Texas Instruments MSP430FR59941IZVWR
- Part No.:
- MSP430FR59941IZVWR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 87-VFBGA
- Datasheet:
-
MSP430FR59941IZVWR.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 87NFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,297
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430FR59941IZVWR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller featuring 256KB FRAM, 8KB RAM, integrated Low-Energy Accelerator (LEA), 12-bit ADC with 20 external channels, and dual eUSCI_A/eUSCI_B peripherals supporting UART/IrDA and I²C. It operates from 1.8 V to 3.6 V and targets battery-powered sensing and real-time signal processing in constrained environments.
For engineers reviewing the MSP430FR59941IZVWR datasheet, MSP430FR59941IZVWR pinout, MSP430FR59941IZVWR application, or MSP430FR59941IZVWR equivalent, key selection criteria include FRAM endurance (10¹⁵ writes), LPM3.5 current (350 nA with RTC), LEA-accelerated FFT performance, I²C bootloader capability, and NFBGA-87 package compatibility with high-density PCB layouts.
Technical Context
The MSP430FR59941IZVWR implements a CPUXV2 16-bit RISC core with up to 16 MHz operation, paired with a dedicated LEA subsystem that executes 256-point complex FFT independently of the CPU-delivering up to 40× speedup versus Cortex-M0+ for sensor data preprocessing. Its memory architecture unifies code and data in nonvolatile FRAM with 125 ns write latency and no erase cycles.
Power management includes five low-power modes (LPM0–LPM4.5), with LPM3.5 sustaining RTC operation via 3.7-pF crystal at 350 nA, and LPM4.5 achieving 45 nA shutdown. Clock sources include DCO (10 factory-trimmed frequencies), LFXT (32 kHz crystal), HFXT (up to 24 MHz), and VLO-enabling precise timing across operating modes without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC, up to 16 MHz - enables deterministic real-time control with minimal instruction cycles per operation. |
| FRAM Capacity | 256 KB program + 0.5 KB information memory - supports over-the-air firmware updates without flash wear-out or erase delays. |
| RAM | 8 KB total, including 4 KB shared with LEA - allows concurrent CPU/accelerator data buffering for streaming sensor analytics. |
| ADC12_B | 12-bit SAR with 20 external inputs, window comparator, internal reference - enables high-accuracy analog monitoring with autonomous threshold triggering. |
| Low-Power Mode LPM3.5 | 350 nA with RTC clocked by 3.7-pF crystal - sustains calendar timekeeping and wake-on-alarm functionality for multi-year battery life. |
| eUSCI Peripherals | 4 × eUSCI_A (UART/IrDA/SPI) + 4 × eUSCI_B (I²C/SPI); BSL supports I²C - simplifies host communication and field firmware recovery without UART pins. |
| LEA Subsystem | Dedicated signal processor executing FFT/FIR/matrix ops; 4 KB RAM shared with CPU - offloads compute-intensive tasks while CPU remains in LPM3. |
Pinout & Package
NFBGA-87 package (6 mm × 6 mm, ball pitch 0.5 mm), optimized for space-constrained industrial and wearable designs. Thermal pad recommended to be connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset and Non-Maskable Interrupt input | Active-low reset with configurable NMI function; requires 10-nF pulldown if unused per TI design guidance. |
| P1.6 / P1.7 | BSLSDA / BSLSCL (I²C Bootloader) | Dedicated I²C interface for firmware loading and recovery - eliminates need for UART-based programming hardware. |
| PJ.4 / PJ.5 | LFXIN / LFXOUT | Connects to 32-kHz crystal for RTC operation in LPM3.5; enables ultra-low-power timekeeping with 350 nA quiescent current. |
| PJ.6 / PJ.7 | HFXIN / HFXOUT | Supports up to 24-MHz high-frequency crystal for active-mode performance or system clock derivation. |
| DVSS1–DVSS3, AGND, DGND | Power Ground Terminals | Multiple isolated ground balls reduce noise coupling between analog (AVSS), digital (DVSS), and I/O domains. |
| AVCC1, DVCC1–DVCC3 | Supply Voltage Inputs | Separate analog and digital supply rails allow independent filtering and voltage regulation for mixed-signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 256 KB unified memory with 10¹⁵ write endurance and 125 ns word-write - eliminates flash erase bottlenecks and enables logging at sensor sampling rates. |
| Low-Energy Accelerator (LEA) | Hardware DSP coprocessor executing 256-pt complex FFT in <100 µs - reduces CPU wake time and extends battery life in vibration or ECG analysis. |
| Capacitive Touch I/O | All GPIO support CTSIO without external components - enables direct integration of touch buttons/sliders in wearables and HMI panels. |
| Security Engine | 128/256-bit AES coprocessor + IP encapsulation - protects firmware and sensitive data against physical and logical attacks in grid or medical devices. |
| Ultra-Low-Power RTC | 350 nA operation with calendar/alarm in LPM3.5 using 3.7-pF crystal - delivers precise timekeeping for metering and scheduling with no external RTC IC. |
Applications
| Smart Electricity Metering | Industrial Predictive Maintenance Sensor |
|---|---|
Use Scenario: Continuous voltage/current sampling and harmonic analysis in ANSI C12.20-compliant meters. IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, managing secure firmware updates via FRAM, and maintaining tamper-proof time stamps with RTC. Use Value: FRAM endurance enables decade-long waveform logging; LEA accelerates FFT-based THD calculation without waking CPU; I²C BSL simplifies field firmware patching. |
Use Scenario: Battery-powered vibration sensor node performing edge FFT on accelerometer data before wireless transmission. IC Role / Device Role / Timing Role: Real-time signal acquisition and preprocessing unit with autonomous wake-on-event and low-duty-cycle RF activation. Use Value: LEA computes 256-pt FFT 40× faster than CPU alone, reducing active time from ~4 ms to <100 µs; LPM3.5 RTC schedules periodic sampling at 350 nA. |
| Wearable Fitness Tracker | Building Automation Occupancy Sensor |
Use Scenario: Optical heart-rate monitoring with ambient light cancellation and motion artifact compensation. IC Role / Device Role / Timing Role: Analog front-end controller handling ADC sequencing, LED timing, capacitive touch UI, and BLE interface coordination. Use Value: All-GPIO capacitive touch eliminates BOM cost; 12-bit ADC with internal reference ensures consistent photodiode measurement; FRAM stores calibration offsets nonvolatility. |
Use Scenario: Passive infrared (PIR) + ultrasonic occupancy detector with adaptive sensitivity and daylight harvesting control. IC Role / Device Role / Timing Role: Multi-sensor fusion hub managing analog comparators, timers for pulse-width analysis, and I²C-connected environmental sensors. Use Value: 16-channel analog comparator enables simultaneous PIR signal windowing and ultrasonic echo detection; LPM4.5 (45 nA) extends battery life to >5 years in ceiling-mounted fixtures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power FRAM MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5994IZVWR | Identical FRAM/RAM/LEA/peripheral set but features UART-based BSL instead of I²C BSL. | Requires UART debug interface for firmware updates; less suitable where I²C is already routed to host MCU or PMIC. | Select when UART infrastructure exists and I²C pins are constrained; verify pin mapping for BSLTX/BSLRX on P2.0/P2.1. |
| MSP430FR59641IZVWR | Same NFBGA-87 package and 256KB FRAM, but lacks LEA subsystem and has only UART BSL. | Cannot accelerate FFT/FIR; limited to simpler signal conditioning or control-only roles without intensive math. | Choose for cost-sensitive applications requiring FRAM endurance and low power but no DSP acceleration - e.g., static sensor logging or relay control. |
Compared with MSP430FR59941IZVWR, the MSP430FR5994IZVWR offers identical processing and memory but trades I²C BSL for UART BSL-reducing flexibility in systems lacking UART routing. The MSP430FR59641IZVWR removes LEA entirely, cutting DSP capability while retaining FRAM benefits for basic sensing.
Availability
MSP430FR59941IZVWR is available at Aetrix Electronics and suitable for smart metering, industrial predictive maintenance, wearable health monitoring, building automation, and grid infrastructure applications requiring stable component supply, long-term manufacturability, and ultra-low-power operation.
Supply support for MSP430FR59941IZVWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency, reliability, and system-level integration.
The MSP430FR599x product line was engineered for ultra-low-power sensing and real-time signal processing in battery-operated and energy-harvesting systems-prioritizing FRAM endurance, sub-µA sleep currents, and hardware-accelerated analytics.
FAQ
What distinguishes MSP430FR59941IZVWR from MSP430FR5994IZVWR?
The MSP430FR59941IZVWR integrates an I²C-based bootloader (BSL), enabling firmware updates over existing I²C buses without dedicated UART lines. In contrast, MSP430FR5994IZVWR uses a UART BSL. Both share identical FRAM (256 KB), RAM (8 KB), LEA accelerator, and NFBGA-87 packaging. Pin functions differ only on P1.6/P1.7 (BSLSDA/BSLSCL vs. general-purpose I/O).
Does MSP430FR59941IZVWR support crystal-less operation?
Yes, MSP430FR59941IZVWR supports crystal-less operation using its internal digitally controlled oscillator (DCO) with 10 factory-trimmed frequencies ranging from ~10 kHz to 16 MHz. However, RTC operation in LPM3.5 requires an external 32-kHz crystal on PJ.4/PJ.5; the DCO cannot substitute for precision timekeeping in ultra-low-power modes.
How does the LEA subsystem in MSP430FR59941IZVWR improve power efficiency?
The LEA subsystem in MSP430FR59941IZVWR executes signal-processing routines like 256-point FFT autonomously while the CPU remains in LPM3. This reduces active-mode CPU time from ~4 ms to under 100 µs per transform, cutting average current consumption significantly. Combined with 350 nA LPM3.5 RTC, it enables multi-year battery life in intermittent-sampling applications.
What is the maximum external clock frequency supported by MSP430FR59941IZVWR?
MSP430FR59941IZVWR supports an external high-frequency crystal (HFXT) up to 24 MHz on PJ.6/PJ.7. This clock can drive the MCLK for full-speed CPU operation or serve as a source for peripheral modules such as timers and eUSCI baud-rate generation, enabling high-throughput serial communication and precise PWM timing.
Can MSP430FR59941IZVWR operate across the full industrial temperature range?
Yes, MSP430FR59941IZVWR is qualified for operation from –40°C to +85°C ambient temperature. Its FRAM memory retains data integrity and write endurance across this range, and all electrical specifications-including LPM3.5 current (350 nA), ADC accuracy, and clock stability-are guaranteed within these limits per TI's SLASE54D production data sheet.
MSP430FR59941IZVWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 87-VFBGA
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 68
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR59941IZVWR FAQ
1.How can I place an order for MSP430FR59941IZVWR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR59941IZVWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR59941IZVWR reliable?
The price and inventory of MSP430FR59941IZVWR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR59941IZVWR is usually 5 days.
3.What payment methods are accepted for MSP430FR59941IZVWR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR59941IZVWR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR59941IZVWR?
MSP430FR59941IZVWR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR59941IZVWR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR59941IZVWR?
For technical support, including MSP430FR59941IZVWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR59941IZVWR requirements.
6.How does Aetrix verify that MSP430FR59941IZVWR is sourced from the original manufacturer or authorized distributors?
All MSP430FR59941IZVWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR59941IZVWR meets industry standards.
7.What is the process for return or replacement of MSP430FR59941IZVWR?
All MSP430FR59941IZVWR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR59941IZVWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR59941IZVWR part is unused and in its original packaging.
Return procedure for MSP430FR59941IZVWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430FR59941IZVWR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

