Texas Instruments MSP430FR59941IRGZT
- Part No.:
- MSP430FR59941IRGZT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR59941IRGZT.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 48VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:210
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430FR59941IRGZT from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller featuring 256KB FRAM, 8KB RAM, integrated Low-Energy Accelerator (LEA), 12-bit ADC with 20 external channels, and dual eUSCI_A/eUSCI_B serial interfaces. It operates from 1.8 V to 3.6 V and supports real-time clock (RTC) in LPM3.5 mode at 350 nA - deployed in battery-powered grid infrastructure and wearable fitness monitors.
For engineers reviewing the MSP430FR59941IRGZT datasheet, MSP430FR59941IRGZT pinout, MSP430FR59941IRGZT application, or MSP430FR59941IRGZT equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LEA-accelerated FFT performance, I²C bootloader capability, and VQFN-48 package compatibility with space-constrained PCB layouts.
Technical Context
The MSP430FR59941IRGZT implements a CPUXV2 16-bit RISC core with up to 16 MHz operation, paired with a dedicated LEA subsystem that executes complex signal processing (e.g., 256-point complex FFT) independently of the CPU using shared 4KB RAM. Its clock system integrates DCO, LFXT (32 kHz crystal), and HFXT (up to 24 MHz) with programmable dividers.
Peripherals include six 16-bit timers (TA0–TA4, TB0), 32-/16-bit CRC, AES-128/256 encryption coprocessor, and capacitive-touch-capable I/O ports with edge-selectable wake-from-LPM. The device uses a unified memory map where FRAM serves both code and data, enabling seamless over-the-air firmware updates without flash erase delays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC, up to 16 MHz - enables deterministic real-time control with low interrupt latency |
| Nonvolatile Memory | 256 KB FRAM + 0.5 KB information memory - supports 10¹⁵ write cycles and zero-delay writes for logging and firmware updates |
| RAM | 8 KB total, including 4 KB shared with LEA - allows concurrent CPU/LEA operation without memory contention |
| ADC | 12-bit SAR ADC with 20 external inputs, window comparator, and internal reference - suitable for sensor signal acquisition in analog front ends |
| Ultra-Low-Power Modes | LPM3.5 (RTC active): 350 nA; LPM4.5 (shutdown): 45 nA - extends battery life in multi-year IoT deployments |
| Serial Interfaces | 4× eUSCI_A (UART/IrDA/SPI) + 4× eUSCI_B (I²C/SPI); BSL supports I²C - enables robust sensor hub communication and field firmware recovery |
| Security | AES-128/256 coprocessor + IP encapsulation + random number seed - meets basic firmware integrity and data confidentiality requirements |
Pinout & Package
VQFN-48 (RGZ) package, 7 mm × 7 mm, 0.5 mm pitch, thermal pad connected to DVSS. Pin count: 48 terminals, including 40 configurable GPIOs with capacitive touch support, 4 power/ground pairs, and dedicated crystal/oscillator connections (LFXIN/LFXOUT, HFXIN/HFXOUT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug I/O | Active-low reset initiation; NMI input for critical fault handling; bidirectional debug interface for programming and real-time trace |
| P1.0–P1.7, P2.0–P2.7, P3.0–P3.7, P4.0–P4.7, P5.0–P5.7, P6.0–P6.7, P7.0–P7.7, P8.0–P8.3, PJ.0–PJ.3, PJ.4–PJ.7 | Configurable multifunction I/O ports | All pins support capacitive touch sensing without external components; each port supports bit/byte/word access and edge-selectable LPM wake-up |
| AVCC1, AVSS1–AVSS3 | Analog power supply and ground | Separate analog domain for ADC and comparators; requires local decoupling to maintain 12-bit accuracy under dynamic load |
| LFXIN / LFXOUT | Low-frequency crystal oscillator input/output | Drives 32.768 kHz watch crystal for RTC operation in LPM3.5; supports automatic gain control and fail-safe switching to VLO |
| HFXIN / HFXOUT | High-frequency crystal oscillator input/output | Supports external crystals up to 24 MHz for high-speed peripheral operation and precise timing-critical tasks |
| TEST / SBWTCK | Spy-Bi-Wire test clock | Enables single-wire JTAG debugging and programming; required for production programming and in-system firmware updates |
Key Features
| Feature | Design Value |
|---|---|
| Low-Energy Accelerator (LEA) | Dedicated signal-processing engine executing 256-point complex FFT up to 40× faster than CPU alone - eliminates need for external DSP in sensor fusion applications |
| Ferroelectric RAM (FRAM) | 256 KB unified memory with 125 ns write time and 10¹⁵ endurance - enables reliable data logging at high sample rates without wear leveling overhead |
| Capacitive Touch I/O | All 40 GPIOs support CSD (capacitive sensing) with no external RC network - reduces BOM cost and board area in human-interface designs |
| Hardware AES Encryption | 128-/256-bit AES coprocessor with DMA support - accelerates secure boot, encrypted OTA updates, and protected sensor data transmission |
| Real-Time Clock (RTC) | Calendar-mode RTC with alarm and battery-backup capability operating at 350 nA in LPM3.5 - provides accurate timekeeping for scheduling and timestamping in energy-harvesting systems |
Applications
| Smart Grid Sensor Node | Wearable Fitness Tracker |
|---|---|
Use Scenario: Remote current/voltage monitoring unit installed on distribution transformers with wireless backhaul. IC Role / Device Role / Timing Role: Main controller managing ADC sampling, FRAM-based event logging, RTC-scheduled transmissions, and I²C communication with RF module. Use Value: 45 nA shutdown current extends battery life beyond 10 years; FRAM enables burst logging during transient faults without data loss. | Use Scenario: Wrist-worn activity monitor measuring heart rate, motion, and skin temperature continuously. IC Role / Device Role / Timing Role: Central MCU acquiring analog sensor data via 12-bit ADC, performing motion algorithm acceleration via LEA, and managing Bluetooth LE connectivity through UART. Use Value: LEA offloads FFT-based HRV analysis from CPU, reducing active-mode current to 118 µA/MHz and extending charge cycle by 30%. |
| Industrial Wireless Sensor Hub | Building Automation Controller |
Use Scenario: Battery-powered gateway aggregating temperature, humidity, and CO₂ readings from multiple LoRaWAN end nodes. IC Role / Device Role / Timing Role: Host processor running lightweight RTOS, managing I²C sensor interfaces, AES-encrypted payload assembly, and UART-to-LoRa module bridging. Use Value: Integrated AES-256 coprocessor secures sensor payloads before transmission; 350 nA RTC mode enables precise sleep/wake scheduling across 10-year deployments. | Use Scenario: Occupancy-aware HVAC zone controller using PIR and ambient light sensing with scheduled ventilation control. IC Role / Device Role / Timing Role: Real-time controller executing occupancy logic, driving relay outputs, maintaining time-of-day via RTC, and communicating via I²C to display and environmental sensors. Use Value: Capacitive-touch I/O eliminates mechanical buttons; FRAM stores calibration offsets and usage history nonvolatility without backup battery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5994IRGZT | Identical FRAM/RAM/LEA/peripheral set but features UART bootloader instead of I²C BSL; same VQFN-48 package | Preferred where UART-based field updates are standardized; lacks native I²C slave interface for bootloader recovery | Select MSP430FR5994IRGZT if UART is the primary host interface and I²C BSL is not required |
| MSP430FR59641IRGZT | Same VQFN-48 package and 256KB FRAM, but omits LEA; retains identical ADC, timers, and I²C BSL | Suitable for cost-sensitive applications requiring FRAM endurance and I²C BSL but no DSP acceleration | Choose MSP430FR59641IRGZT when LEA is unnecessary and BOM cost reduction is prioritized over signal processing throughput |
Compared with MSP430FR5994IRGZT, the MSP430FR59941IRGZT adds I²C BSL at no package or peripheral cost - enabling secure, low-pin-count firmware recovery in constrained systems; versus MSP430FR59641IRGZT, it delivers 40× FFT acceleration via LEA while retaining identical power and memory specs.
Availability
MSP430FR59941IRGZT is available at Aetrix Electronics and suitable for smart grid sensor nodes, wearable fitness trackers, industrial wireless sensor hubs, and building automation controllers requiring stable component supply and long-term lifecycle assurance.
Supply support for MSP430FR59941IRGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency, reliability, and system-level integration.
The MSP430FR599x product line targets ultra-low-power sensing and measurement applications, combining FRAM nonvolatility with hardware-accelerated signal processing to eliminate trade-offs between memory endurance, power, and computational throughput.
FAQ
What is the maximum operating frequency of the MSP430FR59941IRGZT?
The MSP430FR59941IRGZT supports a maximum CPU clock frequency of 16 MHz using its integrated DCO or external HFXT oscillator. This frequency is fully supported across all operating voltage ranges (1.8 V to 3.6 V) and enables deterministic real-time execution of time-critical tasks such as ADC sampling control and timer-based PWM generation. The MSP430FR59941IRGZT maintains full peripheral functionality-including LEA, ADC, and eUSCI modules-at this speed.
Does the MSP430FR59941IRGZT support capacitive touch sensing on all I/O pins?
Yes, the MSP430FR59941IRGZT supports capacitive touch sensing on all 40 general-purpose I/O pins without requiring external RC components. This capability is implemented via integrated CSD (Capacitive Sigma-Delta) hardware within the port modules, allowing direct electrode connection and software-configurable sensitivity. The MSP430FR59941IRGZT's CSD engine operates concurrently with other peripherals and supports proximity, button, and slider implementations in battery-powered devices.
How does the Low-Energy Accelerator (LEA) in the MSP430FR59941IRGZT improve signal processing performance?
The LEA in the MSP430FR59941IRGZT executes fixed-point DSP kernels-such as 256-point complex FFT, FIR filtering, and matrix multiplication-up to 40× faster than the CPU alone, using dedicated 4KB RAM and parallel arithmetic units. It operates independently of the CPU, freeing the main core for system management. The MSP430FR59941IRGZT's LEA requires no DSP expertise and is supported by TI's free optimized DSP library, making advanced sensor analytics accessible in ultra-low-power designs.
What bootloader interface does the MSP430FR59941IRGZT provide, and how is it configured?
The MSP430FR59941IRGZT features an I²C-based hardware bootloader (BSL) activated via P1.6 (BSLSDA) and P1.7 (BSLSCL). Unlike UART BSL variants, this configuration enables firmware updates over a two-wire interface compatible with existing I²C infrastructure-reducing pin count and simplifying host-side implementation. The MSP430FR59941IRGZT's BSL is factory-programmed and supports encrypted image loading, checksum verification, and memory write protection to ensure update integrity.
What is the standby current consumption of the MSP430FR59941IRGZT in RTC-enabled low-power mode?
In LPM3.5 mode-with the real-time clock (RTC) running from a 32.768 kHz crystal-the MSP430FR59941IRGZT consumes 350 nA typical current. This mode retains RTC calendar functionality, RAM contents, and selected register states while disabling the CPU, MCLK, and most peripherals. The MSP430FR59941IRGZT achieves this ultra-low current via optimized SVS thresholds, gated clock domains, and leakage-reduced process technology-enabling decade-long operation on coin-cell batteries.
MSP430FR59941IRGZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR59941IRGZT FAQ
1.How can I place an order for MSP430FR59941IRGZT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR59941IRGZT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR59941IRGZT reliable?
The price and inventory of MSP430FR59941IRGZT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR59941IRGZT is usually 5 days.
3.What payment methods are accepted for MSP430FR59941IRGZT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR59941IRGZT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR59941IRGZT?
MSP430FR59941IRGZT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR59941IRGZT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR59941IRGZT?
For technical support, including MSP430FR59941IRGZT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR59941IRGZT requirements.
6.How does Aetrix verify that MSP430FR59941IRGZT is sourced from the original manufacturer or authorized distributors?
All MSP430FR59941IRGZT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR59941IRGZT meets industry standards.
7.What is the process for return or replacement of MSP430FR59941IRGZT?
All MSP430FR59941IRGZT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR59941IRGZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR59941IRGZT part is unused and in its original packaging.
Return procedure for MSP430FR59941IRGZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430FR59941IRGZT Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

