Texas Instruments MSP430FR59941IPMR
- Part No.:
- MSP430FR59941IPMR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MSP430FR59941IPMR.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430FR59941IPMR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 256KB FRAM, 8KB RAM, integrated Low-Energy Accelerator (LEA), 12-bit ADC with 20 external channels, and dual eUSCI_A/eUSCI_B serial interfaces. It operates from 1.8 V to 3.6 V and supports real-time clock (RTC) in LPM3.5 mode at 350 nA - deployed in battery-powered grid infrastructure and wearable fitness monitors.
For engineers reviewing the MSP430FR59941IPMR datasheet, MSP430FR59941IPMR pinout, MSP430FR59941IPMR application, or MSP430FR59941IPMR equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LEA-accelerated FFT performance, I²C-based bootloader (BSL), and LQFP-80 package compatibility with industrial PCB layouts.
Technical Context
The MSP430FR59941IPMR implements a CPUXV2 core with 16 registers and a dedicated LEA subsystem sharing 4KB of RAM - enabling parallel signal processing independent of CPU execution. Its clock system integrates DCO, HFXT (up to 16 MHz), and LFXT (32 kHz crystal) with automatic low-power mode transitions.
Peripherals include six 16-bit timers (TA0–TA4, TB0), 32-/16-bit CRC, AES-256 encryption coprocessor, capacitive-touch I/O on all pins, and eUSCI modules supporting UART/IrDA/SPI (eUSCI_A) and I²C/SPI (eUSCI_B). The BSL is configured for I²C interface via P1.6 (BSLSDA) and P1.7 (BSLSCL).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2, up to 16 MHz - enables deterministic real-time control with minimal code footprint |
| Nonvolatile Memory | 256 KB FRAM + 0.5 KB information memory - supports over-the-air firmware updates without erase latency or wear leveling |
| RAM | 8 KB total RAM, including 4 KB shared with LEA - allows concurrent CPU/accelerator data buffering |
| Power Consumption | LPM3.5 (RTC active): 350 nA - extends battery life to years in metering and sensor node applications |
| Analog Peripherals | 12-bit ADC with 20 external inputs, window comparator, internal reference - eliminates external precision references in analog front ends |
| Serial Interfaces | 4 × eUSCI_A (UART/IrDA/SPI), 4 × eUSCI_B (I²C/SPI); BSL uses I²C on P1.6/P1.7 - simplifies field firmware upgrades via standard I²C master |
| Security | AES-256 encryption/decryption coprocessor + IP encapsulation - protects firmware and sensitive data against physical and logical attacks |
Pinout & Package
LQFP-80 package (12 mm × 12 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug input | Active-low reset with NMI capability; enables Spy-Bi-Wire debugging without full JTAG header |
| P1.6 / BSLSDA | I²C data line for hardware bootloader | Direct connection to I²C master for secure, pin-efficient firmware updates without UART interface |
| P1.7 / BSLSCL | I²C clock line for hardware bootloader | Synchronizes BSL communication; requires external pull-ups per I²C specification |
| AVCC1 / AVSS1 | Analog power supply and ground | Independent analog domain decoupling required for ADC/comp accuracy; separate from digital DVCC/DVSS |
| PJ.4 / LFXIN, PJ.5 / LFXOUT | Low-frequency crystal oscillator terminals | Supports 32.768 kHz crystal for RTC operation in LPM3.5 - critical for calendar-aware low-power scheduling |
Key Features
| Feature | Design Value |
|---|---|
| FRAM endurance | 10¹⁵ write cycles - enables logging, parameter storage, and firmware patching in field-deployed devices without degradation |
| LEA subsystem | 40× faster 256-point complex FFT vs. Cortex-M0+ - accelerates sensor fusion and spectral analysis without DSP expertise |
| Capacitive-touch I/O | All GPIO pins support CTSIO without external components - reduces BOM cost and PCB area in HMI designs |
| Ultra-low-power RTC | 350 nA in LPM3.5 with 3.7-pF crystal - delivers precise timekeeping for wake-up scheduling in multi-year battery applications |
| I²C Bootloader (BSL) | Dedicated I²C interface on P1.6/P1.7 - enables secure, factory-programmable firmware recovery and field updates |
Applications
| Smart Electricity Metering | Industrial Sensor Node |
|---|---|
Use Scenario: Tamper-resistant energy measurement with time-of-use billing and remote firmware updates. IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, RTC-driven tariff switching, and secure I²C-based firmware update handling. Use Value: FRAM enables reliable event logging under brownout; LEA accelerates harmonic distortion analysis; AES-256 secures OTA updates. |
Use Scenario: Battery-powered vibration/temperature monitoring in predictive maintenance systems. IC Role / Device Role / Timing Role: Low-duty-cycle sensor aggregator with wake-on-event, ADC sampling, and wireless data prep. Use Value: 45 nA shutdown (LPM4.5) extends 10-year battery life; capacitive-touch I/O repurposed as wake-from-LPM GPIO; FRAM stores calibration offsets nonvolatily. |
| Wearable Fitness Tracker | Building Automation Controller |
Use Scenario: Continuous heart-rate and motion sensing with Bluetooth LE connectivity and multi-day battery life. IC Role / Device Role / Timing Role: Sensor hub managing optical/accelerometer data, real-time activity classification, and BLE packet prep. Use Value: LEA offloads FFT-based HRV analysis from CPU; 350 nA RTC enables accurate sleep-stage tracking; FRAM stores daily activity history without flash wear. |
Use Scenario: Distributed HVAC zone controller with occupancy sensing, temperature regulation, and Modbus RTU communication. IC Role / Device Role / Timing Role: Field-level controller interfacing with thermostats, relays, and RS-485 transceivers via eUSCI_B. Use Value: I²C BSL allows centralized firmware deployment across 100+ nodes; 16-channel comparator monitors multiple sensor thresholds simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5994IPMR | Identical FRAM/RAM/LEA/peripheral set but UART-based BSL (P2.0/P2.1) | Requires UART interface for firmware updates instead of I²C | Select when existing design uses UART for field programming or lacks I²C master resources |
| MSP430FR5964IPMR | Same package and peripherals but no LEA; 256KB FRAM, 8KB RAM, UART BSL | Lacks hardware acceleration for FFT/FIR/matrix math - CPU handles all signal processing | Select when signal processing load is light or software-based acceleration suffices |
Compared with MSP430FR59941IPMR, the MSP430FR5994IPMR offers identical performance but requires UART infrastructure for BSL, while the MSP430FR5964IPMR removes LEA to reduce cost and complexity at the expense of real-time DSP capability - making MSP430FR59941IPMR optimal for I²C-centric, compute-intensive edge nodes.
Availability
MSP430FR59941IPMR is available at Aetrix Electronics and suitable for smart metering, industrial sensor networks, and wearable electronics requiring stable component supply across multi-year production cycles.
Supply support for MSP430FR59941IPMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and system integration.
The MSP430FR599x product line targets ultra-low-power sensing and measurement applications where FRAM persistence, sub-µA RTC operation, and hardware-accelerated signal processing are critical - especially in battery-constrained infrastructure and portable devices.
FAQ
What is the primary differentiator of MSP430FR59941IPMR versus other MSP430FR59xx variants?
The MSP430FR59941IPMR uniquely combines 256KB FRAM, Low-Energy Accelerator (LEA), and I²C-based hardware bootloader (BSL) on P1.6/P1.7. Unlike MSP430FR5994IPMR (UART BSL) or MSP430FR5964IPMR (no LEA), the MSP430FR59941IPMR enables secure, pin-efficient firmware updates and real-time FFT/FIR processing - ideal for compute-intensive, battery-operated edge nodes.
Does MSP430FR59941IPMR support capacitive touch sensing without external components?
Yes. All GPIO pins on MSP430FR59941IPMR support capacitive-touch sensing using the integrated CTSIO module - no external RC networks or dedicated touch controllers are required. This capability is confirmed in the device's functional description and pin attributes table, enabling direct implementation of sliders, wheels, or buttons with minimal BOM impact.
What is the minimum supply voltage for MSP430FR59941IPMR during active operation?
The MSP430FR59941IPMR operates from 1.8 V to 3.6 V. The absolute minimum supply voltage is constrained by SVS (Supply Voltage Supervisor) thresholds - specifically, the SVSLO level sets the lower bound at 1.8 V. Operation below this voltage risks undefined behavior or brownout reset, as verified in Section 8.3 (Recommended Operating Conditions) of the official datasheet.
How does the LEA subsystem in MSP430FR59941IPMR improve signal processing efficiency?
The LEA in MSP430FR59941IPMR executes 256-point complex FFT up to 40× faster than an Arm Cortex-M0+ core while operating independently of the CPU. It shares 4KB RAM with the CPU and supports FIR filtering and matrix multiplication - reducing CPU load, lowering active-mode current, and enabling real-time sensor fusion in ultra-low-power applications.
Which package and pin count does MSP430FR59941IPMR use, and what are its thermal characteristics?
MSP430FR59941IPMR uses an 80-pin LQFP package (PN suffix, 12 mm × 12 mm body, 0.5 mm pitch) with an exposed thermal pad. TI recommends connecting the thermal pad to DVSS for optimal thermal dissipation. The package supports JEDEC-standard reflow profiles and achieves θJA ≈ 46°C/W under standard 2-layer board conditions - validated in Section 12 of the datasheet.
MSP430FR59941IPMR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-LQFP
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 17x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR59941IPMR FAQ
1.How can I place an order for MSP430FR59941IPMR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR59941IPMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR59941IPMR reliable?
The price and inventory of MSP430FR59941IPMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR59941IPMR is usually 5 days.
3.What payment methods are accepted for MSP430FR59941IPMR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR59941IPMR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR59941IPMR?
MSP430FR59941IPMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR59941IPMR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR59941IPMR?
For technical support, including MSP430FR59941IPMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR59941IPMR requirements.
6.How does Aetrix verify that MSP430FR59941IPMR is sourced from the original manufacturer or authorized distributors?
All MSP430FR59941IPMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR59941IPMR meets industry standards.
7.What is the process for return or replacement of MSP430FR59941IPMR?
All MSP430FR59941IPMR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR59941IPMR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR59941IPMR part is unused and in its original packaging.
Return procedure for MSP430FR59941IPMR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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