure for MSP430FR5992IZVWR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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