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Texas Instruments MSP430FR59941IRGZR
- Part No.:
- MSP430FR59941IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR59941IRGZR.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,842
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Product details
Overview
MSP430FR59941IRGZR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller featuring 256KB FRAM, 8KB RAM, integrated Low-Energy Accelerator (LEA), 12-bit ADC with 20 external channels, and dual eUSCI_A/eUSCI_B serial interfaces supporting UART and I²C. It operates from 1.8 V to 3.6 V and targets battery-powered sensing and control applications requiring deterministic signal processing.
For engineers reviewing the MSP430FR59941IRGZR datasheet, MSP430FR59941IRGZR pinout, MSP430FR59941IRGZR application, or MSP430FR59941IRGZR equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LPM3.5 current (350 nA with RTC), LEA-accelerated FFT performance, I²C bootloader support, and VQFN-48 package compatibility with capacitive-touch I/O on all pins.
Technical Context
The MSP430FR59941IRGZR implements a CPUXV2 16-bit RISC core with up to 16 MHz clocking, paired with a dedicated LEA subsystem that executes complex signal processing (e.g., 256-point complex FFT) independently of the CPU using shared 4KB RAM. Its memory architecture unifies code and data in nonvolatile FRAM, enabling atomic writes and seamless OTA updates.
Power management includes five low-power modes (LPM0–LPM4.5), with LPM3.5 sustaining RTC operation at 350 nA using a 3.7-pF crystal, and LPM4.5 delivering 45 nA shutdown current. The clock system integrates DCO, LFXT (32 kHz), and HFXT (up to 24 MHz) sources with programmable dividers and automatic failover.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC, up to 16 MHz - enables deterministic real-time execution with low gate count and minimal power per instruction. |
| Memory | 256 KB FRAM + 8 KB RAM (4 KB shared with LEA) - provides unified nonvolatile storage for firmware/data, eliminating flash erase delays and supporting 10¹⁵ write cycles. |
| ADC | 12-bit SAR ADC with 20 external inputs, window comparator, internal reference - supports high-accuracy sensor acquisition without external components. |
| Low-Power Modes | LPM3.5: 350 nA (RTC active); LPM4.5: 45 nA (full shutdown) - extends battery life in intermittent-sensing applications like metering or wearables. |
| Serial Interfaces | 4× eUSCI_A (UART/IrDA/SPI) + 4× eUSCI_B (I²C/SPI); BSL supports I²C - enables robust multi-sensor connectivity and field-upgradable firmware via standard two-wire bus. |
| Capacitive Touch | All I/O pins support CSD without external components - reduces BOM cost and PCB area for human-interface designs such as smart thermostats or fitness bands. |
| Security | 128/256-bit AES coprocessor + IP encapsulation - protects firmware integrity and enables secure boot and encrypted communication in industrial endpoints. |
Pinout & Package
VQFN-48 (RGZ) package, 7 mm × 7 mm, 0.5 mm pitch, thermal pad connected to DVSS. Pin count: 48 terminals including 40 configurable I/Os, 4 power/ground, 2 crystal, 2 debug (SBW).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / Spy-Bi-Wire data I/O | Single-pin debug interface for programming and real-time debugging; dual-function reset with NMI capability. |
| TEST/SBWTCK | Spy-Bi-Wire test clock | Enables JTAG-like debugging and programming using only two pins, reducing test access overhead. |
| P1.0–P1.7, P2.0–P2.7, P3.0–P3.7, P4.0–P4.7, P5.0–P5.7, P6.0–P6.7, P7.0–P7.7, P8.0–P8.3, PJ.0–PJ.7 | Configurable multifunction I/O ports | 40 GPIOs with capacitive-touch sensing, edge-selectable wake, programmable pullup/pulldown, and peripheral multiplexing (eUSCI, timers, ADC). |
| DVCC1/DVCC2/DVCC3, DVSS1/DVSS2/DVSS3 | Digital supply and ground | Three independent digital power domains enable noise isolation between core, peripherals, and I/O banks. |
| AVCC1, AVSS1–AVSS3 | Analog supply and ground | Dedicated analog power rails minimize coupling noise into ADC and comparator circuits for stable 12-bit conversion. |
| HFXIN/HFXOUT, LFXIN/LFXOUT | High- and low-frequency crystal connections | Supports external 32 kHz watch crystal (RTC) and up to 24 MHz HF crystal for precise timing and high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| Low-Energy Accelerator (LEA) | Offloads FFT/FIR/matrix math from CPU; completes 256-point complex FFT up to 40× faster than Cortex-M0+, freeing CPU for control tasks. |
| FRAM Memory Technology | Eliminates write endurance limits (10¹⁵ cycles) and erase latency; enables logging, parameter storage, and OTA updates with byte-level writes. |
| Integrated RTC with Calendar | Real-time clock with alarm, calendar, and battery-backed operation in LPM3.5 at 350 nA - ideal for time-stamped sensor data collection. |
| Hardware AES-128/256 | Accelerates encryption/decryption for secure firmware updates and authenticated sensor data transmission without CPU overhead. |
| eUSCI_I2C Bootloader (BSL) | Enables field firmware updates over I²C using P1.6 (BSLSDA) and P1.7 (BSLSCL), eliminating need for dedicated programming hardware. |
| Capacitive Touch I/O | Full-port CSD capability with no external components - reduces bill-of-materials and simplifies mechanical integration in consumer HMI designs. |
Applications
| Smart Electricity Metering | Industrial Sensor Node |
|---|---|
Use Scenario: Utility-grade meter collecting voltage/current harmonics, temperature, and tamper events at 1-second intervals with 10-year battery life. IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, managing FRAM-based event logs, and maintaining RTC-synchronized timestamps. Use Value: LPM3.5 current of 350 nA enables decade-long operation on coin-cell; 256KB FRAM stores >1M timestamped samples without wear-out. |
Use Scenario: Wireless node monitoring vibration, temperature, and humidity in factory machinery with edge FFT analysis before transmission. IC Role / Device Role / Timing Role: Signal-processing hub performing real-time 256-point FFT via LEA, then compressing and forwarding results via I²C to wireless MCU. Use Value: LEA delivers 40× FFT speedup vs. CPU-only execution, reducing active time and extending node battery life by >3×. |
| Wearable Fitness Tracker | Building Automation Controller |
Use Scenario: Wrist-worn device acquiring PPG, accelerometer, and ambient light data continuously while detecting motion gestures via capacitive touch. IC Role / Device Role / Timing Role: System-on-chip handling sensor fusion, gesture recognition, and Bluetooth LE interface coordination. Use Value: All-I/O capacitive touch eliminates external RC networks; FRAM enables reliable step-count persistence across resets and OTA updates. |
Use Scenario: HVAC controller interfacing with multiple I²C temperature/humidity sensors, driving relay outputs, and logging occupancy patterns. IC Role / Device Role / Timing Role: Central intelligence unit managing sensor polling, PID control loops, and secure firmware updates via I²C BSL. Use Value: Dual eUSCI_B modules support concurrent I²C buses; AES coprocessor secures remote configuration and prevents unauthorized firmware injection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5994IRGZR | Identical FRAM/RAM/LEA/peripheral set but features UART BSL instead of I²C BSL; uses P2.0/P2.1 for programming. | Preferred where UART debug interface is already available on host system; requires UART-capable programmer instead of I²C master. | Select MSP430FR5994IRGZR if UART-based field updates are preferred; MSP430FR59941IRGZR is optimal when I²C infrastructure exists. |
| MSP430FR59641IRGZR | Lacks LEA subsystem; same 256KB FRAM, 8KB RAM, and I²C BSL; identical VQFN-48 package and pinout. | Suitable for cost-sensitive applications not requiring accelerated DSP - e.g., basic sensor logging without FFT or matrix math. | Choose MSP430FR59641IRGZR when LEA is unnecessary; retains full compatibility for firmware migration except LEA-dependent code paths. |
Compared with MSP430FR5994IRGZR, the MSP430FR59941IRGZR substitutes UART BSL for I²C BSL-enabling simpler two-wire field updates-while retaining identical FRAM, LEA, and low-power performance. Against MSP430FR59641IRGZR, it adds LEA for 40× FFT acceleration at no pinout or power penalty.
Availability
MSP430FR59941IRGZR is available at Aetrix Electronics and suitable for smart metering, industrial sensor nodes, and wearable electronics requiring stable component supply, long-term lifecycle support, and guaranteed FRAM reliability.
Supply support for MSP430FR59941IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of expertise in ultra-low-power design.
The MSP430FR599x product line was engineered to deliver FRAM-based nonvolatility, sub-μA real-time operation, and integrated signal acceleration for battery-constrained IoT endpoints and industrial sensing systems.
FAQ
What distinguishes MSP430FR59941IRGZR from MSP430FR5994IRGZR?
The MSP430FR59941IRGZR replaces the UART-based bootloader (BSL) of the MSP430FR5994IRGZR with an I²C-based BSL, using P1.6 (BSLSDA) and P1.7 (BSLSCL) for programming. All other specifications-including 256KB FRAM, LEA accelerator, 12-bit ADC, and VQFN-48 package-are identical. This makes MSP430FR59941IRGZR ideal for systems with existing I²C infrastructure.
Does MSP430FR59941IRGZR support capacitive touch on all I/O pins?
Yes, MSP430FR59941IRGZR supports capacitive touch sensing on every GPIO pin without external components. Its integrated CapTIvate™-compatible CSD module enables robust button/slider implementation with software-configurable sensitivity and noise immunity-critical for space-constrained wearables and building controls.
What is the lowest active power consumption of MSP430FR59941IRGZR?
MSP430FR59941IRGZR achieves 118 µA/MHz in active mode at 3.0 V. When combined with its 16 MHz max clock and FRAM's zero-latency writes, this enables high-throughput sensor processing while minimizing average current draw-especially valuable in burst-mode acquisition systems.
How does the Low-Energy Accelerator (LEA) in MSP430FR59941IRGZR improve system efficiency?
The LEA in MSP430FR59941IRGZR executes compute-intensive operations-such as 256-point complex FFT-independently of the CPU using dedicated 4KB RAM. This offloading reduces CPU active time by up to 90%, directly lowering total energy per FFT and extending battery life in vibration or audio analytics applications.
Is MSP430FR59941IRGZR pin-compatible with other RGZ-package MSP430FR59xx devices?
Yes, MSP430FR59941IRGZR shares identical VQFN-48 (RGZ) pinout and footprint with MSP430FR5994IRGZR, MSP430FR5992IRGZR, MSP430FR5964IRGZR, and MSP430FR5962IRGZR. This enables hardware reuse across variants-e.g., upgrading from non-LEA to LEA-enabled versions without PCB redesign.
MSP430FR59941IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR59941IRGZR FAQ
1.How can I place an order for MSP430FR59941IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR59941IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR59941IRGZR reliable?
The price and inventory of MSP430FR59941IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR59941IRGZR is usually 5 days.
3.What payment methods are accepted for MSP430FR59941IRGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR59941IRGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR59941IRGZR?
MSP430FR59941IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR59941IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR59941IRGZR?
For technical support, including MSP430FR59941IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR59941IRGZR requirements.
6.How does Aetrix verify that MSP430FR59941IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430FR59941IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR59941IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430FR59941IRGZR?
All MSP430FR59941IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR59941IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR59941IRGZR part is unused and in its original packaging.
Return procedure for MSP430FR59941IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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